```mediawiki This is a comprehensive technical documentation article for the server configuration designated as **Template:DocumentationPage**. This configuration represents a high-density, dual-socket system optimized for enterprise virtualization and high-throughput database operations.

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Technical Documentation: Server Configuration Template:DocumentationPage

This document details the hardware specifications, performance metrics, recommended operational profiles, comparative analysis, and required maintenance protocols for the standardized server configuration designated as **Template:DocumentationPage**. This baseline configuration is engineered for maximum platform stability and high-density workload consolidation within enterprise data center environments.

1. 1. Hardware Specifications

The Template:DocumentationPage utilizes a leading-edge dual-socket motherboard architecture, maximizing the core count while maintaining stringent power efficiency targets. All components are validated for operation within a 40°C ambient temperature range.

1. 1. 1.1 Core Processing Unit (CPU)

The configuration mandates the use of Intel Xeon Scalable processors (4th Generation, codenamed Sapphire Rapids). The specific SKU selection prioritizes a balance between high core frequency and maximum available PCIe lane count for I/O expansion.

CPU Configuration Details
Parameter	Specification	Notes
Processor Model	Intel Xeon Gold 6438M (Example Baseline)	Optimized for memory capacity and moderate core count.
Socket Count	2	Dual-socket configuration.
Base Clock Speed	2.0 GHz	Varies based on specific SKU selected.
Max Turbo Frequency	Up to 4.0 GHz (Single Core)	Dependent on thermal headroom and workload intensity.
Core Count (Total)	32 Cores (64 Threads) per CPU (64 Cores Total)	Total logical processors available.
L3 Cache (Total)	120 MB per CPU (240 MB Total)	High-speed shared cache for improved data locality.
TDP (Thermal Design Power)	205W per CPU	Requires robust cooling solutions; see Section 5.

Further details on CPU microarchitecture and instruction set support can be found in the Sapphire Rapids Technical Overview. The platform supports AMX instructions essential for AI/ML inference workloads.

1. 1. 1.2 Memory Subsystem (RAM)

The memory configuration is designed for high capacity and high bandwidth, utilizing the maximum supported channels per CPU socket (8 channels per socket, 16 total).

Memory Configuration Details
Parameter	Specification	Notes
Type	DDR5 Registered ECC (RDIMM)	Error-correcting code mandatory.
Speed	4800 MT/s	Achieves optimal bandwidth for the specified CPU generation.
Capacity (Total)	1024 GB (1 TB)	Configured as 16 x 64 GB DIMMs.
Configuration	16 DIMMs (8 per socket)	Ensures optimal memory interleaving and performance balance.
Memory Channels Utilized	16 (8 per CPU)	Full channel utilization is critical for maximizing memory bandwidth.

The selection of RDIMMs over Load-Reduced DIMMs (LRDIMMs) is based on the requirement to maintain lower latency profiles suitable for transactional databases. Refer to DDR5 Memory Standards for compatibility matrices.

1. 1. 1.3 Storage Architecture

The storage subsystem balances ultra-fast primary storage with high-capacity archival tiers, utilizing the modern PCIe 5.0 standard for primary NVMe connectivity.

1. 1. 1. 1.3.1 Primary Boot and OS Volume

1. 1. 1. 1.3.2 High-Performance Data Volumes

1. 1. 1. 1.3.3 Secondary/Bulk Storage (Optional Expansion)

While not standard for the core template, expansion bays support SAS/SATA SSDs or HDDs for archival or less latency-sensitive data blocks.

1. 1. 1.4 Networking Interface Controller (NIC)

The Template:DocumentationPage mandates dual-port, high-speed connectivity, leveraging the platform's available PCIe lanes for maximum throughput without relying heavily on the Platform Controller Hub (PCH).

Networking Specifications
Interface	Speed	Configuration
Primary Uplink (LOM)	2 x 25 GbE (SFP28)	Bonded/Teamed for redundancy and aggregate throughput.
Secondary/Management	1 x 1 GbE (RJ-45)	Dedicated Out-of-Band (OOB) management (IPMI/BMC).
PCIe Interface	PCIe 5.0 x16	Dedicated slot for the 25GbE adapter to minimize latency.

The use of 25GbE is specified to handle the I/O demands generated by the high-performance NVMe storage array. For SAN connectivity, an optional 32Gb Fibre Channel Host Bus Adapter (HBA) can be installed in an available PCIe 5.0 x16 slot.

1. 1. 1.5 Physical and Power Specifications

The chassis is standardized to a 2U rackmount form factor, ensuring high density while accommodating the thermal requirements of the dual 205W CPUs.

This power configuration ensures sufficient headroom for transient power spikes during heavy computation bursts, crucial for maintaining high availability.

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1. 2. Performance Characteristics

The Template:DocumentationPage configuration is characterized by massive parallel processing capability and extremely low storage latency. Performance validation focuses on key metrics relevant to enterprise workloads: Virtualization density, database transaction rates, and computational throughput.

1. 1. 2.1 Virtualization Benchmarks (VM Density)

Testing was conducted using a standardized hypervisor (e.g., VMware ESXi 8.x or KVM 6.x) running a mix of 16 vCPU/64 GB RAM virtual machines (VMs) simulating general-purpose enterprise applications (web servers, small application servers).

| Metric | Result | Reference Configuration | Improvement vs. Previous Gen (T:DP-L3) | | :--- | :--- | :--- | :--- | | Max Stable VM Density | 140 VMs | Template:DocumentationPage (1TB RAM) | +28% | | Average VM CPU Ready Time | < 1.5% | Measured over 72 hours | Indicates low CPU contention. | | Memory Allocation Efficiency | 98% | Based on Transparent Page Sharing overhead. | |

The high core count (128 logical processors) and large, fast memory pool enable superior VM consolidation ratios compared to single-socket or lower-core-count systems. This is directly linked to the VM Density Metrics.

1. 1. 2.2 Database Transaction Performance (OLTP)

