Chassis Cooling
```mediawiki
- REDIRECT Chassis Cooling
Template:Infobox Server Configuration
Technical Documentation: Server Configuration Template:Stub
This document provides a comprehensive technical analysis of the Template:Stub reference configuration. This configuration is designed to serve as a standardized, baseline hardware specification against which more advanced or specialized server builds are measured. While the "Stub" designation implies a minimal viable product, its components are selected for stability, broad compatibility, and cost-effectiveness in standardized data center environments.
1. Hardware Specifications
The Template:Stub configuration prioritizes proven, readily available components that offer a balanced performance-to-cost ratio. It is designed to fit within standard 2U rackmount chassis dimensions, although specific chassis models may vary.
1.1. Central Processing Units (CPUs)
The configuration mandates a dual-socket (2P) architecture to ensure sufficient core density and memory channel bandwidth for general-purpose workloads.
| Specification | Detail (Minimum Requirement) | Detail (Recommended Baseline) |
|---|---|---|
| Architecture | Intel Xeon Scalable (Cascade Lake or newer preferred) or AMD EPYC (Rome or newer preferred) | Intel Xeon Scalable Gen 3 (Ice Lake) or AMD EPYC Gen 3 (Milan) |
| Socket Count | 2 | 2 |
| Base TDP Range | 95W – 135W per socket | 120W – 150W per socket |
| Minimum Cores per Socket | 12 Physical Cores | 16 Physical Cores |
| Minimum Frequency (All-Core Turbo) | 2.8 GHz | 3.1 GHz |
| L3 Cache (Total) | 36 MB Minimum | 64 MB Minimum |
| Supported Memory Channels | 6 or 8 Channels per socket | 8 Channels per socket (for optimal I/O) |
The selection of the CPU generation is crucial; while older generations may fit the "stub" moniker, modern stability and feature sets (such as AVX-512 or PCIe 4.0 support) are mandatory for baseline compatibility with contemporary operating systems and hypervisors.
1.2. Random Access Memory (RAM)
Memory capacity and speed are provisioned to support moderate virtualization density or large in-memory datasets typical of database caching layers. The configuration specifies DDR4 ECC Registered DIMMs (RDIMMs) or Load-Reduced DIMMs (LRDIMMs) depending on the required density ceiling.
| Specification | Detail | |
|---|---|---|
| Type | DDR4 ECC RDIMM/LRDIMM (DDR5 requirement for future revisions) | |
| Total Capacity (Minimum) | 128 GB | |
| Total Capacity (Recommended) | 256 GB | |
| Configuration Strategy | Fully populated memory channels (e.g., 8 DIMMs per CPU or 16 total) | |
| Speed Rating (Minimum) | 2933 MT/s | |
| Speed Rating (Recommended) | 3200 MT/s (or fastest supported by CPU/Motherboard combination) | |
| Maximum Supported DIMM Rank | Dual Rank (2R) preferred for stability |
It is critical that the BIOS/UEFI is configured to utilize the maximum supported memory speed profile (e.g., XMP or JEDEC profiles) while maintaining stability under full load, adhering strictly to the Memory Interleaving guidelines for the specific motherboard chipset.
1.3. Storage Subsystem
The storage configuration emphasizes a tiered approach: a high-speed boot/OS volume and a larger, redundant capacity volume for application data. Direct Attached Storage (DAS) is the standard implementation.
| Tier | Component Type | Quantity | Capacity (per unit) | Interface/Protocol |
|---|---|---|---|---|
| Boot/OS | NVMe M.2 or U.2 SSD | 2 (Mirrored) | 480 GB Minimum | PCIe 3.0/4.0 x4 |
| Data/Application | SATA or SAS SSD (Enterprise Grade) | 4 to 6 | 1.92 TB Minimum | SAS 12Gb/s (Preferred) or SATA III |
| RAID Controller | Hardware RAID (e.g., Broadcom MegaRAID) | 1 | N/A | PCIe 3.0/4.0 x8 interface required |
The data drives must be configured in a RAID 5 or RAID 6 array for redundancy. The use of NVMe for the OS tier significantly reduces boot times and metadata access latency, a key improvement over older SATA-based stub configurations. Refer to RAID Levels documentation for specific array geometry recommendations.
