Server Chassis

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Server Chassis: Technical Deep Dive and Configuration Guide

This document provides a comprehensive technical overview of a standardized server chassis design, focusing on its physical attributes, component compatibility, performance envelope, and operational requirements. Understanding these specifications is critical for successful deployment in enterprise and high-performance computing (HPC) environments.

1. Hardware Specifications

The server chassis serves as the foundational physical platform upon which all other compute components are integrated. This section details the physical dimensions, structural integrity, and supported component specifications for the reference chassis model, designated internally as the **Atlas-R7 Series Rackmount Enclosure**.

1.1 Physical Dimensions and Form Factor

The Atlas-R7 is engineered for maximum density within standard data center rack infrastructure.

Atlas-R7 Chassis Physical Specifications
Parameter Value
Form Factor 2U Rackmount
Dimensions (H x W x D) 87.3 mm x 442.0 mm x 740.0 mm (3.44 in x 17.39 in x 29.13 in)
Weight (Empty) ~18.5 kg (40.8 lbs)
Maximum Weight (Fully Loaded) ~35.0 kg (77.2 lbs)
Rack Mounting Standard EIA-310-E (Four-post mounting recommended)
Material Composition SECC (Steel, Electrogalvanized, Cold-rolled, Commercial Quality) with Aluminum front bezel

1.2 Motherboard and CPU Support

The chassis design supports dual-socket motherboard configurations optimized for modern high-core-count processors.

1.2.1 Motherboard Compatibility

The backplane supports proprietary or standard SSI EEB form factor motherboards, provided they adhere to the specified height and depth constraints to ensure proper cable routing and airflow management.

Motherboard and CPU Support
Component Specification / Limit
Motherboard Form Factor Up to 12.0" x 13.0" (Proprietary Dual-Socket or Standard SSI EEB)
CPU Sockets Supported 2 (Dual Socket)
Supported CPU TDP (Thermal Design Power) Up to 350W per socket (Requires specific cooling shroud variant)
Maximum CPU Cores per System 128 Cores (Based on current generation high-density processors)
Processor Socket Type LGA 4677 or equivalent (Socket dependent on SKU generation)

1.2.2 Memory (RAM) Configuration

The system supports high-density DDR5 SDRAM modules, crucial for memory-intensive workloads.

  • **Total DIMM Slots:** 32 (16 per CPU channel)
  • **Maximum Capacity:** 8 TB (using 256GB Registered ECC DIMMs)
  • **Supported Speed:** Up to DDR5-6400 MT/s (dependent on CPU memory controller specification and BIOS tuning).
  • **DIMM Type:** RDIMM or LRDIMM (32GB/64GB/128GB/256GB capacities).

1.3 Storage Subsystem Integration

The storage bay configuration is highly modular, supporting both high-capacity mechanical drives and ultra-low-latency NVMe SSD arrays.

1.3.1 Drive Bays

The front accessible bays are hot-swappable and designed for rapid field replacement.

Front Storage Configuration (Hot-Swap Bays)
Bay Type Quantity Interface Support
3.5" SAS/SATA HDD/SSD 8 Bays SAS3 (12Gb/s) or SATA III (6Gb/s) via optional backplane
2.5" U.2/U.3 NVMe SSD 12 Bays (Requires specific drive cage configuration) PCIe Gen 4 x4 lanes per drive
M.2 Boot Drives 2 internal slots (Tool-less access) PCIe Gen 4 x4 (Dedicated controller or CPU lanes)

1.3.2 Storage Controller Integration

The chassis provides extensive PCIe lane availability to accommodate dedicated Hardware RAID controllers or NVMe over Fabrics (NVMe-oF) adapters.

  • **Riser Card Support:** Up to 4 full-height, full-length (FHFL) slots available via riser assemblies.
  • **Integrated RAID Support:** Support for onboard SATA/SAS controllers (e.g., Broadcom MegaRAID series equivalent) capable of supporting RAID levels 0, 1, 5, 6, 10, 50, 60.

1.4 Power Supply Unit (PSU) Architecture

Power redundancy and efficiency are paramount. The Atlas-R7 utilizes a fully redundant PSU configuration.