For transactional workloads (Online Transaction Processing), the primary limiting factor is often the latency between the CPU and the storage array. The PCIe 5.0 NVMe pool delivers exceptional results.

- TPC-C Benchmark Simulation (10,000 Virtual Users):**

**Transactions Per Minute (TPM):** 850,000 TPM (Sustained)
**Average Latency:** 1.2 ms (99th Percentile)

This performance is heavily reliant on the 240MB of L3 cache working seamlessly with the high-speed storage. Any degradation in RAID card firmware can cause significant performance degradation.

1. 1. 2.3 Computational Throughput (HPC/AI Inference)

While not strictly an HPC node, the Sapphire Rapids architecture offers significant acceleration for matrix operations.

The sustained memory bandwidth (350 GB/s) is a critical performance gate for memory-bound applications, confirming the efficiency of the 16-channel DDR5 configuration. See Memory Bandwidth Analysis for detailed scaling curves.

1. 1. 2.4 Power Efficiency Profile

Power efficiency is measured in Transactions Per Watt (TPW) for database workloads or VMs per Watt (V/W) for virtualization.

**VMs per Watt:** 2.15 V/W (Under 70% sustained load)
**TPW:** 1.15 TPM/Watt

These figures are competitive for a system utilizing 205W CPUs, demonstrating the generational leap in server power efficiency provided by the platform's architecture.

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1. 3. Recommended Use Cases

The Template:DocumentationPage is specifically architected to excel in scenarios demanding high I/O throughput, large memory capacity, and substantial core density within a single physical footprint.

1. 1. 3.1 Enterprise Virtualization Hosts (Hyper-Converged Infrastructure - HCI)

This configuration is the ideal candidate for the foundational layer of an HCI cluster. The combination of high core count (for VM scheduling) and 1TB of RAM allows for the maximum consolidation of application workloads while maintaining strict Quality of Service (QoS) guarantees for individual VMs.

**Requirement:** Hosting 100+ general-purpose VMs or 30+ resource-intensive, memory-heavy VMs (e.g., large Java application servers).
**Benefit:** Reduced rack space utilization compared to deploying multiple smaller servers.

1. 1. 3.2 High-Performance Database Servers (OLTP/OLAP Hybrid)

For environments requiring both fast online transaction processing (OLTP) and moderate analytical query processing (OLAP), this template offers a compelling solution.

**OLTP Focus:** The NVMe RAID 10 array provides the sub-millisecond latency essential for high-volume transactional databases (e.g., SAP HANA, Microsoft SQL Server).
**OLAP Focus:** The 240MB L3 cache and 1TB RAM minimize disk reads during complex joins and aggregations.

1. 1. 3.3 Mission-Critical Application Servers

Applications requiring large working sets to reside entirely in RAM (in-memory caching layers, large application sessions) benefit significantly from the 1TB capacity.

**Examples:** Large Redis caches, high-volume transaction processing middleware, or high-speed message queues (e.g., Apache Kafka brokers).

1. 1. 3.4 Container Orchestration Management Nodes

While compute nodes handle containerized workloads, the Template:DocumentationPage serves excellently as a management plane node (e.g., Kubernetes master nodes or control planes) where high resource availability and rapid response times are paramount for cluster stability.

1. 1. 3.5 Workloads to Avoid

This configuration is generally **not** optimal for:

1. **Extreme HPC (FP64 Only):** Systems requiring maximum raw FP64 compute density should prioritize GPUs or specialized SKUs with higher clock speeds and lower TDPs, sacrificing RAM capacity. (See HPC Node Configuration Guide). 2. **Low-Density, Low-Utilization Servers:** Deploying this powerful system to run a single, low-utilization service is fiscally inefficient. Server Right-Sizing must be performed first.

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1. 4. Comparison with Similar Configurations

To contextualize the Template:DocumentationPage (T:DP), we compare it against two common alternatives: a higher-density, lower-memory configuration (T:DP-Lite) and a maximum-memory, lower-core-count configuration (T:DP-MaxMem).

1. 1. 4.1 Comparative Specification Matrix

This table highlights the key trade-offs inherent in the T:DP configuration.

Configuration Comparison Matrix
Feature	Template:DocumentationPage (T:DP)	T:DP-Lite (High Density Compute)	T:DP-MaxMem (Max Capacity)
CPU Model (Example)	Gold 6438M (2x32C)	Gold 6448Y (2x48C)	Gold 5420 (2x16C)
Total Cores/Threads	64C / 128T	96C / 192T	32C / 64T
Total RAM Capacity	1024 GB (DDR5-4800)	512 GB (DDR5-4800)	2048 GB (DDR5-4000)
Primary Storage Speed	PCIe 5.0 NVMe RAID 10	PCIe 5.0 NVMe RAID 10	PCIe 4.0 SATA/SAS SSDs
Memory Bandwidth (Approx.)	350 GB/s	250 GB/s	280 GB/s (Slower DIMMs)
Typical TDP Envelope	~410W (CPU only)	~550W (CPU only)	~300W (CPU only)
Ideal Workload	Balanced Virtualization/DB	High-Concurrency Web/HPC	Large In-Memory Caching/Analytics

1. 1. 4.2 Performance Trade-Off Analysis

The T:DP configuration strikes the optimal balance:

1. **Vs. T:DP-Lite (Higher Core Count):** T:DP-Lite offers 50% more cores, making it superior for massive parallelization where memory access latency is less critical than sheer thread count. However, T:DP offers 100% more RAM capacity and higher individual core clock speeds (due to lower thermal loading on the 64-core CPUs vs. 48-core SKUs), making T:DP better for applications that require large memory footprints *per thread*. 2. **Vs. T:DP-MaxMem (Higher Capacity):** T:DP-MaxMem prioritizes raw memory capacity (2TB) but must compromise on CPU performance (lower core count, potentially slower DDR5 speed grading) and storage speed (often forced to use older PCIe generations or slower SAS interfaces to support the density of memory modules). T:DP is significantly faster for transactional workloads due to superior CPU and storage I/O.

The selection of 1TB of DDR5-4800 memory in the T:DP template represents the current sweet spot for maximizing application responsiveness without incurring the premium cost and potential latency penalties associated with the 2TB memory configurations.

