Custom Log Formats

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```mediawiki This is a comprehensive technical documentation article for the server configuration designated as **Template:DocumentationPage**. This configuration represents a high-density, dual-socket system optimized for enterprise virtualization and high-throughput database operations.

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  1. Technical Documentation: Server Configuration Template:DocumentationPage

This document details the hardware specifications, performance metrics, recommended operational profiles, comparative analysis, and required maintenance protocols for the standardized server configuration designated as **Template:DocumentationPage**. This baseline configuration is engineered for maximum platform stability and high-density workload consolidation within enterprise data center environments.

    1. 1. Hardware Specifications

The Template:DocumentationPage utilizes a leading-edge dual-socket motherboard architecture, maximizing the core count while maintaining stringent power efficiency targets. All components are validated for operation within a 40°C ambient temperature range.

      1. 1.1 Core Processing Unit (CPU)

The configuration mandates the use of Intel Xeon Scalable processors (4th Generation, codenamed Sapphire Rapids). The specific SKU selection prioritizes a balance between high core frequency and maximum available PCIe lane count for I/O expansion.

CPU Configuration Details
Parameter Specification Notes
Processor Model Intel Xeon Gold 6438M (Example Baseline) Optimized for memory capacity and moderate core count.
Socket Count 2 Dual-socket configuration.
Base Clock Speed 2.0 GHz Varies based on specific SKU selected.
Max Turbo Frequency Up to 4.0 GHz (Single Core) Dependent on thermal headroom and workload intensity.
Core Count (Total) 32 Cores (64 Threads) per CPU (64 Cores Total) Total logical processors available.
L3 Cache (Total) 120 MB per CPU (240 MB Total) High-speed shared cache for improved data locality.
TDP (Thermal Design Power) 205W per CPU Requires robust cooling solutions; see Section 5.

Further details on CPU microarchitecture and instruction set support can be found in the Sapphire Rapids Technical Overview. The platform supports AMX instructions essential for AI/ML inference workloads.

      1. 1.2 Memory Subsystem (RAM)

The memory configuration is designed for high capacity and high bandwidth, utilizing the maximum supported channels per CPU socket (8 channels per socket, 16 total).

Memory Configuration Details
Parameter Specification Notes
Type DDR5 Registered ECC (RDIMM) Error-correcting code mandatory.
Speed 4800 MT/s Achieves optimal bandwidth for the specified CPU generation.
Capacity (Total) 1024 GB (1 TB) Configured as 16 x 64 GB DIMMs.
Configuration 16 DIMMs (8 per socket) Ensures optimal memory interleaving and performance balance.
Memory Channels Utilized 16 (8 per CPU) Full channel utilization is critical for maximizing memory bandwidth.

The selection of RDIMMs over Load-Reduced DIMMs (LRDIMMs) is based on the requirement to maintain lower latency profiles suitable for transactional databases. Refer to DDR5 Memory Standards for compatibility matrices.

      1. 1.3 Storage Architecture

The storage subsystem balances ultra-fast primary storage with high-capacity archival tiers, utilizing the modern PCIe 5.0 standard for primary NVMe connectivity.

        1. 1.3.1 Primary Boot and OS Volume

| Parameter | Specification | Notes | | :--- | :--- | :--- | | Type | Dual M.2 NVMe SSD (RAID 1) | For operating system and hypervisor installation. | | Capacity | 2 x 960 GB | High endurance, enterprise-grade M.2 devices. | | Interface | PCIe 5.0 x4 | Utilizes dedicated lanes from the CPU/PCH. |

        1. 1.3.2 High-Performance Data Volumes

| Parameter | Specification | Notes | | :--- | :--- | :--- | | Type | U.2 NVMe SSD (RAID 10 Array) | Primary high-IOPS storage pool. | | Capacity | 8 x 3.84 TB | Total raw capacity of 30.72 TB. | | Interface | PCIe 5.0 via dedicated HBA/RAID card | Requires a high-lane count RAID controller (e.g., Broadcom MegaRAID 9750 series). | | Expected IOPS (Random R/W 4K) | > 1,500,000 IOPS | Achievable under optimal conditions. |

        1. 1.3.3 Secondary/Bulk Storage (Optional Expansion)

While not standard for the core template, expansion bays support SAS/SATA SSDs or HDDs for archival or less latency-sensitive data blocks.