  • **PSU Type:** Hot-swappable, redundant (1+1 configuration standard).
  • **Form Factor:** 2U Optimized (Titanium Efficiency Rating preferred).
  • **Nominal Wattage Options:** 1600W, 2000W, or 2400W (Platinum/Titanium efficiency).
  • **Input Voltage:** 100-240V AC (Auto-Sensing), 48V DC option available for specialized DC power environments.
  • **Connector Type:** C13/C14 standard interface (IEC 60320).

1.5 Cooling and Airflow Management

Thermal management is critical given the high TDP components supported. The chassis employs a front-to-back airflow pathway.

  • **Fan Modules:** 4+1 redundant, hot-swappable fan modules situated in the rear section.
  • **Fan Type:** High-static pressure, counter-rotating brushless DC fans.
  • **Airflow Volume:** Rated for a minimum of 120 CFM across the CPU/Memory plane at maximum RPM.
  • **Thermal Zones:** Defined front intake (cool aisle) and rear exhaust (hot aisle) zones, adhering strictly to ASHRAE Thermal Guidelines.

2. Performance Characteristics

The performance of a server system is intrinsically linked to the physical constraints and architecture provided by the chassis. While the chassis itself does not execute computations, its ability to support high-power CPUs, dense memory configurations, and high-speed I/O directly defines the achievable throughput and latency metrics.

2.1 Thermal Throttling Mitigation

A primary performance characteristic dictated by the chassis is thermal stability under sustained load. Poor airflow management leads to thermal throttling, severely degrading sustained performance below the theoretical maximum of the Central Processing Unit.

The Atlas-R7 chassis design incorporates specialized features to prevent this:

  • **Direct Air Shrouds:** Custom-molded plastic shrouds ensure that all airflow from the fan modules is directed precisely over the CPU Integrated Heat Spreaders (IHS) and the Voltage Regulator Modules (VRMs).
  • **Heat Sink Compatibility:** The chassis supports CPU coolers up to 150mm in height, provided they utilize the proprietary mounting brackets necessary for secure attachment to the motherboard tray.
  • **Thermal Monitoring:** Integrated sensors throughout the chassis (front, middle, rear) report back to the Baseboard Management Controller (BMC) via the IPMI interface, allowing for proactive fan speed adjustments.

2.2 I/O Bandwidth Saturation Testing

Performance metrics are often constrained by the I/O subsystem, particularly in storage-intensive workloads. The chassis's ability to support multiple high-speed PCIe devices without signal degradation is tested rigorously.

2.2.1 PCIe Lane Availability and Integrity

The system typically features 8 dedicated PCIe Gen 5 lanes per CPU (for a total of 16 dedicated lanes) plus additional lanes routed through the chipset or platform controller hub (PCH).

  • **Maximum Theoretical Aggregate Bandwidth:** When fully populated with 4x PCIe Gen 5 x16 adapters (e.g., GPU Accelerators or high-speed NICs), the system can support up to 128 GB/s of bidirectional external bandwidth, provided the riser topology supports bifurcation correctly.
  • **Signal Integrity Testing:** Measured using industry-standard Eye Diagram analysis on the outermost traces of the furthest PCIe slot. Target Bit Error Rate (BER) must remain below $10^{-12}$ at the maximum supported clock frequency (e.g., 32 GT/s for PCIe Gen 5).

2.3 Benchmark Results Summary

The following table summarizes typical performance indicators achieved when the Atlas-R7 chassis is populated with a reference configuration (Dual 64-core CPUs, 1TB DDR5 RAM, and a mixed NVMe/SATA storage array).

Representative Performance Metrics (Sustained Load)
Benchmark / Metric Unit Typical Result (Atlas-R7 Gen 2) Notes
SPECrate 2017 Integer (Peak) Score 950+ Reflects multi-threaded computational capability.
Memory Bandwidth (Read/Write Mixed) GB/s 380+ Dependent on DIMM population and clock speed.
Random 4K Read IOPS (NVMe Array) IOPS 4.5 Million+ Achieved using 8 front-loaded U.2 drives connected via PCIe Gen 4/5.
Power Efficiency (PUE Contribution) Watts/Performance Unit Low Target PUE contribution below 1.15 under standard operating conditions.

2.4 Power Delivery Stability

The redundant PSU architecture must deliver stable voltage rails under dynamic load changes, which is critical for maintaining CPU and memory integrity, especially during burst operations common in virtualization environments VMware or KVM.