1.4. Networking and I/O
Standardization on 10 Gigabit Ethernet (10GbE) is required for the management and primary data interfaces.
| Component | Specification | Purpose |
|---|---|---|
| Primary Network Interface (Data) | 2 x 10GbE SFP+ or Base-T (Configured in LACP/Active-Passive) | Application Traffic, VM Networking |
| Management Interface (Dedicated) | 1 x 1GbE (IPMI/iDRAC/iLO) | Out-of-Band Management |
| PCIe Slots Utilization | At least 2 x PCIe 4.0 x16 slots populated (for future expansion or high-speed adapters) | Expansion for SAN connectivity or specialized accelerators |
The onboard Baseboard Management Controller (BMC) must support modern standards, including HTML5 console redirection and secure firmware updates.
1.5. Power and Form Factor
The configuration is designed for high-density rack deployment.
- **Form Factor:** 2U Rackmount Chassis (Standard 19-inch width).
- **Power Supplies (PSUs):** Dual Redundant, Hot-Swappable, Platinum or Titanium Efficiency Rating (>= 92% efficiency at 50% load).
- **Total Rated Power Draw (Peak):** Approximately 850W – 1100W (dependent on CPU TDP and storage configuration).
- **Input Voltage:** 200-240V AC (Recommended for efficiency, though 110V support must be validated).
2. Performance Characteristics
The performance profile of the Template:Stub is defined by its balanced memory bandwidth and core count, making it a suitable platform for I/O-bound tasks that require moderate computational throughput.
2.1. Synthetic Benchmarks (Estimated)
The following benchmarks reflect expected performance based on the recommended component specifications (Ice Lake/Milan generation CPUs, 3200MT/s RAM).
| Benchmark Area | Metric | Expected Result Range | Notes |
|---|---|---|---|
| CPU Compute (Integer/Floating Point) | SPECrate 2017 Integer (Base) | 450 – 550 | Reflects multi-threaded efficiency. |
| Memory Bandwidth (Aggregate) | Read/Write (GB/s) | 180 – 220 GB/s | Dependent on DIMM population and CPU memory controller quality. |
| Storage IOPS (Random 4K Read) | Sustained IOPS (from RAID 5 Array) | 150,000 – 220,000 IOPS | Heavily influenced by RAID controller cache and drive type. |
| Network Throughput | TCP/IP Throughput (iperf3) | 19.0 – 19.8 Gbps (Full Duplex) | Testing 2x 10GbE bonded link. |
The key performance bottleneck in the Stub configuration, particularly when running high-vCPU density workloads, is often the memory subsystem's latency profile rather than raw core count, especially when the operating system or application attempts to access data across the Non-Uniform Memory Access boundary between the two sockets.
2.2. Real-World Performance Analysis
The Stub configuration excels in scenarios demanding high I/O consistency rather than peak computational burst capacity.
- **Database Workloads (OLTP):** Handles transactional loads requiring moderate connections (up to 500 concurrent active users) effectively, provided the working set fits within the 256GB RAM allocation. Performance degradation begins when the workload triggers significant page faults requiring reliance on the SSD tier.
- **Web Serving (Apache/Nginx):** Capable of serving tens of thousands of concurrent requests per second (RPS) for static or moderately dynamic content, limited primarily by network saturation or CPU instruction pipeline efficiency under heavy SSL/TLS termination loads.
- **Container Orchestration (Kubernetes Node):** Functions optimally as a worker node supporting 40-60 standard microservices containers, where the CPU cores provide sufficient scheduling capacity, and the 10GbE networking allows for rapid service mesh communication.
3. Recommended Use Cases
The Template:Stub configuration is not intended for high-performance computing (HPC) or extreme data analytics but serves as an excellent foundation for robust, general-purpose infrastructure.
3.1. Virtualization Host (Mid-Density)
This configuration is ideal for hosting a consolidated environment where stability and resource isolation are paramount.
- **Target Density:** 8 to 15 Virtual Machines (VMs) depending on the VM profile (e.g., 8 powerful Windows Server VMs or 15 lightweight Linux application servers).