      1. 1.4 Networking Interface Controller (NIC)

The Template:DocumentationPage mandates dual-port, high-speed connectivity, leveraging the platform's available PCIe lanes for maximum throughput without relying heavily on the Platform Controller Hub (PCH).

Networking Specifications
Interface Speed Configuration
Primary Uplink (LOM) 2 x 25 GbE (SFP28) Bonded/Teamed for redundancy and aggregate throughput.
Secondary/Management 1 x 1 GbE (RJ-45) Dedicated Out-of-Band (OOB) management (IPMI/BMC).
PCIe Interface PCIe 5.0 x16 Dedicated slot for the 25GbE adapter to minimize latency.

The use of 25GbE is specified to handle the I/O demands generated by the high-performance NVMe storage array. For SAN connectivity, an optional 32Gb Fibre Channel Host Bus Adapter (HBA) can be installed in an available PCIe 5.0 x16 slot.

      1. 1.5 Physical and Power Specifications

The chassis is standardized to a 2U rackmount form factor, ensuring high density while accommodating the thermal requirements of the dual 205W CPUs.

| Parameter | Specification | Notes | | :--- | :--- | :--- | | Form Factor | 2U Rackmount | Standard depth (approx. 750mm). | | Power Supplies (PSU) | 2 x 2000W (1+1 Redundant) | Platinum/Titanium efficiency rating required. | | Max Power Draw (Peak) | ~1400W | Under full CPU load, max memory utilization, and peak storage I/O. | | Cooling | High-Static Pressure Fans (N+1 Redundancy) | Hot-swappable fan modules. | | Operating Temperature Range | 18°C to 27°C (Recommended) | Max operational limit is 40°C ambient. |

This power configuration ensures sufficient headroom for transient power spikes during heavy computation bursts, crucial for maintaining high availability.

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    1. 2. Performance Characteristics

The Template:DocumentationPage configuration is characterized by massive parallel processing capability and extremely low storage latency. Performance validation focuses on key metrics relevant to enterprise workloads: Virtualization density, database transaction rates, and computational throughput.

      1. 2.1 Virtualization Benchmarks (VM Density)

Testing was conducted using a standardized hypervisor (e.g., VMware ESXi 8.x or KVM 6.x) running a mix of 16 vCPU/64 GB RAM virtual machines (VMs) simulating general-purpose enterprise applications (web servers, small application servers).

| Metric | Result | Reference Configuration | Improvement vs. Previous Gen (T:DP-L3) | | :--- | :--- | :--- | :--- | | Max Stable VM Density | 140 VMs | Template:DocumentationPage (1TB RAM) | +28% | | Average VM CPU Ready Time | < 1.5% | Measured over 72 hours | Indicates low CPU contention. | | Memory Allocation Efficiency | 98% | Based on Transparent Page Sharing overhead. | |

The high core count (128 logical processors) and large, fast memory pool enable superior VM consolidation ratios compared to single-socket or lower-core-count systems. This is directly linked to the VM Density Metrics.

      1. 2.2 Database Transaction Performance (OLTP)

For transactional workloads (Online Transaction Processing), the primary limiting factor is often the latency between the CPU and the storage array. The PCIe 5.0 NVMe pool delivers exceptional results.

    • TPC-C Benchmark Simulation (10,000 Virtual Users):**
  • **Transactions Per Minute (TPM):** 850,000 TPM (Sustained)
  • **Average Latency:** 1.2 ms (99th Percentile)

This performance is heavily reliant on the 240MB of L3 cache working seamlessly with the high-speed storage. Any degradation in RAID card firmware can cause significant performance degradation.