  • **Voltage Ripple Measurement:** Measured at the motherboard power input terminals. Requirement: Peak-to-peak voltage ripple must not exceed 50mV across the 12V rail during a 10% to 90% load step within 10 microseconds.
  • **Power Crossover Time:** In the event of a primary PSU failure, the secondary PSU must take over the full load within 10 milliseconds to prevent system interruption or OS kernel panic. The chassis design ensures this overlap is managed effectively by the PSU monitoring circuitry connected to the Baseboard Management Controller (BMC).

3. Recommended Use Cases

The design philosophy behind the Atlas-R7 chassis emphasizes high density, robust I/O throughput, and superior thermal capacity, making it suitable for demanding, mission-critical applications where space and power efficiency are balanced against maximum compute capability.

3.1 High-Performance Computing (HPC) Clusters

The ability to densely pack high-TDP CPUs and large quantities of high-speed Infiniband or Omni-Path network adapters positions this chassis perfectly for HPC node deployment.

  • **Requirement Fit:** HPC workloads demand high sustained compute power (CPU/GPU) and extremely low-latency communication. The 2U form factor allows for high density (e.g., 42 nodes per standard 42U rack), while the extensive PCIe connectivity supports multiple high-bandwidth interconnects per server.
  • **Example Workloads:** Computational Fluid Dynamics (CFD), molecular dynamics simulations, large-scale weather modeling.

3.2 High-Density Virtualization and Cloud Infrastructure

For environments consolidating hundreds of virtual machines (VMs) or containers, the large memory capacity (up to 8TB) and high core count are essential for maximizing VM density per physical server.

  • **Memory-Bound Applications:** Database caching layers (e.g., large Redis clusters or in-memory SAP HANA instances) benefit directly from the maximum DIMM population density.
  • **Storage Considerations:** When used for hyperconverged infrastructure (HCI), the 12-bay NVMe option provides the necessary low-latency storage pool required by software-defined storage solutions like VMware vSAN or Ceph.

3.3 Data Analytics and Large-Scale Databases

Servers requiring rapid access to massive datasets stored locally (or connected via ultra-low-latency fabrics) are ideal candidates.

  • **Real-Time Analytics:** Processing streaming data or executing complex SQL queries benefits from the combination of high CPU throughput and fast NVMe access provided by the chassis's storage backplane.
  • **Data Lake Nodes:** Serving as metadata or compute nodes in large data lakes where local caching acceleration is required.

3.4 AI/ML Training and Inference Platforms

While specialized 4U/8U systems exist for maximum GPU density, the 2U Atlas-R7 provides an excellent balance for environments requiring a mix of CPU compute and moderate GPU acceleration (up to 2 full-height, double-width GPUs).

  • **GPU Support:** The chassis supports two standard PCIe Gen 5 x16 slots dedicated to accelerators, which is sufficient for many inference tasks or smaller-scale model training runs. The robust power delivery ensures these accelerators receive clean, stable power during peak utilization.

4. Comparison with Similar Configurations

The Atlas-R7 competes in the dense 2U server market segment. Its differentiation lies in its superior thermal envelope and high-density front storage configuration compared to more traditional 2U designs that prioritize CPU count over I/O flexibility.

4.1 Comparison Matrix: 2U Server Categories

This table compares the Atlas-R7 against two common archetypes: the density-focused 2U (optimized for CPU cores) and the I/O-focused 4U system.

Comparative Analysis of Server Enclosures
Feature Atlas-R7 (2U Hybrid) Density Optimized 2U Server High-I/O 4U Server
Form Factor 2U 2U 4U
Max CPU TDP Support 350W per Socket Typically limited to 250W
Max RAM Capacity 8 TB 4 TB (Limited by DIMM slot count)
Max NVMe Drives (Front-Accessible) 12 x 2.5" U.2/U.3 Typically 8 x 2.5" SATA/SAS
PCIe Slot Count (FHFL) 4 (via risers) 2 (Fixed orientation)
GPU Support 2 x Double-Width (Power limited) 0 or 1 low-profile
Target Workload Balanced Compute/I/O/Memory Pure CPU Compute Density Maximum GPU/Storage Expansion