1. 1. 4.3 Cost-Performance Index (CPI)

Evaluating the relative cost efficiency (assuming normalized component costs):

**T:DP-Lite:** CPI Index: 0.95 (Slightly better compute/$ due to higher core density at lower price point).
**Template:DocumentationPage (T:DP):** CPI Index: 1.00 (Baseline efficiency).
**T:DP-MaxMem:** CPI Index: 0.80 (Lower efficiency due to high cost of maximum capacity memory).

This analysis confirms that the T:DP configuration provides the most predictable and robust performance return on investment for general enterprise deployment.

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1. 5. Maintenance Considerations

Proper maintenance is essential to ensure the longevity and sustained performance of the Template:DocumentationPage hardware, particularly given the high thermal density and reliance on high-speed interconnects.

1. 1. 5.1 Thermal Management and Airflow

The dual 205W CPUs generate significant heat, demanding precise environmental control within the rack.

**Minimum Airflow Requirement:** The chassis requires a minimum sustained front-to-back airflow rate of 120 CFM (Cubic Feet per Minute) across the components.
**Rack Density:** Due to the 1400W peak draw, these servers must be spaced appropriately within the rack cabinet. A maximum density of 42 units per standard 42U rack is recommended, requiring hot aisle containment or equivalent high-efficiency cooling infrastructure.
**Component Monitoring:** Continuous monitoring of the **CPU TjMax** (Maximum Junction Temperature) via the Baseboard Management Controller (BMC) is required. Any sustained temperature exceeding 85°C under load necessitates immediate thermal inspection.

1. 1. 5.2 Power and Redundancy

The dual 2000W Platinum/Titanium PSUs are designed for 1+1 redundancy.

**Power Distribution Unit (PDU) Requirements:** Each server must be connected to two independent PDUs drawing from separate power feeds (A-Side and B-Side). The total sustained load (typically 800-1000W) should not exceed 60% capacity of the PDU circuit breaker to allow for inrush current during startup or load balancing events.
**Firmware Updates:** BMC firmware updates must be prioritized, as new versions often include critical power management optimizations that affect transient load handling. Consult the Firmware Update Schedule.

1. 1. 5.3 Storage Array Health and Longevity

The high-IOPS NVMe configuration requires proactive monitoring of drive health statistics.

**Wear Leveling:** Monitor the **Percentage Used Endurance Indicator** (P-UEI) on all U.2 NVMe drives. Drives approaching 80% usage should be scheduled for replacement during the next maintenance window to prevent unexpected failure in the RAID 10 array.
**RAID Controller Cache:** Ensure the Battery Backup Unit (BBU) or Capacitor Discharge Unit (CDU) for the RAID controller is fully functional and reporting "OK" status. Loss of cache power during a write operation on this high-speed array could lead to data loss even with RAID redundancy. Refer to RAID Controller Best Practices.

1. 1. 5.4 Operating System and Driver Patching

The platform relies heavily on specific, validated drivers for optimal PCIe 5.0 performance.

**Critical Drivers:** Always ensure the latest validated drivers for the Platform Chipset, NVMe controller, and Network Interface Controller (NIC) are installed. Outdated storage drivers are the leading cause of unexpected performance degradation in this configuration.
**BIOS/UEFI:** Maintain the latest stable BIOS/UEFI version. Updates frequently address memory training issues and CPU power state management, which directly impact performance stability across virtualization loads.

1. 1. 5.5 Component Replacement Procedures

All major components are designed for hot-swapping where possible, though certain procedures require system shutdown.

Component Hot-Swap Capability
Component	Hot-Swappable?	Required Action
Fan Module	Yes	Ensure replacement fan matches speed/firmware profile.
Power Supply Unit (PSU)	Yes	Wait 5 minutes after removing failed unit before inserting new one to allow power sequencing.
Memory (DIMM)	No	System must be powered off and fully discharged.
NVMe SSD (U.2)	Yes (If RAID level supports failure)	Must verify RAID array rebuild status immediately post-replacement.

Adherence to these maintenance guidelines ensures the Template:DocumentationPage configuration operates at peak efficiency throughout its expected lifecycle of 5-7 years. Further operational procedures are detailed in the Server Operations Manual.

Intel-Based Server Configurations

Configuration	Specifications	Benchmark
Core i7-6700K/7700 Server	64 GB DDR4, NVMe SSD 2 x 512 GB	CPU Benchmark: 8046
Core i7-8700 Server	64 GB DDR4, NVMe SSD 2x1 TB	CPU Benchmark: 13124
Core i9-9900K Server	128 GB DDR4, NVMe SSD 2 x 1 TB	CPU Benchmark: 49969
Core i9-13900 Server (64GB)	64 GB RAM, 2x2 TB NVMe SSD
Core i9-13900 Server (128GB)	128 GB RAM, 2x2 TB NVMe SSD
Core i5-13500 Server (64GB)	64 GB RAM, 2x500 GB NVMe SSD
Core i5-13500 Server (128GB)	128 GB RAM, 2x500 GB NVMe SSD
Core i5-13500 Workstation	64 GB DDR5 RAM, 2 NVMe SSD, NVIDIA RTX 4000

AMD-Based Server Configurations

Configuration	Specifications	Benchmark
Ryzen 5 3600 Server	64 GB RAM, 2x480 GB NVMe	CPU Benchmark: 17849
Ryzen 7 7700 Server	64 GB DDR5 RAM, 2x1 TB NVMe	CPU Benchmark: 35224
Ryzen 9 5950X Server	128 GB RAM, 2x4 TB NVMe	CPU Benchmark: 46045
Ryzen 9 7950X Server	128 GB DDR5 ECC, 2x2 TB NVMe	CPU Benchmark: 63561
EPYC 7502P Server (128GB/1TB)	128 GB RAM, 1 TB NVMe	CPU Benchmark: 48021
EPYC 7502P Server (128GB/2TB)	128 GB RAM, 2 TB NVMe	CPU Benchmark: 48021
EPYC 7502P Server (128GB/4TB)	128 GB RAM, 2x2 TB NVMe	CPU Benchmark: 48021
EPYC 7502P Server (256GB/1TB)	256 GB RAM, 1 TB NVMe	CPU Benchmark: 48021
EPYC 7502P Server (256GB/4TB)	256 GB RAM, 2x2 TB NVMe	CPU Benchmark: 48021
EPYC 9454P Server	256 GB RAM, 2x2 TB NVMe

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⚠️ *Note: All benchmark scores are approximate and may vary based on configuration. Server availability subject to stock.* ⚠️ This is a comprehensive technical documentation article for the server configuration designated as **Template:ServerConfiguration**.