      1. 2.3 Computational Throughput (HPC/AI Inference)

While not strictly an HPC node, the Sapphire Rapids architecture offers significant acceleration for matrix operations.

| Workload Type | Metric | Result | Notes | | :--- | :--- | :--- | :--- | | Floating Point (FP64) | TFLOPS (Theoretical Peak) | ~4.5 TFLOPS | Achievable with optimized AVX-512/AMX code paths. | | AI Inference (INT8) | Inferences/Second | ~45,000 | Using optimized inference engines leveraging AMX. | | Memory Bandwidth (Sustained) | GB/s | ~350 GB/s | Measured using STREAM benchmark tools. |

The sustained memory bandwidth (350 GB/s) is a critical performance gate for memory-bound applications, confirming the efficiency of the 16-channel DDR5 configuration. See Memory Bandwidth Analysis for detailed scaling curves.

      1. 2.4 Power Efficiency Profile

Power efficiency is measured in Transactions Per Watt (TPW) for database workloads or VMs per Watt (V/W) for virtualization.

  • **VMs per Watt:** 2.15 V/W (Under 70% sustained load)
  • **TPW:** 1.15 TPM/Watt

These figures are competitive for a system utilizing 205W CPUs, demonstrating the generational leap in server power efficiency provided by the platform's architecture.

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    1. 3. Recommended Use Cases

The Template:DocumentationPage is specifically architected to excel in scenarios demanding high I/O throughput, large memory capacity, and substantial core density within a single physical footprint.

      1. 3.1 Enterprise Virtualization Hosts (Hyper-Converged Infrastructure - HCI)

This configuration is the ideal candidate for the foundational layer of an HCI cluster. The combination of high core count (for VM scheduling) and 1TB of RAM allows for the maximum consolidation of application workloads while maintaining strict Quality of Service (QoS) guarantees for individual VMs.

  • **Requirement:** Hosting 100+ general-purpose VMs or 30+ resource-intensive, memory-heavy VMs (e.g., large Java application servers).
  • **Benefit:** Reduced rack space utilization compared to deploying multiple smaller servers.
      1. 3.2 High-Performance Database Servers (OLTP/OLAP Hybrid)

For environments requiring both fast online transaction processing (OLTP) and moderate analytical query processing (OLAP), this template offers a compelling solution.

  • **OLTP Focus:** The NVMe RAID 10 array provides the sub-millisecond latency essential for high-volume transactional databases (e.g., SAP HANA, Microsoft SQL Server).
  • **OLAP Focus:** The 240MB L3 cache and 1TB RAM minimize disk reads during complex joins and aggregations.
      1. 3.3 Mission-Critical Application Servers

Applications requiring large working sets to reside entirely in RAM (in-memory caching layers, large application sessions) benefit significantly from the 1TB capacity.

  • **Examples:** Large Redis caches, high-volume transaction processing middleware, or high-speed message queues (e.g., Apache Kafka brokers).
      1. 3.4 Container Orchestration Management Nodes

While compute nodes handle containerized workloads, the Template:DocumentationPage serves excellently as a management plane node (e.g., Kubernetes master nodes or control planes) where high resource availability and rapid response times are paramount for cluster stability.

      1. 3.5 Workloads to Avoid

This configuration is generally **not** optimal for:

1. **Extreme HPC (FP64 Only):** Systems requiring maximum raw FP64 compute density should prioritize GPUs or specialized SKUs with higher clock speeds and lower TDPs, sacrificing RAM capacity. (See HPC Node Configuration Guide). 2. **Low-Density, Low-Utilization Servers:** Deploying this powerful system to run a single, low-utilization service is fiscally inefficient. Server Right-Sizing must be performed first.

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    1. 4. Comparison with Similar Configurations

To contextualize the Template:DocumentationPage (T:DP), we compare it against two common alternatives: a higher-density, lower-memory configuration (T:DP-Lite) and a maximum-memory, lower-core-count configuration (T:DP-MaxMem).

      1. 4.1 Comparative Specification Matrix

This table highlights the key trade-offs inherent in the T:DP configuration.