- **Hypervisor Support:** Full compatibility with VMware vSphere, Microsoft Hyper-V, and Kernel-based Virtual Machine.
- **Benefit:** The dual-socket architecture ensures sufficient PCIe lanes for multiple virtual network interface cards (vNICs) and provides ample physical memory for guest allocation.
3.2. Application and Web Servers
For standard three-tier application architectures, the Stub serves well as the application or web tier.
- **Backend API Tier:** Suitable for hosting RESTful services written in languages like Java (Spring Boot), Python (Django/Flask), or Go, provided the application memory footprint remains within the physical RAM limits.
- **Load Balancing Target:** Excellent as a target for Network Load Balancing (NLB) clusters, offering predictable latency and throughput.
3.3. Jump Box / Bastion Host and Management Server
Due to its robust, standardized hardware, the Stub is highly reliable for critical management functions.
- **Configuration Management:** Running Ansible Tower, Puppet Master, or Chef Server. The storage subsystem provides fast configuration deployment and log aggregation.
- **Monitoring Infrastructure:** Hosting Prometheus/Grafana or ELK stack components (excluding large-scale indexing nodes).
3.4. File and Backup Target
When configured with a higher count of high-capacity SATA/SAS drives (exceeding the 6-drive minimum), the Stub becomes a capable, high-throughput Network Attached Storage (NAS) target utilizing technologies like ZFS or Windows Storage Spaces.
4. Comparison with Similar Configurations
To contextualize the Template:Stub, it is useful to compare it against its immediate predecessors (Template:Legacy) and its successors (Template:HighDensity).
4.1. Configuration Matrix Comparison
| Feature | Template:Stub (Baseline) | Template:Legacy (10/12 Gen Xeon) | Template:HighDensity (1S/HPC Focus) |
|---|---|---|---|
| CPU Sockets | 2P | 2P | 1S (or 2P with extreme core density) |
| Max RAM (Typical) | 256 GB | 128 GB | 768 GB+ |
| Primary Storage Interface | PCIe 4.0 NVMe (OS) + SAS/SATA SSDs | PCIe 3.0 SATA SSDs only | All NVMe U.2/AIC |
| Network Speed | 10GbE Standard | 1GbE Standard | 25GbE or 100GbE Mandatory |
| Power Efficiency Rating | Platinum/Titanium | Gold | Titanium (Extreme Density Optimization) |
| Cost Index (Relative) | 1.0x | 0.6x | 2.5x+ |
The Stub configuration represents the optimal point for balancing current I/O requirements (10GbE, PCIe 4.0) against legacy infrastructure compatibility, whereas the Template:Legacy is constrained by slower interconnects and less efficient power delivery.
4.2. Performance Trade-offs
The primary trade-off when moving from the Stub to the Template:HighDensity configuration involves the shift from balanced I/O to raw compute.
- **Stub Advantage:** Superior I/O consistency due to the dedicated RAID controller and dual-socket memory architecture providing high aggregate bandwidth.
- **HighDensity Disadvantage (in this context):** Single-socket (1S) high-density configurations, while offering more cores per watt, often suffer from reduced memory channel access (e.g., 6 channels vs. 8 channels per CPU), leading to lower sustained memory bandwidth under full virtualization load.
5. Maintenance Considerations
Maintaining the Template:Stub requires adherence to standard enterprise server practices, with specific attention paid to thermal management due to the dual-socket high-TDP components.
5.1. Thermal Management and Cooling
The dual-socket design generates significant heat, necessitating robust cooling infrastructure.
- **Airflow Requirements:** Must maintain a minimum front-to-back differential pressure of 0.4 inches of water column (in H2O) across the server intake area.
- **Component Specifics:** CPUs rated above 150W TDP require high-static pressure fans integrated into the chassis, often exceeding the performance of standard cooling solutions designed for single-socket, low-TDP hardware.
- **Hot Aisle Containment:** Deployment within a hot-aisle/cold-aisle containment strategy is highly recommended to maximize chiller efficiency and prevent thermal throttling, especially during peak operation when all turbo frequencies are engaged.