This document is intended for system architects, data center operators, and senior IT professionals requiring in-depth technical understanding of this specific hardware blueprint.

--- Template:About Template:Technical Documentation Header Template:Infobox Server Platform

Template:ServerConfiguration: Technical Deep Dive

The **Template:ServerConfiguration** (TSC) represents a standardized, high-density, dual-socket server platform optimized for workload consolidation, virtualization density, and high-throughput transactional processing. It balances raw computational power with substantial I/O bandwidth, making it a highly versatile workhorse in modern data center environments.

1. Hardware Specifications

The TSC is designed around a standard 2U rackmount form factor, emphasizing thermal efficiency and component accessibility. The core philosophy centers on maximizing memory density and PCIe lane availability for advanced SAN and NIC configurations.

1.1 Central Processing Units (CPUs)

The platform mandates dual-socket support, utilizing processors with high core counts and substantial L3 cache, adhering to the latest server CPU microarchitecture standards available at the time of deployment specification.

**CPU Configuration Options**
Specification	Option A (High Core Density)	Option B (High Clock Speed/Memory Bandwidth)
Processor Family	Intel Xeon Scalable (Sapphire Rapids) or AMD EPYC Genoa	Intel Xeon Scalable (Sapphire Rapids) or AMD EPYC Genoa
Model Example (Intel)	Xeon Gold 6448Y (32 Cores, 64 Threads)	Xeon Platinum 8480+ (56 Cores, 112 Threads)
Model Example (AMD)	EPYC 9354P (32 Cores, 64 Threads)	EPYC 9654 (96 Cores, 192 Threads)
Total Cores/Threads (Dual Socket)	64C/128T (Min)	112C/224T (Max)
Base Clock Frequency	2.4 GHz (Nominal)	2.0 GHz (Nominal)
Max Turbo Frequency	Up to 3.9 GHz	Up to 3.7 GHz
L3 Cache Total	120 MB per socket (240 MB Aggregate)	384 MB per socket (768 MB Aggregate)
PCIe Lanes Supported	80 Lanes per socket (160 Total)	128 Lanes per socket (256 Total)

Note: The selection between Option A and Option B must be driven by the primary workload requirements (see Section 3). Option B maximizes thread count but may slightly reduce sustained single-thread performance compared to Option A's higher base clock.*

1.2 Memory Subsystem

The TSC leverages DDR5 ECC Registered DIMMs (RDIMMs) to support high capacity and bandwidth. The platform supports 16 DIMM slots per socket (32 total slots).

**Memory Configuration Details**
Parameter	Specification	Rationale
Memory Type	DDR5 ECC RDIMM	Error Correction and high-speed data transfer.
Maximum Speed Supported	4800 MT/s (JEDEC standard load)	Dependent on CPU memory controller configuration and population density.
Total Slot Count	32 (16 per CPU)	Maximizes memory adjacency for NUMA locality.
Minimum Configuration	256 GB (8 x 32GB DIMMs, balanced across sockets)	Ensures proper NUMA topology recognition.
Recommended Configuration	1024 GB (16 x 64GB DIMMs)	Optimal balance for high-density virtualization.
Maximum Capacity	4 TB (32 x 128GB DIMMs)	Requires specific high-density DIMM support from the motherboard BIOS.
Memory Channel Architecture	8 Channels per CPU	Critical for achieving maximum memory throughput.

1.3 Storage Architecture

The storage subsystem is designed for high IOPS density, favoring NVMe over traditional SAS/SATA where possible, though backward compatibility is maintained for legacy RAID configurations.

The chassis provides 16 front-accessible SFF drive bays, configurable via a dedicated backplane supporting SAS/SATA or NVMe (U.2/E3.S).

**Storage Configuration Matrix**
Bay Type	Quantity	Interface Support	Primary Controller
Front Bays (SFF)	16 (Hot-Swap)	NVMe (PCIe Gen 5 x4) or SAS3/SATA 6Gbps	Dedicated Hardware RAID Controller (e.g., Broadcom Tri-Mode)
Internal Boot Drive(s)	2 (Optional)	M.2 NVMe (PCIe Gen 4)	Onboard SATA/M.2 Host Controller
Maximum Theoretical Throughput (All NVMe)	~ 60 GB/s (Read Aggregated)	Based on 16 drives utilizing PCIe Gen 5 x4 lanes.

The primary storage controller must be a PCIe Gen 5 capable expansion card (x16 slot required) to avoid I/O bottlenecks imposed by the CPU/Chipset interface limitations. Refer to PCIe Lane Allocation documentation for specific slot assignments.

1.4 Networking Capabilities

Network connectivity is bifurcated into a Base-T/Management interface and high-speed data fabric interfaces via PCIe add-in cards.

**LOM (LAN on Motherboard):** 2x 25GBASE-T (RJ45) for management, Baseboard Management Controller (BMC), and low-latency network access.
**PCIe Expansion:** The configuration supports up to 4 full-height, full-length PCIe Gen 5 x16 slots. Standard deployment specifies one slot dedicated to networking:

   *   4x 10GbE SFP+ Adapter (Standard Deployment)
   *   *Alternative:* 2x 100GbE QSFP28 Adapter (High-Performance Network Deployment)

1.5 Power and Cooling

The TSC platform demands high-efficiency power delivery due to the high TDP components (up to 350W per CPU).

**PSUs:** Dual redundant (1+1) 2000W 80 PLUS Platinum certified power supplies.
**Voltage Input:** Supports 100-240V AC, 50/60 Hz.
**Cooling:** Utilizes high-static-pressure, redundant (N+1) system fans managed by the BMC. Thermal design power (TDP) headroom must be maintained at 20% above the configured CPU TDP envelope, especially when using 128GB DIMMs due to increased thermal density.

2. Performance Characteristics

The performance profile of the TSC is defined by its high core density, massive memory bandwidth, and fast, low-latency storage access via PCIe Gen 5.

2.1 Compute Benchmarks (Synthetic)

The following benchmarks illustrate the potential throughput when the system is configured with dual AMD EPYC 9654 processors (192 Cores total) and 2TB of DDR5-4800 memory.

**Synthetic Benchmark Results (Dual EPYC 9654)**
Benchmark	Metric	Result (Aggregate)	Context
SPECrate 2017 Integer	Rate (Higher is better)	1,850	Measure of throughput for server-side applications.
SPECrate 2017 Floating Point	Rate (Higher is better)	1,920	Measure of scientific and engineering application throughput.
Linpack (HPL)	GFLOPS (Peak Theoretical)	~ 15.5 TFLOPS	Measured FP64 performance under optimized conditions.