Configuration Comparison Matrix
Feature Template:DocumentationPage (T:DP) T:DP-Lite (High Density Compute) T:DP-MaxMem (Max Capacity)
CPU Model (Example) Gold 6438M (2x32C) Gold 6448Y (2x48C) Gold 5420 (2x16C)
Total Cores/Threads 64C / 128T 96C / 192T 32C / 64T
Total RAM Capacity 1024 GB (DDR5-4800) 512 GB (DDR5-4800) 2048 GB (DDR5-4000)
Primary Storage Speed PCIe 5.0 NVMe RAID 10 PCIe 5.0 NVMe RAID 10 PCIe 4.0 SATA/SAS SSDs
Memory Bandwidth (Approx.) 350 GB/s 250 GB/s 280 GB/s (Slower DIMMs)
Typical TDP Envelope ~410W (CPU only) ~550W (CPU only) ~300W (CPU only)
Ideal Workload Balanced Virtualization/DB High-Concurrency Web/HPC Large In-Memory Caching/Analytics
      1. 4.2 Performance Trade-Off Analysis

The T:DP configuration strikes the optimal balance:

1. **Vs. T:DP-Lite (Higher Core Count):** T:DP-Lite offers 50% more cores, making it superior for massive parallelization where memory access latency is less critical than sheer thread count. However, T:DP offers 100% more RAM capacity and higher individual core clock speeds (due to lower thermal loading on the 64-core CPUs vs. 48-core SKUs), making T:DP better for applications that require large memory footprints *per thread*. 2. **Vs. T:DP-MaxMem (Higher Capacity):** T:DP-MaxMem prioritizes raw memory capacity (2TB) but must compromise on CPU performance (lower core count, potentially slower DDR5 speed grading) and storage speed (often forced to use older PCIe generations or slower SAS interfaces to support the density of memory modules). T:DP is significantly faster for transactional workloads due to superior CPU and storage I/O.

The selection of 1TB of DDR5-4800 memory in the T:DP template represents the current sweet spot for maximizing application responsiveness without incurring the premium cost and potential latency penalties associated with the 2TB memory configurations.

      1. 4.3 Cost-Performance Index (CPI)

Evaluating the relative cost efficiency (assuming normalized component costs):

  • **T:DP-Lite:** CPI Index: 0.95 (Slightly better compute/$ due to higher core density at lower price point).
  • **Template:DocumentationPage (T:DP):** CPI Index: 1.00 (Baseline efficiency).
  • **T:DP-MaxMem:** CPI Index: 0.80 (Lower efficiency due to high cost of maximum capacity memory).

This analysis confirms that the T:DP configuration provides the most predictable and robust performance return on investment for general enterprise deployment.

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    1. 5. Maintenance Considerations

Proper maintenance is essential to ensure the longevity and sustained performance of the Template:DocumentationPage hardware, particularly given the high thermal density and reliance on high-speed interconnects.

      1. 5.1 Thermal Management and Airflow

The dual 205W CPUs generate significant heat, demanding precise environmental control within the rack.

  • **Minimum Airflow Requirement:** The chassis requires a minimum sustained front-to-back airflow rate of 120 CFM (Cubic Feet per Minute) across the components.
  • **Rack Density:** Due to the 1400W peak draw, these servers must be spaced appropriately within the rack cabinet. A maximum density of 42 units per standard 42U rack is recommended, requiring hot aisle containment or equivalent high-efficiency cooling infrastructure.
  • **Component Monitoring:** Continuous monitoring of the **CPU TjMax** (Maximum Junction Temperature) via the Baseboard Management Controller (BMC) is required. Any sustained temperature exceeding 85°C under load necessitates immediate thermal inspection.
      1. 5.2 Power and Redundancy

The dual 2000W Platinum/Titanium PSUs are designed for 1+1 redundancy.

  • **Power Distribution Unit (PDU) Requirements:** Each server must be connected to two independent PDUs drawing from separate power feeds (A-Side and B-Side). The total sustained load (typically 800-1000W) should not exceed 60% capacity of the PDU circuit breaker to allow for inrush current during startup or load balancing events.
  • **Firmware Updates:** BMC firmware updates must be prioritized, as new versions often include critical power management optimizations that affect transient load handling. Consult the Firmware Update Schedule.
      1. 5.3 Storage Array Health and Longevity

The high-IOPS NVMe configuration requires proactive monitoring of drive health statistics.