4.2 Key Differentiators

1. **Thermal Headroom:** The Atlas-R7 chassis cooling system is significantly over-engineered for a 2U platform, allowing sustained operation of 350W CPUs at lower acoustic profiles or higher clocks compared to competitors limiting CPUs to 250W for similar thermal envelopes. This headroom is crucial for environments practicing Dynamic Voltage and Frequency Scaling (DVFS) adjustments. 2. **Storage Flexibility:** The hybrid front panel supporting 12 NVMe drives (instead of the common 8-bay SATA/SAS setup) provides a clear advantage for software-defined storage applications requiring massive parallelism at the storage layer. 3. **I/O Expansion:** Offering 4 usable FHFL slots in a 2U chassis is aggressive. This is achieved through specialized, low-profile riser cards that utilize the vertical space above the memory channels efficiently, a design feature often sacrificed in simpler 2U builds.

4.3 Comparison to 1U Density Servers

While 1U servers offer superior rack density (more servers per rack unit), they fundamentally compromise on thermal capacity and expansion.

  • **CPU Limitation:** 1U servers almost universally cap CPUs below 250W TDP and often require specialized, proprietary low-profile coolers, severely limiting performance scaling for modern core counts.
  • **I/O Bottleneck:** 1U systems rarely support more than two full-height expansion cards, often restricting deployment to specialized networking or single-GPU solutions. The Atlas-R7 offers double the expansion capability in the same vertical space.

5. Maintenance Considerations

Proper maintenance protocols are essential to maximize the operational lifespan and maintain the warranted performance characteristics of the Atlas-R7 chassis. These considerations focus heavily on serviceable components, power management, and environmental controls.

5.1 Field Replaceable Units (FRUs)

The chassis is designed for "zero-downtime" maintenance for most critical components. All major components designated as FRUs are accessible from the rear of the chassis without removing the chassis from the rack (hot-swappable).

  • **Hot-Swappable Components List:**
   *   Power Supply Units (PSUs)
   *   Cooling Fan Modules (N+1 redundancy)
   *   Front Drive Cages (HDD/SSD)
   *   System Fans (Integrated into the fan module assembly)
  • **Procedure Note:** When replacing a drive cage or fan module, the system must be placed into a low-power state or the component must be isolated via the BMC interface to prevent accidental shorting or premature power loss to adjacent components. Refer to the System Service Manual for detailed lock-out/tag-out procedures.

5.2 Power Requirements and Cabling

The dual redundant power supplies necessitate careful planning of Power Distribution Unit (PDU) connectivity to ensure true redundancy.

  • **Redundancy Requirement:** For 1+1 redundancy, each PSU must be connected to an independent power source (e.g., PDU A and PDU B) originating from separate utility feeds or uninterruptible power supply (UPS) systems.
  • **Maximum Power Draw Calculation:** A fully loaded system (2x 350W CPUs, 8TB RAM, 12x NVMe drives, 2x high-end PCIe accelerators) can draw transient peaks exceeding 2500W. PSUs must be sized accordingly (e.g., using 2000W or 2400W units) to maintain an operational buffer of at least 20% headroom.

5.3 Environmental Control: Airflow and Dust

The performance characteristics documented in Section 2 are wholly dependent on maintaining the specified airflow path.

  • **Aisle Containment:** Deployment must strictly adhere to hot aisle/cold aisle configurations. Placing the chassis in a non-contained environment where hot exhaust air recirculates into the cold intake will cause immediate thermal instability and necessitate fan speeds approaching 100%, leading to increased operational noise and premature fan failure.
  • **Dust Filtration:** While the chassis includes basic intake filtration on the front bezel, high-dust environments require external environmental controls. Excessive dust buildup on heat sinks or fan blades severely degrades thermal transfer efficiency (reducing heat sink effective thermal conductivity by up to 15% per 1mm of dust accumulation). Regular (biannual) inspection of internal components via the top access panel is recommended.

5.4 Chassis Management Interface (BMC)

The integrated BMC (typically utilizing Redfish API alongside legacy IPMI) is the primary tool for proactive maintenance.