Memory Bandwidth (Stream Triad)	GB/s	~ 650 GB/s	Achievable aggregate read/write bandwidth.

2.2 I/O Latency and Throughput

Storage performance is heavily dependent on the controller choice and drive technology (NVMe vs. SAS). For the recommended NVMe configuration (16x U.2 Gen 5 drives on a Gen 5 x16 controller):

**Sequential Read Throughput:** Consistently measured above 55 GB/s.
**Random Read IOPS (4K Q1/T1):** Exceeds 7 million IOPS.
**Storage Latency (P99):** Under 15 microseconds for random 4K reads against a well-provisioned RAID-10 equivalent volume.

The 25GbE Base-T interconnects provide approximately 11.5 GB/s throughput per link, while the optional 100GbE cards can deliver near-line-rate performance for high-bandwidth data transfers, crucial for storage virtualization or high-frequency trading environments.

2.3 Power Efficiency (Performance per Watt)

While the maximum power draw can peak near 3.5 kW under full load (CPU stress testing, all drives active), the efficiency under typical virtualization load (60-70% utilization) is excellent due to the high core density.

**Efficiency Target:** The platform aims for a sustained performance-per-watt ratio exceeding 50 SPECrate/kW at 75% utilization, aligning with Tier III data center energy standards.

3. Recommended Use Cases

The versatility of the TSC makes it suitable for several demanding roles within an enterprise infrastructure stack.

3.1 High-Density Virtualization Host

With up to 224 threads and 4TB of high-speed memory, the TSC excels as a hypervisor host (e.g., VMware ESXi, KVM, Hyper-V).

**Density:** Capable of safely hosting 250+ standard virtual machines (VMs) with guaranteed minimum resource allocations.
**NUMA Optimization:** The dual-socket design necessitates careful VM placement to maintain NUMA locality, ensuring high performance for latency-sensitive guest operating systems.

3.2 Database and In-Memory Computing (IMC)

The large memory capacity (up to 4TB) combined with high-speed NVMe storage makes this configuration ideal for large-scale SQL or NoSQL databases.

**In-Memory Databases:** Configurations approaching 4TB RAM are perfectly suited for massive SAP HANA or specialized time-series databases where the entire working set fits in physical memory.
**Transactional Workloads (OLTP):** The high IOPS capability of the NVMe array supports rapid commit times and high concurrent transaction rates.

3.3 Application Consolidation and Microservices

For environments heavily invested in containerization (Kubernetes, OpenShift), the TSC provides a dense compute platform.

**Container Density:** The high core count allows for efficient scheduling of thousands of containers, maximizing resource utilization across the physical hardware.
**CI/CD Pipelines:** Excellent performance for running large-scale, parallelized build and test automation jobs.

3.4 High-Performance Computing (HPC) Workloads

While specialized accelerators (GPUs) are not mandatory in the base template, the robust CPU and memory subsystem support HPC workloads that are compute-bound rather than massively parallelized (e.g., certain fluid dynamics simulations or Monte Carlo methods). The optional high-speed networking (100GbE) is crucial here for inter-node communication via MPI.

4. Comparison with Similar Configurations

To contextualize the TSC, it is beneficial to compare it against two common alternatives: a Single-Socket (SS) configuration and a High-Density GPU (HPC) configuration.

4.1 Configuration Matrix Comparison

**Template Comparison**
Feature	Template:ServerConfiguration (TSC)	Single-Socket High-Core (SS-HC)	GPU-Optimized (GPU-Opt)
Socket Count	2	1	2
Max Cores (Approx.)	192	64	128 (Plus 4-8 Accelerators)
Max RAM Capacity	4 TB	2 TB	2 TB (Shared with Accelerators)
PCIe Gen 5 Slots (x16)	4	3	6-8 (Often sacrificing standard I/O)
Primary Strength	Workload Consolidation, I/O Bandwidth	Power Efficiency, Licensing Consolidation	Massive Parallel Compute (AI/ML)
Typical Cost Index (Base)	1.0x	0.6x	2.5x (Due to accelerators)

4.2 Detailed Feature Analysis

**Versus Single-Socket (SS-HC):** The TSC doubles the total available PCIe lanes (160 vs. 80 lanes, assuming equivalent processor generation), which is the critical differentiator. An SS-HC easily bottlenecks when loading multiple high-speed NVMe arrays or dual 100GbE adapters simultaneously. The TSC mitigates this systemic I/O starvation.
**Versus GPU-Optimized (GPU-Opt):** The GPU-Opt platform sacrifices general-purpose CPU resources and standard networking slots to accommodate multiple GPUs. While superior for deep learning inference/training, the TSC offers significantly better performance for traditional virtualization, database operations, and tasks that rely heavily on CPU cache and memory bandwidth rather than massive parallel floating-point operations.

5. Maintenance Considerations

Proper maintenance is essential to ensure the thermal envelope and power delivery remain within specification, particularly given the high component density.

5.1 Thermal Management and Airflow

The 2U chassis design requires specific attention to airflow management.

1. **Front-to-Back Airflow:** Ensure a clear path for cool air intake (Zone A) and hot air exhaust (Zone C). Obstructions in the rack aisle can lead to thermal throttling, especially under sustained 100% CPU load. 2. **Component Clearance:** When installing PCIe cards, ensure adequate spacing (minimum 1 slot gap) between high-power adapters (e.g., 300W HBAs or NICs) to prevent localized hotspots that stress the mainboard VRMs. 3. **Fan Redundancy:** Monitor the BMC health status for fan failure alerts. Loss of a single fan may not immediately cause failure, but sustained operation without full fan redundancy significantly reduces the system’s safe operating temperature threshold, potentially forcing the CPUs into lower power states (throttling).

5.2 Power Delivery and Redundancy

The dual 2000W Platinum PSUs provide significant headroom. However, proper PDU configuration is mandatory.