  • **Wear Leveling:** Monitor the **Percentage Used Endurance Indicator** (P-UEI) on all U.2 NVMe drives. Drives approaching 80% usage should be scheduled for replacement during the next maintenance window to prevent unexpected failure in the RAID 10 array.
  • **RAID Controller Cache:** Ensure the Battery Backup Unit (BBU) or Capacitor Discharge Unit (CDU) for the RAID controller is fully functional and reporting "OK" status. Loss of cache power during a write operation on this high-speed array could lead to data loss even with RAID redundancy. Refer to RAID Controller Best Practices.
      1. 5.4 Operating System and Driver Patching

The platform relies heavily on specific, validated drivers for optimal PCIe 5.0 performance.

  • **Critical Drivers:** Always ensure the latest validated drivers for the Platform Chipset, NVMe controller, and Network Interface Controller (NIC) are installed. Outdated storage drivers are the leading cause of unexpected performance degradation in this configuration.
  • **BIOS/UEFI:** Maintain the latest stable BIOS/UEFI version. Updates frequently address memory training issues and CPU power state management, which directly impact performance stability across virtualization loads.
      1. 5.5 Component Replacement Procedures

All major components are designed for hot-swapping where possible, though certain procedures require system shutdown.

Component Hot-Swap Capability
Component Hot-Swappable? Required Action
Fan Module Yes Ensure replacement fan matches speed/firmware profile.
Power Supply Unit (PSU) Yes Wait 5 minutes after removing failed unit before inserting new one to allow power sequencing.
Memory (DIMM) No System must be powered off and fully discharged.
NVMe SSD (U.2) Yes (If RAID level supports failure) Must verify RAID array rebuild status immediately post-replacement.

Adherence to these maintenance guidelines ensures the Template:DocumentationPage configuration operates at peak efficiency throughout its expected lifecycle of 5-7 years. Further operational procedures are detailed in the Server Operations Manual.


Intel-Based Server Configurations

Configuration Specifications Benchmark
Core i7-6700K/7700 Server 64 GB DDR4, NVMe SSD 2 x 512 GB CPU Benchmark: 8046
Core i7-8700 Server 64 GB DDR4, NVMe SSD 2x1 TB CPU Benchmark: 13124
Core i9-9900K Server 128 GB DDR4, NVMe SSD 2 x 1 TB CPU Benchmark: 49969
Core i9-13900 Server (64GB) 64 GB RAM, 2x2 TB NVMe SSD
Core i9-13900 Server (128GB) 128 GB RAM, 2x2 TB NVMe SSD
Core i5-13500 Server (64GB) 64 GB RAM, 2x500 GB NVMe SSD
Core i5-13500 Server (128GB) 128 GB RAM, 2x500 GB NVMe SSD
Core i5-13500 Workstation 64 GB DDR5 RAM, 2 NVMe SSD, NVIDIA RTX 4000

AMD-Based Server Configurations

Configuration Specifications Benchmark
Ryzen 5 3600 Server 64 GB RAM, 2x480 GB NVMe CPU Benchmark: 17849
Ryzen 7 7700 Server 64 GB DDR5 RAM, 2x1 TB NVMe CPU Benchmark: 35224
Ryzen 9 5950X Server 128 GB RAM, 2x4 TB NVMe CPU Benchmark: 46045
Ryzen 9 7950X Server 128 GB DDR5 ECC, 2x2 TB NVMe CPU Benchmark: 63561
EPYC 7502P Server (128GB/1TB) 128 GB RAM, 1 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (128GB/2TB) 128 GB RAM, 2 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (128GB/4TB) 128 GB RAM, 2x2 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (256GB/1TB) 256 GB RAM, 1 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (256GB/4TB) 256 GB RAM, 2x2 TB NVMe CPU Benchmark: 48021
EPYC 9454P Server 256 GB RAM, 2x2 TB NVMe