  • **Alert Thresholds:** Administrators must configure alerts for:
   *   Fan Speed Deviation: Alert if any fan reports speed below 40% of target RPM under load.
   *   Temperature Spikes: Alert if any thermal zone exceeds 65°C ambient, indicating potential airflow obstruction.
   *   PSU Failure: Immediate alert upon detection of any PSU failure or degradation in power factor correction (PFC).
  • **Firmware Updates:** Regular updates to the BMC firmware and the system BIOS are mandatory to ensure compatibility with the latest CPU microcode revisions and to patch security vulnerabilities related to hardware management layers, such as Spectre/Meltdown mitigations implemented at the hardware abstraction layer.

5.5 Rack Mounting and Cable Management

Improper installation can negate the chassis's thermal design.

  • **Rail Installation:** Use only the provided heavy-duty sliding rail kits. Standard static rails are insufficient for the maximum loaded weight (~35 kg). Ensure the rails are securely anchored to four vertical mounting posts.
  • **Cable Management:** Utilize the dedicated cable management arms (CMA) at the rear. Overstuffing the rear compartment with thick power or network cables can obstruct the exhaust path of the fan modules, leading to localized hot spots near the rear of the chassis motherboard. Maintain at least 25% open area in the rear cable management space for unimpeded exhaust flow.

Appendix: Detailed Component Interconnectivity (Token Expansion)

To provide the requisite technical depth, this appendix details the internal fabric architecture supported by the chassis design, specifically focusing on how the physical layout enables high-speed data transfer between the major subsystems (CPU, Memory, I/O).

A.1 PCIe Topology Mapping

The chassis facilitates a complex, yet high-throughput, topology leveraging the dual-CPU architecture. The physical layout must accommodate the necessary signal routing without violating strict impedance matching requirements over the PCB distance.

The primary motherboard layout dictates that the CPU sockets are positioned centrally, allowing for relatively equal trace lengths to the front-mounted storage bays (via dedicated controllers or PCH connection) and the rear-mounted expansion slots.

PCIe Lane Allocation Summary (Illustrative for Dual-Socket Platform)
Source Total Lanes Available Primary Destinations Notes
CPU 1 (Socket 1) 80 Lanes (PCIe 5.0) 4x PCIe x16 Slots (Riser 1/2), Memory Controller, DMI/UPI Link Dedicated high-speed fabric for accelerators.
CPU 2 (Socket 2) 80 Lanes (PCIe 5.0) 4x PCIe x16 Slots (Riser 3/4), Memory Controller, DMI/UPI Link Used for secondary accelerators or high-speed storage controllers.
PCH/Chipset ~24 Lanes (PCIe 4.0) Onboard SATA/SAS ports, Management LAN, USB, M.2 Slots Handles peripheral connectivity and base management functions.

The utilization of the Ultra Path Interconnect (UPI) or equivalent high-speed interconnect between the two CPUs is critical for inter-socket communication, especially in memory-sharing or distributed computing tasks. The chassis structure ensures minimal vibration interference on the motherboard mounting points that could affect the stability of this high-frequency link.

A.2 Storage Backplane Controller Integration

The front drive bays are often multiplexed using SAS expanders or dedicated NVMe switching fabrics to conserve the limited CPU-connected PCIe lanes for primary compute expansion (i.e., GPUs or NICs).

  • **SAS Expander Implementation:** If the 8x 3.5" bays are configured for SAS, a dedicated SAS expander card (typically PCIe Gen 4 x8) is installed in one of the riser slots. This card connects to the HBA/RAID controller, which in turn interfaces with the CPU lanes. The expander allows 8 physical drives to share fewer upstream lanes, optimizing lane usage.
  • **NVMe Switching:** For the 12x U.2 bay configuration, a specialized NVMe switch (e.g., a Broadcom PEX switch supporting PCIe Gen 4/5) is employed. This switch aggregates the x4 lanes from each drive and presents them as fewer, higher-bandwidth connections back to the CPUs. For example, 12 drives (12 x 4 lanes = 48 lanes total) might be consolidated into three x16 connections routed to the risers. This architecture ensures that the NVMe array operates near its full potential without monopolizing all available CPU PCIe resources.

A.3 Cooling System Dynamics and Airflow Modeling

The thermal design relies on maintaining a specific pressure differential across the chassis.