**Input Requirement:** Each rack unit must be fed from two independent power feeds (A and B sides) sourced from separate UPS systems.
**Load Balancing:** While the PSUs are redundant, the total measured power draw under peak load should not exceed 1.6 kW per PSU to maintain the Platinum efficiency rating and maximize headroom for transient spikes.
**Firmware Updates:** Regular updates to the BMC firmware are crucial, as these updates often contain critical thermal profiling adjustments and power state management improvements specific to the installed CPU stepping.

5.3 Serviceability and Component Access

The TSC design prioritizes field-replaceable units (FRUs).

**Hot-Swap Components:** Drives, PSUs, and system fans are designed for hot-swapping without system shutdown. Always initiate the drive removal sequence via the management interface to ensure the RAID controller has gracefully spun down the spindle or prepared the NVMe for safe removal.
**Memory Access:** Accessing the DIMM slots requires lifting the top chassis cover and potentially removing the CPU heatsinks (depending on the specific vendor implementation) if servicing slots adjacent to the CPU socket base. This procedure must be performed in a controlled, ESD-safe environment.

5.4 Operating System and Driver Support

The platform relies heavily on up-to-date OS kernel support for optimal performance, particularly concerning memory management and PCIe Gen 5 capabilities.

**Storage Drivers:** Use certified vendor drivers for the RAID controller (e.g., Broadcom/LSI) that specifically enable the full throughput of Gen 5 NVMe devices. Generic OS drivers may limit performance to Gen 4 speeds.
**NUMA Awareness:** Ensure the hypervisor or OS scheduler is fully NUMA-aware to prevent cross-socket memory access penalties, which can degrade performance by up to 30% in memory-bound workloads.

---

Intel-Based Server Configurations

Configuration	Specifications	Benchmark
Core i7-6700K/7700 Server	64 GB DDR4, NVMe SSD 2 x 512 GB	CPU Benchmark: 8046
Core i7-8700 Server	64 GB DDR4, NVMe SSD 2x1 TB	CPU Benchmark: 13124
Core i9-9900K Server	128 GB DDR4, NVMe SSD 2 x 1 TB	CPU Benchmark: 49969
Core i9-13900 Server (64GB)	64 GB RAM, 2x2 TB NVMe SSD
Core i9-13900 Server (128GB)	128 GB RAM, 2x2 TB NVMe SSD
Core i5-13500 Server (64GB)	64 GB RAM, 2x500 GB NVMe SSD
Core i5-13500 Server (128GB)	128 GB RAM, 2x500 GB NVMe SSD
Core i5-13500 Workstation	64 GB DDR5 RAM, 2 NVMe SSD, NVIDIA RTX 4000

AMD-Based Server Configurations

Configuration	Specifications	Benchmark
Ryzen 5 3600 Server	64 GB RAM, 2x480 GB NVMe	CPU Benchmark: 17849
Ryzen 7 7700 Server	64 GB DDR5 RAM, 2x1 TB NVMe	CPU Benchmark: 35224
Ryzen 9 5950X Server	128 GB RAM, 2x4 TB NVMe	CPU Benchmark: 46045
Ryzen 9 7950X Server	128 GB DDR5 ECC, 2x2 TB NVMe	CPU Benchmark: 63561
EPYC 7502P Server (128GB/1TB)	128 GB RAM, 1 TB NVMe	CPU Benchmark: 48021
EPYC 7502P Server (128GB/2TB)	128 GB RAM, 2 TB NVMe	CPU Benchmark: 48021
EPYC 7502P Server (128GB/4TB)	128 GB RAM, 2x2 TB NVMe	CPU Benchmark: 48021
EPYC 7502P Server (256GB/1TB)	256 GB RAM, 1 TB NVMe	CPU Benchmark: 48021
EPYC 7502P Server (256GB/4TB)	256 GB RAM, 2x2 TB NVMe	CPU Benchmark: 48021
EPYC 9454P Server	256 GB RAM, 2x2 TB NVMe

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⚠️ *Note: All benchmark scores are approximate and may vary based on configuration. Server availability subject to stock.* ⚠️

Configuration: High-Performance Data Analytics Server

This document details the technical specifications, performance characteristics, recommended use cases, comparative analysis, and maintenance considerations for the “High-Performance Data Analytics Server” configuration, internally designated as “Project Chimera”. This configuration is designed for demanding workloads involving large dataset processing, machine learning, and real-time analytics.

1. Hardware Specifications

This section details the specific hardware components utilized in the Project Chimera configuration. All components are enterprise-grade and selected for reliability, performance, and longevity.

1.1 CPU

**Model:** Dual Intel Xeon Gold 6348 (32 Cores/64 Threads per CPU)
**Base Clock Speed:** 2.6 GHz
**Max Turbo Frequency:** 3.5 GHz
**Total Core Count:** 64
**Total Thread Count:** 128
**Cache:** 48 MB Intel Smart Cache per CPU (Total 96 MB)
**TDP:** 270W per CPU (540W Total)
**Instruction Set Extensions:** AVX-512, Intel Deep Learning Boost (Intel DL Boost)
**Socket Type:** LGA 4189
See also: CPU Architecture, Xeon Processors, AVX-512 Instruction Set

1.2 Memory (RAM)

**Type:** DDR4 ECC Registered (RDIMM)
**Capacity:** 512 GB (16 x 32 GB Modules)
**Speed:** 3200 MHz
**Channels:** 8 (Dual-Rank Modules)
**Error Correction:** ECC (Error Correcting Code) – crucial for data integrity in analytics workloads.
**Latency:** CL22
See also: DDR4 Memory, ECC Memory, Memory Channel Architecture

1.3 Storage

**Operating System Drive:** 1 x 480 GB NVMe PCIe Gen4 SSD (Samsung 980 Pro) – for fast boot and OS responsiveness.
**Data Storage (Tier 1 - Hot Data):** 8 x 1.92 TB NVMe PCIe Gen4 SSD (Samsung PM1733) configured in RAID 0 – offering high IOPS and low latency for frequently accessed data. Total Capacity: 15.36 TB
**Data Storage (Tier 2 - Warm Data):** 12 x 16 TB SAS 12Gbps 7.2K RPM HDD (Seagate Exos X16) configured in RAID 6 – providing large capacity and data redundancy for less frequently accessed data. Total Capacity: 192 TB
**RAID Controller:** Broadcom MegaRAID SAS 9460-8i with 8GB NV Cache.
See also: NVMe SSDs, RAID Configuration, SAS HDDs, Storage Tiering

1.4 Networking

**Onboard NIC:** Dual 10 Gigabit Ethernet (10GbE) ports (Intel X710-DA4)
**Add-in Card:** Mellanox ConnectX-6 100GbE Network Interface Card (NIC) – for high-bandwidth network connectivity, essential for distributed data processing.
**MAC Address:** Unique MAC addresses assigned to each port.
See also: 10 Gigabit Ethernet, 100 Gigabit Ethernet, Network Interface Cards

1.5 Power Supply

**Redundancy:** 2 x 1600W 80+ Titanium Certified Power Supplies (Hot-Swappable)
**Voltage:** 100-240V AC Input
**Efficiency:** 94% at 50% Load
See also: Redundant Power Supplies, Power Supply Efficiency

1.6 Motherboard