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⚠️ *Note: All benchmark scores are approximate and may vary based on configuration. Server availability subject to stock.* ⚠️ Template:ConfigurationTitle

This document details the "Custom Log Formats" server configuration, a specialized setup optimized for high-volume, highly-structured log data processing and analysis. This configuration isn't focused on raw compute power, but rather on the efficient capture, parsing, and forwarding of log data generated by a diverse range of applications. It’s designed to be a central logging aggregation point, not a primary application server. The core concept is to minimize CPU load during log *capture* and maximize efficiency in log *formatting* and *transmission*.

1. Hardware Specifications

This configuration prioritizes I/O speed and reliability over absolute CPU core count. The goal is to ensure no log data is lost, even during peak loads.

Component Specification Details
CPU Dual Intel Xeon Silver 4310 (12 Cores/24 Threads per CPU) Base Clock: 2.1 GHz, Boost Clock: 3.3 GHz, Total Cores: 24, Total Threads: 48, Cache: 18.75MB L3 Cache per CPU, TDP: 120W
RAM 128 GB DDR4 ECC Registered 3200MHz Configuration: 8 x 16GB modules. ECC Registered ensures data integrity. 3200MHz provides a balance between cost and performance. Buffered DIMMs are used for stability with this CPU platform. Memory Subsystem
Storage (OS) 500GB NVMe PCIe Gen4 x4 SSD Samsung 980 Pro. Used for the operating system and logging software (e.g., rsyslog, Fluentd). The high speed NVMe drive reduces OS latency and improves overall system responsiveness. Solid State Drives
Storage (Log Storage - Tier 1) 2 x 4TB NVMe PCIe Gen4 x4 SSD (RAID 1) Samsung 990 Pro. This is the primary landing zone for incoming logs. RAID 1 provides redundancy, preventing data loss in case of a drive failure. High IOPS and low latency are critical here. RAID Configurations
Storage (Log Storage - Tier 2) 8 x 16TB SAS 7.2K RPM HDD (RAID 6) Seagate Exos X16. Used for longer-term log storage. RAID 6 offers good redundancy and capacity. While slower than SSDs, the larger capacity is cost-effective for archival. Hard Disk Drives
Network Interface Dual 10 Gigabit Ethernet (10GbE) Intel X710-DA4. Teaming is configured for redundancy and increased bandwidth. This is crucial for transmitting logs to central analysis systems. Network Interface Cards
Motherboard Supermicro X12DPG-QT6 Supports Dual Intel Xeon Scalable Processors, 16 DDR4 DIMM slots, multiple PCIe slots for storage and networking. Server Motherboards
Power Supply 1200W Redundant Power Supplies (80+ Platinum) Provides ample power for all components and ensures high availability. Redundancy is crucial for uptime. Power Supply Units
Chassis 4U Rackmount Server Chassis Supermicro 847E16-R1200B. Designed for optimal airflow and cooling. Server Chassis
RAID Controller Broadcom MegaRAID SAS 9300-8i Hardware RAID controller for managing RAID arrays. Offers better performance and reliability than software RAID. RAID Controllers

2. Performance Characteristics

The performance of this configuration isn't measured in traditional terms like FLOPS or core-specific benchmarks. Instead, we focus on log ingestion rates and formatting overhead.

  • Log Ingestion Rate: Under sustained load, this configuration can handle up to 200,000 log messages per second (LPS) with an average message size of 1KB, using rsyslog with optimized configuration. This figure is dependent on log format complexity and network bandwidth. Log Aggregation
  • CPU Utilization: During peak log ingestion, CPU utilization typically remains below 30% due to the efficient handling of log data by the logging software and the fast storage system.
  • Disk I/O: The NVMe RAID 1 array achieves over 300,000 IOPS (Input/Output Operations Per Second) for read/write operations, ensuring that log data is written to disk without bottlenecks.
  • Network Throughput: The dual 10GbE interfaces provide a combined bandwidth of 20 Gbps, ensuring that logs can be transmitted to external systems without congestion.
  • Benchmarking Tools: We utilize tools like `syslog-ng`'s benchmarking utility and `rsyslog`'s performance monitoring features to measure log ingestion rates and identify potential bottlenecks. `iperf3` is used to assess network throughput. Performance Monitoring Tools
Benchmark Metric Result
rsyslog Ingestion Rate (1KB messages) Logs Per Second (LPS) 200,000+
NVMe RAID 1 - Sequential Read MB/s 7,000+
NVMe RAID 1 - Sequential Write MB/s 6,000+
NVMe RAID 1 - Random 4K Read IOPS 350,000+
NVMe RAID 1 - Random 4K Write IOPS 300,000+
10GbE Network Throughput Gbps 18+ (with teaming overhead)