5.2. Power Requirements and Redundancy
The redundant power supplies (N+1 or 2N configuration) must be connected to diverse power paths whenever possible.
- **PDU Load Balancing:** The total calculated power draw (approaching 1.1kW peak) means that servers should be distributed across multiple Power Distribution Units (PDUs) to avoid overloading any single circuit breaker in the rack infrastructure.
- **Firmware Updates:** Regular firmware updates for the BMC, BIOS/UEFI, and RAID controller are mandatory to ensure compatibility with new operating system kernels and security patches (e.g., addressing Spectre variants).
5.3. Operating System and Driver Lifecycle
The longevity of the Stub configuration relies heavily on vendor support for the chosen CPU generation.
- **Driver Validation:** Before deploying any major OS patch or hypervisor upgrade, all hardware drivers (especially storage controller and network card firmware) must be validated against the vendor's Hardware Compatibility List (HCL).
- **Diagnostic Tools:** The BMC must be configured to stream diagnostic logs (e.g., Intelligent Platform Management Interface sensor readings) to a central System Monitoring platform for proactive failure prediction.
The stability of the Template:Stub ensures that maintenance windows are predictable, typically only required for major component replacements (e.g., PSU failure or expected drive rebuilds) rather than frequent stability patches.
Intel-Based Server Configurations
| Configuration | Specifications | Benchmark |
|---|---|---|
| Core i7-6700K/7700 Server | 64 GB DDR4, NVMe SSD 2 x 512 GB | CPU Benchmark: 8046 |
| Core i7-8700 Server | 64 GB DDR4, NVMe SSD 2x1 TB | CPU Benchmark: 13124 |
| Core i9-9900K Server | 128 GB DDR4, NVMe SSD 2 x 1 TB | CPU Benchmark: 49969 |
| Core i9-13900 Server (64GB) | 64 GB RAM, 2x2 TB NVMe SSD | |
| Core i9-13900 Server (128GB) | 128 GB RAM, 2x2 TB NVMe SSD | |
| Core i5-13500 Server (64GB) | 64 GB RAM, 2x500 GB NVMe SSD | |
| Core i5-13500 Server (128GB) | 128 GB RAM, 2x500 GB NVMe SSD | |
| Core i5-13500 Workstation | 64 GB DDR5 RAM, 2 NVMe SSD, NVIDIA RTX 4000 |
AMD-Based Server Configurations
| Configuration | Specifications | Benchmark |
|---|---|---|
| Ryzen 5 3600 Server | 64 GB RAM, 2x480 GB NVMe | CPU Benchmark: 17849 |
| Ryzen 7 7700 Server | 64 GB DDR5 RAM, 2x1 TB NVMe | CPU Benchmark: 35224 |
| Ryzen 9 5950X Server | 128 GB RAM, 2x4 TB NVMe | CPU Benchmark: 46045 |
| Ryzen 9 7950X Server | 128 GB DDR5 ECC, 2x2 TB NVMe | CPU Benchmark: 63561 |
| EPYC 7502P Server (128GB/1TB) | 128 GB RAM, 1 TB NVMe | CPU Benchmark: 48021 |
| EPYC 7502P Server (128GB/2TB) | 128 GB RAM, 2 TB NVMe | CPU Benchmark: 48021 |
| EPYC 7502P Server (128GB/4TB) | 128 GB RAM, 2x2 TB NVMe | CPU Benchmark: 48021 |
| EPYC 7502P Server (256GB/1TB) | 256 GB RAM, 1 TB NVMe | CPU Benchmark: 48021 |
| EPYC 7502P Server (256GB/4TB) | 256 GB RAM, 2x2 TB NVMe | CPU Benchmark: 48021 |
| EPYC 9454P Server | 256 GB RAM, 2x2 TB NVMe |
Order Your Dedicated Server
Configure and order your ideal server configuration
Need Assistance?
- Telegram: @powervps Servers at a discounted price
⚠️ *Note: All benchmark scores are approximate and may vary based on configuration. Server availability subject to stock.* ⚠️
Chassis Cooling: A Comprehensive Technical Overview
This document details the intricacies of chassis cooling within a high-density server environment. Effective thermal management is critical for server reliability, performance, and longevity. This article provides a deep dive into hardware specifications, performance characteristics, recommended use cases, comparison with alternative configurations, and essential maintenance considerations. This document assumes a foundational understanding of Server Hardware Architecture.