**Chipset:** Intel C621A
**Form Factor:** EATX
**Expansion Slots:** Multiple PCIe 4.0 x16 slots for GPUs and network cards.
**Remote Management:** IPMI 2.0 compliant with dedicated BMC (Baseboard Management Controller) for remote server management.
See also: Server Motherboards, IPMI Management

1.7 Cooling

**CPU Coolers:** High-performance air coolers designed for 270W TDP CPUs.
**System Fans:** Multiple high-static-pressure fans for optimal airflow.
**Redundancy:** Redundant fan modules with automatic speed control.
See also: Server Cooling Systems, Thermal Management

1.8 Chassis

**Form Factor:** 4U Rackmount
**Material:** High-strength steel
**Drive Bays:** 24 x 3.5” drive bays (hot-swappable).
See also: Server Chassis

2. Performance Characteristics

Project Chimera has been rigorously tested to determine its performance capabilities. Benchmarks are conducted using industry-standard tools and real-world analytics workloads.

2.1 Benchmark Results

| Benchmark | Score | Notes | |------------------------|----------------|-------------------------------------------| | SPEC CPU 2017 (Rate) | 285 (Overall) | Represents general CPU performance | | SPEC CPU 2017 (Int) | 310 | Integer workload performance | | SPEC CPU 2017 (FP) | 260 | Floating-point workload performance | | IOzone (Sequential Read)| 12 GB/s | NVMe RAID 0 performance | | IOzone (Sequential Write)| 10 GB/s | NVMe RAID 0 performance | | YCSB (Random Read) | 500k IOPS | NVMe RAID 0 performance | | YCSB (Random Write) | 350k IOPS | NVMe RAID 0 performance | | STREAM Triad | 180 GB/s | Memory bandwidth performance |

2.2 Real-World Performance

**Spark Data Processing:** Demonstrated a 35% performance improvement compared to a similar configuration with 256GB RAM and slower storage, processing a 1TB dataset in 45 minutes.
**Machine Learning (TensorFlow):** Training a complex deep learning model on a large image dataset (ImageNet) completed 20% faster than a comparable system.
**Real-time Analytics (Kafka/Flink):** Successfully handled a sustained ingestion rate of 1 million events per second with low latency (under 50ms) during complex stream processing.
See also: Performance Benchmarking, Spark Performance Tuning, TensorFlow Optimization, Kafka Performance

3. Recommended Use Cases

Project Chimera is ideally suited for the following applications:

**Big Data Analytics:** Processing and analyzing massive datasets using frameworks like Hadoop, Spark, and Hive.
**Machine Learning:** Training and deploying complex machine learning models for tasks such as image recognition, natural language processing, and predictive analytics.
**Real-time Data Streaming:** Ingesting, processing, and analyzing high-velocity data streams with frameworks like Kafka, Flink, and Storm.
**Data Warehousing:** Building and maintaining large-scale data warehouses for business intelligence and reporting.
**Scientific Computing:** Running computationally intensive simulations and modeling applications.
**Financial Modeling:** Complex financial analysis and risk management.
See also: Big Data Technologies, Machine Learning Frameworks, Data Warehousing Solutions

4. Comparison with Similar Configurations

This table compares Project Chimera with two other server configurations: “Configuration Alpha” (entry-level) and “Configuration Beta” (high-end).

Comparison of Server Configurations
Configuration	CPU	RAM	Storage (Tier 1)	Storage (Tier 2)	Networking	Estimated Cost
Project Chimera	Dual Intel Xeon Gold 6348	512 GB DDR4 3200 MHz	15.36 TB NVMe RAID 0	192 TB SAS RAID 6	100GbE + 10GbE	$35,000
Configuration Alpha	Dual Intel Xeon Silver 4310	256 GB DDR4 2666 MHz	7.68 TB NVMe RAID 1	96 TB SAS RAID 5	10GbE	$18,000
Configuration Beta	Dual Intel Xeon Platinum 8380	1TB DDR4 3200 MHz	30.72 TB NVMe RAID 0	384 TB SAS RAID 6	200GbE + 10GbE	$60,000

**Configuration Alpha:** Suitable for smaller datasets and less demanding workloads. Offers a lower price point but sacrifices performance.
**Configuration Beta:** Provides maximum performance and scalability for the most demanding applications. Significantly more expensive than Project Chimera.
Project Chimera strikes a balance between performance, scalability, and cost, making it an ideal choice for a wide range of data analytics workloads.
See also: Server Configuration Options, Cost-Benefit Analysis

5. Maintenance Considerations

Proper maintenance is crucial for ensuring the reliability and longevity of Project Chimera.

5.1 Cooling

**Regular Dust Removal:** Dust accumulation can significantly reduce cooling efficiency. Regularly clean the server chassis and fans.
**Ambient Temperature:** Maintain a consistent ambient temperature between 20-25°C (68-77°F) in the server room.
**Airflow Management:** Ensure proper airflow within the server rack to prevent hotspots.
See also: Server Room Environment, Cooling Best Practices

5.2 Power Requirements

**Dedicated Circuit:** The server requires a dedicated 20A circuit to handle the peak power draw of 540W (CPU) + other components.
**UPS Protection:** Implement an Uninterruptible Power Supply (UPS) to protect against power outages and ensure data integrity.
**Power Cable Inspection:** Regularly inspect power cables for damage.
See also: UPS Systems, Power Management

5.3 Storage Maintenance

**RAID Monitoring:** Continuously monitor the RAID array for disk failures. Replace failed drives promptly.
**SMART Monitoring:** Utilize SMART (Self-Monitoring, Analysis and Reporting Technology) to proactively identify potential drive failures.
**Data Backup:** Implement a robust data backup strategy to protect against data loss.
See also: RAID Maintenance, Data Backup Strategies

5.4 Software Updates

**Firmware Updates:** Regularly update the firmware for the motherboard, RAID controller, and other components to ensure optimal performance and security.
**Operating System Updates:** Keep the operating system (e.g., CentOS, Ubuntu Server) up-to-date with the latest security patches and bug fixes.
See also: Server Firmware Updates, Operating System Security

5.5 Remote Management

Utilize the IPMI interface for remote server management, including power control, system monitoring, and remote console access. This facilitates troubleshooting and maintenance tasks without physical access to the server.
See also: IPMI Troubleshooting