Real-world performance will vary depending on the complexity of the log formats, the amount of data being logged, and the network conditions. Proper tuning of the logging software is essential for maximizing performance.

3. Recommended Use Cases

This configuration is ideal for the following scenarios:

  • Centralized Logging Server: Consolidating logs from multiple servers and applications into a single, manageable location. This provides a single point of access for troubleshooting and security analysis. Centralized Logging
  • Security Information and Event Management (SIEM): Providing a high-volume log source for SIEM systems like Splunk, Elastic Stack (ELK), or QRadar. The structured log formats facilitate efficient searching and analysis. SIEM Systems
  • Compliance Logging: Meeting compliance requirements that mandate detailed log retention and analysis (e.g., PCI DSS, HIPAA, GDPR). The reliable storage and data integrity features ensure that logs are available for audits. Compliance Regulations
  • Application Performance Monitoring (APM): Capturing application logs for performance analysis and troubleshooting. Custom log formats can include application-specific metrics and timestamps. Application Performance Monitoring
  • Network Monitoring: Collecting network device logs (routers, switches, firewalls) for security monitoring and network performance analysis. Network Monitoring Tools
  • Cloud Infrastructure Logging: Aggregating logs from cloud environments (AWS, Azure, GCP) into a central location for unified analysis. Cloud Logging

4. Comparison with Similar Configurations

Here's a comparison with alternative configurations:

Configuration CPU RAM Storage (Tier 1) Storage (Tier 2) Network Cost (approx.) Use Case
**Custom Log Formats (This Config)** Dual Xeon Silver 4310 128GB DDR4 2 x 4TB NVMe (RAID 1) 8 x 16TB SAS (RAID 6) Dual 10GbE $8,000 - $10,000 High-volume, structured logging, SIEM integration
**High-Compute Server** Dual Xeon Gold 6338 256GB DDR4 1 x 1TB NVMe 4 x 8TB SAS (RAID 5) Single 1GbE $12,000 - $15,000 Application server, database server. Less optimized for logging.
**Budget Logging Server** Single Xeon E-2336 64GB DDR4 1 x 2TB SATA SSD 4 x 8TB SATA HDD (RAID 5) Single 1GbE $4,000 - $6,000 Small-scale logging, development environments. Lower performance and reliability.
**All-Flash Logging Server** Dual Xeon Silver 4310 128GB DDR4 4 x 4TB NVMe (RAID 10) None Dual 10GbE $12,000 - $15,000 Extremely high performance, but higher cost and lower storage capacity. Suitable for very specific, high-throughput logging needs.

The "Custom Log Formats" configuration strikes a balance between performance, reliability, and cost. It offers significantly higher log ingestion rates than the "Budget Logging Server" while being more cost-effective than the "All-Flash Logging Server". It prioritizes I/O and network performance over raw compute power, making it ideal for its intended purpose. Compared to the "High-Compute Server," it's specifically designed for log handling, offering better I/O and network capabilities for that task.