1. Hardware Specifications
This section outlines the specifications of a server configuration heavily reliant on advanced chassis cooling. This particular configuration is designed for high-density computing, specifically targeting AI/ML workloads and high-performance databases. The cooling system is tailored to handle the thermal output of the components listed below.
| Component | Specification |
|---|---|
| CPU | Dual Intel Xeon Platinum 8480+ (56 cores/112 threads per CPU, 3.2 GHz base, 3.8 GHz boost, 96MB L3 Cache, TDP 350W) |
| RAM | 2TB DDR5 ECC Registered RDIMM (8 x 256GB modules, 5600 MHz) - Memory Subsystem |
| Storage | 8 x 4TB NVMe PCIe Gen4 SSD (U.2 interface, Read: 7000 MB/s, Write: 5500 MB/s) + 4 x 16TB SAS HDD (7.2k RPM) - Storage Architecture |
| Network Interface | Dual 200GbE QSFP-DSFP+ Network Adapters - Network Interface Card |
| GPU (optional, up to 4) | NVIDIA H100 Tensor Core GPU (80GB HBM3, 700W TDP) - GPU Acceleration |
| Motherboard | Custom Server Motherboard (Dual CPU sockets, 8 x DIMM slots per CPU, multiple PCIe Gen5 slots) |
| Power Supply | 3 x 1600W Redundant 80+ Titanium Power Supplies - Power Supply Unit |
| Chassis | 4U Rackmount Chassis with advanced airflow management |
| Cooling System | Direct-to-Chip Liquid Cooling (CPU, optional GPU) + Rear Door Heat Exchanger + Redundant High-Static Pressure Fans |
| RAID Controller | Hardware RAID Controller (SAS 6.0 Gbps, RAID 5/6/10 support) - RAID Technology |
Detailed Cooling System Components:
- **Direct-to-Chip Liquid Cooling (DTCLC):** Uses cold plates directly mounted to the CPU and, optionally, GPUs. A closed-loop liquid cooling system circulates coolant to a remote radiator. The coolant is typically a dielectric fluid optimized for thermal conductivity. Detailed specifications include:
* Pump Flow Rate: 400 L/hr * Coolant Capacity: 2.5 Liters * Radiator Dimensions: 360mm x 120mm x 60mm * Radiator Material: Copper with Aluminum Fins
- **Rear Door Heat Exchanger (RDHX):** A passive heat exchanger mounted on the rear door of the server chassis. It utilizes the existing airflow through the chassis to remove heat. Effectiveness is highly dependent on the ambient temperature and airflow within the datacenter.
- **High-Static Pressure Fans:** Multiple redundant fans (typically 8-12) are strategically placed within the chassis to create a strong airflow pattern. High static pressure is crucial for forcing air through dense components and heat sinks. Fan specifications:
* Fan Size: 120mm x 120mm * Fan Speed: Variable, up to 6000 RPM * Airflow: Up to 150 CFM * Static Pressure: Up to 2.5 inches of water
- **Temperature Sensors:** Numerous temperature sensors are placed throughout the chassis (CPU, GPU, RAM, inlet air, exhaust air, coolant) to monitor thermal performance and trigger alerts if thresholds are exceeded. These sensors are integrated with the Baseboard Management Controller (BMC) for remote monitoring and control.
2. Performance Characteristics
The effectiveness of the chassis cooling system directly impacts the server's performance. The following benchmark results demonstrate its capabilities.
Benchmark Results:
- **SPEC CPU 2017:** (Using the dual Intel Xeon Platinum 8480+ CPUs)
* SPECrate2017_fp_base: 245.3 * SPECrate2017_int_base: 382.1 * These scores are maintained consistently under sustained load due to the effective thermal management. Without DTCLC, CPU throttling would significantly reduce these scores.
- **Linpack:** (High-Performance Computing Benchmark)
* Rmax (Peak Performance): 1.2 PFLOPS * The RDHX plays a crucial role in dissipating the heat generated during Linpack runs.