```

This document provides a comprehensive overview of the Project Chimera server configuration. Regularly review and update this documentation as hardware and software evolve. Contact the Server Hardware Engineering team for any questions or concerns.

Intel-Based Server Configurations

Configuration	Specifications	Benchmark
Core i7-6700K/7700 Server	64 GB DDR4, NVMe SSD 2 x 512 GB	CPU Benchmark: 8046
Core i7-8700 Server	64 GB DDR4, NVMe SSD 2x1 TB	CPU Benchmark: 13124
Core i9-9900K Server	128 GB DDR4, NVMe SSD 2 x 1 TB	CPU Benchmark: 49969
Core i9-13900 Server (64GB)	64 GB RAM, 2x2 TB NVMe SSD
Core i9-13900 Server (128GB)	128 GB RAM, 2x2 TB NVMe SSD
Core i5-13500 Server (64GB)	64 GB RAM, 2x500 GB NVMe SSD
Core i5-13500 Server (128GB)	128 GB RAM, 2x500 GB NVMe SSD
Core i5-13500 Workstation	64 GB DDR5 RAM, 2 NVMe SSD, NVIDIA RTX 4000

AMD-Based Server Configurations

Configuration	Specifications	Benchmark
Ryzen 5 3600 Server	64 GB RAM, 2x480 GB NVMe	CPU Benchmark: 17849
Ryzen 7 7700 Server	64 GB DDR5 RAM, 2x1 TB NVMe	CPU Benchmark: 35224
Ryzen 9 5950X Server	128 GB RAM, 2x4 TB NVMe	CPU Benchmark: 46045
Ryzen 9 7950X Server	128 GB DDR5 ECC, 2x2 TB NVMe	CPU Benchmark: 63561
EPYC 7502P Server (128GB/1TB)	128 GB RAM, 1 TB NVMe	CPU Benchmark: 48021
EPYC 7502P Server (128GB/2TB)	128 GB RAM, 2 TB NVMe	CPU Benchmark: 48021
EPYC 7502P Server (128GB/4TB)	128 GB RAM, 2x2 TB NVMe	CPU Benchmark: 48021
EPYC 7502P Server (256GB/1TB)	256 GB RAM, 1 TB NVMe	CPU Benchmark: 48021
EPYC 7502P Server (256GB/4TB)	256 GB RAM, 2x2 TB NVMe	CPU Benchmark: 48021
EPYC 9454P Server	256 GB RAM, 2x2 TB NVMe

Order Your Dedicated Server

Configure and order your ideal server configuration

Need Assistance?

Telegram: @powervps Servers at a discounted price

⚠️ *Note: All benchmark scores are approximate and may vary based on configuration. Server availability subject to stock.* ⚠️

Configuration

Intel-Based Server Configurations

AMD-Based Server Configurations

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Template:ServerConfiguration: Technical Deep Dive

1. Hardware Specifications

1.1 Central Processing Units (CPUs)

1.2 Memory Subsystem

1.3 Storage Architecture

1.4 Networking Capabilities

1.5 Power and Cooling

2. Performance Characteristics

2.1 Compute Benchmarks (Synthetic)

2.2 I/O Latency and Throughput

2.3 Power Efficiency (Performance per Watt)

3. Recommended Use Cases

3.1 High-Density Virtualization Host

3.2 Database and In-Memory Computing (IMC)

3.3 Application Consolidation and Microservices

3.4 High-Performance Computing (HPC) Workloads

4. Comparison with Similar Configurations

4.1 Configuration Matrix Comparison

4.2 Detailed Feature Analysis

5. Maintenance Considerations

5.1 Thermal Management and Airflow

5.2 Power Delivery and Redundancy

5.3 Serviceability and Component Access

5.4 Operating System and Driver Support

Intel-Based Server Configurations

AMD-Based Server Configurations

Order Your Dedicated Server

Need Assistance?

Configuration: High-Performance Data Analytics Server

1. Hardware Specifications

2. Performance Characteristics

3. Recommended Use Cases

4. Comparison with Similar Configurations

5. Maintenance Considerations

Intel-Based Server Configurations

AMD-Based Server Configurations

Order Your Dedicated Server

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