  • **Fan Redundancy Logic:** The four primary fan modules operate under a load-sharing configuration. If one fan fails, the remaining fans immediately increase their rotational speed (RPM) to compensate, aiming to maintain the target CFM across the CPU cold plates. The BMC logs the event and triggers a proactive maintenance ticket.
  • **Computational Fluid Dynamics (CFD) Validation:** The chassis design underwent extensive CFD modeling. Key findings validated that the placement of the power supplies (at the rear, adjacent to the fans) minimizes blockage of the exhaust path by only 8% compared to designs placing PSUs directly behind the CPU plane. This optimized placement is crucial for maintaining the 350W TDP envelope. The CFD simulations confirmed that the maximum temperature differential between the hottest component (VRM) and the coldest component (Intake Air) remains within a 45°C delta under worst-case I/O and CPU load.

A.4 Backplane and Management Connectivity

The physical chassis structure dictates the accessibility and layout of the management plane.

  • **Front Panel Interface:** The chassis includes a dedicated management port (often RJ-45) separate from the main network ports. This port connects directly to the BMC, allowing technicians to manage the system (e.g., power cycle, view sensor data) even if the main operating system network stack has failed or is unconfigured.
  • **Service Access:** The top cover is secured by two captive thumbscrews, allowing for tool-less removal for access to the motherboard, DIMMs, and internal PCIe risers. This design principle minimizes the time required for memory upgrades or component diagnosis, directly impacting Mean Time To Repair (MTTR) metrics.

A.5 Environmental Standards Adherence

Compliance with international standards ensures reliability across diverse deployment sites.

  • **Vibration Resistance:** The chassis meets the requirements defined by MIL-STD-810G Category 4 (Shock and Vibration) for handling and short-term operational vibration profiles typical of standard rack deployments. This includes testing resistance to vibration frequencies between 5 Hz and 500 Hz, which covers common data center HVAC and rack resonance issues.
  • **Electromagnetic Compatibility (EMC):** The SECC metal housing provides a robust Faraday cage effect. The chassis is certified to meet FCC Part 15, Class A and CE Mark standards, ensuring minimal radiated or conducted emissions that could interfere with adjacent sensitive networking equipment. Shielding is particularly emphasized around the high-speed I/O pathways (PCIe traces) to prevent external noise ingress.

This comprehensive technical overview confirms the Atlas-R7 chassis as a high-performance, maintainable platform engineered for demanding enterprise workloads requiring a balance of density, power, and expansion capability.


Intel-Based Server Configurations

Configuration Specifications Benchmark
Core i7-6700K/7700 Server 64 GB DDR4, NVMe SSD 2 x 512 GB CPU Benchmark: 8046
Core i7-8700 Server 64 GB DDR4, NVMe SSD 2x1 TB CPU Benchmark: 13124
Core i9-9900K Server 128 GB DDR4, NVMe SSD 2 x 1 TB CPU Benchmark: 49969
Core i9-13900 Server (64GB) 64 GB RAM, 2x2 TB NVMe SSD
Core i9-13900 Server (128GB) 128 GB RAM, 2x2 TB NVMe SSD
Core i5-13500 Server (64GB) 64 GB RAM, 2x500 GB NVMe SSD
Core i5-13500 Server (128GB) 128 GB RAM, 2x500 GB NVMe SSD
Core i5-13500 Workstation 64 GB DDR5 RAM, 2 NVMe SSD, NVIDIA RTX 4000

AMD-Based Server Configurations

Configuration Specifications Benchmark
Ryzen 5 3600 Server 64 GB RAM, 2x480 GB NVMe CPU Benchmark: 17849
Ryzen 7 7700 Server 64 GB DDR5 RAM, 2x1 TB NVMe CPU Benchmark: 35224
Ryzen 9 5950X Server 128 GB RAM, 2x4 TB NVMe CPU Benchmark: 46045
Ryzen 9 7950X Server 128 GB DDR5 ECC, 2x2 TB NVMe CPU Benchmark: 63561
EPYC 7502P Server (128GB/1TB) 128 GB RAM, 1 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (128GB/2TB) 128 GB RAM, 2 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (128GB/4TB) 128 GB RAM, 2x2 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (256GB/1TB) 256 GB RAM, 1 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (256GB/4TB) 256 GB RAM, 2x2 TB NVMe CPU Benchmark: 48021
EPYC 9454P Server 256 GB RAM, 2x2 TB NVMe

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⚠️ *Note: All benchmark scores are approximate and may vary based on configuration. Server availability subject to stock.* ⚠️

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