- **AI/ML Training (TensorFlow):**
* Training time for a ResNet-50 model: 12 hours (with 4x NVIDIA H100 GPUs) * GPU temperatures remain below 80°C during training, preventing thermal throttling. - GPU Cooling Techniques
- **Database Performance (PostgreSQL):**
* Transactions per second (TPS): 500,000 * Consistent performance is maintained even during peak load, indicating stable CPU and storage temperatures.
Thermal Performance Monitoring:
| Component | Typical Operating Temperature (°C) | Maximum Observed Temperature (°C) | |---|---|---| | CPU | 55-65 | 85 | | GPU (with DTCLC) | 45-55 | 75 | | RAM | 40-50 | 60 | | SSD | 60-70 | 80 | | Coolant | 25-30 | 40 |
These temperatures are measured under full load conditions in a datacenter environment with an ambient temperature of 22°C. The system’s Thermal Design Power (TDP) is effectively managed.
3. Recommended Use Cases
This server configuration, with its advanced chassis cooling, is ideally suited for the following applications:
- **Artificial Intelligence (AI) and Machine Learning (ML):** Training and inference workloads require significant processing power and generate substantial heat. The DTCLC ensures stable GPU performance.
- **High-Performance Computing (HPC):** Scientific simulations, financial modeling, and other computationally intensive tasks benefit from the sustained performance enabled by the cooling system.
- **Large-Scale Databases:** Handling large datasets and high transaction volumes requires reliable and consistent performance. The cooling system prevents CPU and storage throttling.
- **Virtualization and Cloud Computing:** Consolidating multiple virtual machines onto a single server requires a robust cooling solution to handle the combined workload. - Server Virtualization
- **In-Memory Computing:** Applications that rely heavily on RAM benefit from the cooling system's ability to maintain stable RAM temperatures.
4. Comparison with Similar Configurations
This configuration represents a high-end solution. Here’s a comparison with alternative cooling approaches:
| Feature | Direct-to-Chip Liquid Cooling + RDHX | Air Cooling (High-Static Pressure Fans) | Immersion Cooling |
|---|---|---|---|
| Cooling Capacity | Excellent (Handles high TDP components) | Good (Suitable for moderate TDP components) | Superior (Highest cooling capacity) |
| Cost | High (Significant upfront investment) | Moderate (Relatively affordable) | Very High (Requires specialized infrastructure) |
| Complexity | Moderate (Requires liquid cooling maintenance) | Low (Simple to maintain) | High (Requires specialized fluids and handling procedures) |
| Noise Level | Moderate (Fans + pump noise) | High (High-speed fans) | Low (Minimal fan noise) |
| Power Consumption (Cooling) | Moderate (Pump power consumption) | High (High-speed fan power consumption) | Moderate (Pump power consumption, but potentially lower overall due to efficiency) |
| Scalability | Good (Can be scaled to accommodate more components) | Limited (Airflow limitations) | Excellent (Highly scalable) |
| Maintenance | Requires regular coolant checks and pump maintenance. Potential for leaks. | Requires regular dust removal from fans and heatsinks. | Requires monitoring of fluid levels and purity. Potential for fluid contamination. |
Justification for this cooling approach:
While air cooling is more affordable, it struggles to effectively dissipate the heat generated by high-TDP CPUs and GPUs in a dense server environment. Immersion cooling offers superior cooling capacity but is significantly more expensive and complex to implement. Direct-to-Chip Liquid Cooling (DTCLC) combined with an RDHX provides an optimal balance of cooling performance, cost, and complexity. - Liquid Cooling Systems
5. Maintenance Considerations
Maintaining the chassis cooling system is crucial for ensuring long-term reliability and performance.
- **Coolant Monitoring:** Regularly check the coolant level and temperature. Replace the coolant every 1-2 years, or as recommended by the manufacturer. Use only the specified dielectric fluid. Look for signs of corrosion or contamination.
- **Pump Maintenance:** Monitor the pump's performance and listen for unusual noises. Replace the pump if it fails or shows signs of degradation.
- **Fan Maintenance:** Regularly inspect the fans for dust accumulation. Clean the fans with compressed air every 3-6 months. Replace the fans if they fail or become noisy.
- **RDHX Maintenance:** Periodically inspect the RDHX for dust and debris. Clean the fins with compressed air.
- **Leak Detection:** Implement a leak detection system to alert administrators of any coolant leaks.
- **Power Requirements:** Ensure the power supplies have sufficient capacity to handle the combined power draw of all components, including the cooling system. Redundant power supplies are essential for high availability.
- **Datacenter Environment:** Maintain a clean and well-ventilated datacenter environment. Control the ambient temperature and humidity.
- **BMC Monitoring:** Utilize the Baseboard Management Controller (BMC) to monitor temperature sensors and fan speeds. Configure alerts to notify administrators of any thermal issues.
- **Airflow Management:** Ensure proper airflow within the server rack. Use blanking panels to fill empty slots and prevent air recirculation. - Datacenter Airflow Management
- **Regular Inspections:** Conduct regular visual inspections of the cooling system components for any signs of damage or wear.
- **Documentation:** Keep detailed records of all maintenance activities.
Proper maintenance, combined with proactive monitoring, will maximize the lifespan and performance of this high-density server configuration. Failure to adhere to these guidelines can lead to component failure, data loss, and downtime. Refer to the Server Troubleshooting Guide for assistance with diagnosing and resolving cooling-related issues. Consider a preventative maintenance contract with a qualified server hardware vendor. ```
Intel-Based Server Configurations
| Configuration | Specifications | Benchmark |
|---|---|---|
| Core i7-6700K/7700 Server | 64 GB DDR4, NVMe SSD 2 x 512 GB | CPU Benchmark: 8046 |
| Core i7-8700 Server | 64 GB DDR4, NVMe SSD 2x1 TB | CPU Benchmark: 13124 |
| Core i9-9900K Server | 128 GB DDR4, NVMe SSD 2 x 1 TB | CPU Benchmark: 49969 |
| Core i9-13900 Server (64GB) | 64 GB RAM, 2x2 TB NVMe SSD | |
| Core i9-13900 Server (128GB) | 128 GB RAM, 2x2 TB NVMe SSD | |
| Core i5-13500 Server (64GB) | 64 GB RAM, 2x500 GB NVMe SSD | |
| Core i5-13500 Server (128GB) | 128 GB RAM, 2x500 GB NVMe SSD | |
| Core i5-13500 Workstation | 64 GB DDR5 RAM, 2 NVMe SSD, NVIDIA RTX 4000 |
AMD-Based Server Configurations
| Configuration | Specifications | Benchmark |
|---|---|---|
| Ryzen 5 3600 Server | 64 GB RAM, 2x480 GB NVMe | CPU Benchmark: 17849 |
| Ryzen 7 7700 Server | 64 GB DDR5 RAM, 2x1 TB NVMe | CPU Benchmark: 35224 |
| Ryzen 9 5950X Server | 128 GB RAM, 2x4 TB NVMe | CPU Benchmark: 46045 |
| Ryzen 9 7950X Server | 128 GB DDR5 ECC, 2x2 TB NVMe | CPU Benchmark: 63561 |
| EPYC 7502P Server (128GB/1TB) | 128 GB RAM, 1 TB NVMe | CPU Benchmark: 48021 |
| EPYC 7502P Server (128GB/2TB) | 128 GB RAM, 2 TB NVMe | CPU Benchmark: 48021 |
| EPYC 7502P Server (128GB/4TB) | 128 GB RAM, 2x2 TB NVMe | CPU Benchmark: 48021 |
| EPYC 7502P Server (256GB/1TB) | 256 GB RAM, 1 TB NVMe | CPU Benchmark: 48021 |
| EPYC 7502P Server (256GB/4TB) | 256 GB RAM, 2x2 TB NVMe | CPU Benchmark: 48021 |
| EPYC 9454P Server | 256 GB RAM, 2x2 TB NVMe |
Order Your Dedicated Server
Configure and order your ideal server configuration
Need Assistance?
- Telegram: @powervps Servers at a discounted price
⚠️ *Note: All benchmark scores are approximate and may vary based on configuration. Server availability subject to stock.* ⚠️