5. Maintenance Considerations

Maintaining this configuration requires attention to several key areas:

  • Cooling: The server generates significant heat due to the dual CPUs and high-performance storage. Proper airflow within the server chassis and adequate data center cooling are essential. Monitoring CPU and drive temperatures is crucial. Server Cooling
  • Power Requirements: The 1200W redundant power supplies provide ample power, but the server should be connected to a dedicated power circuit to prevent overloads. Monitoring power consumption is recommended. Power Management
  • Storage Monitoring: Regularly monitor the health of the SSDs and HDDs using SMART monitoring tools. Replace failing drives promptly to maintain data integrity and prevent data loss. Storage Monitoring Tools
  • Log Rotation and Archiving: Implement a robust log rotation and archiving strategy to prevent disk space exhaustion. Consider using tools like `logrotate` or built-in features of your logging software. Log Rotation
  • Software Updates: Keep the operating system and logging software up to date with the latest security patches and bug fixes. System Updates
  • Network Monitoring: Monitor network bandwidth utilization to ensure that logs are being transmitted efficiently. Investigate any network congestion or packet loss. Network Performance Monitoring
  • RAID Maintenance: Periodically check the status of the RAID arrays and ensure that redundancy is maintained. Test the failover process to verify that the system can handle a drive failure gracefully. RAID Maintenance
  • Security Hardening: Secure the server against unauthorized access by implementing strong passwords, firewall rules, and intrusion detection systems. Server Security
  • Regular Backups: Although RAID provides redundancy, it's *not* a substitute for backups. Implement a regular backup strategy to protect against catastrophic failures. Data Backup and Recovery
  • Capacity Planning: Continuously monitor log volume growth and adjust storage capacity accordingly. Plan for future expansion to accommodate increasing log data. Capacity Planning
  • Log Format Validation: Regularly validate that the custom log formats are being correctly parsed and interpreted by downstream systems. Make adjustments if necessary. Log Parsing
  • Time Synchronization: Accurate time synchronization is critical for correlating logs from multiple sources. Use NTP or a similar protocol to ensure that all servers are synchronized. Network Time Protocol
  • Logging Software Tuning: Continuously tune the logging software (rsyslog, Fluentd, etc.) to optimize performance and resource utilization. rsyslog Configuration Fluentd Configuration
  • Alerting: Configure alerts to notify administrators of critical events, such as disk failures, network outages, or high CPU utilization. System Alerting
  • Documentation: Maintain detailed documentation of the server configuration, including the custom log formats, storage layout, and maintenance procedures. Server Documentation
  1. Template:DocumentationFooter: High-Density Compute Node (HDCN-v4.2)

This technical documentation details the specifications, performance characteristics, recommended applications, comparative analysis, and maintenance requirements for the **Template:DocumentationFooter** server configuration, hereafter referred to as the High-Density Compute Node, version 4.2 (HDCN-v4.2). This configuration is optimized for virtualization density, large-scale in-memory processing, and demanding HPC workloads requiring extreme thread density and high-speed interconnectivity.

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    1. 1. Hardware Specifications

The HDCN-v4.2 is built upon a dual-socket, 4U rackmount chassis designed for maximum component density while adhering to strict thermal dissipation standards. The core philosophy of this design emphasizes high core count, massive RAM capacity, and low-latency storage access.

      1. 1.1. System Board and Chassis

The foundation of the HDCN-v4.2 is the proprietary Quasar-X1000 motherboard, utilizing the latest generation server chipset architecture.

HDCN-v4.2 Base Platform Specifications
Component Specification
Chassis Form Factor 4U Rackmount (EIA-310 compliant)
Motherboard Model Quasar-X1000 Dual-Socket Platform
Chipset Architecture Dual-Socket Server Platform with UPI 2.0/Infinity Fabric Link
Maximum Power Delivery (PSU) 3000W (3+1 Redundant, Titanium Efficiency)
Cooling System Direct-to-Chip Liquid Cooling Ready (Optional Air Cooling Available)
Expansion Slots (Total) 8x PCIe 5.0 x16 slots (Full Height, Full Length)
Integrated Networking 2x 100GbE (QSFP56-DD) and 1x OCP 3.0 Slot (Configurable)
Management Controller BMC 4.0 with Redfish API Support
      1. 1.2. Central Processing Units (CPUs)

The HDCN-v4.2 mandates the use of high-core-count, low-latency processors optimized for multi-threaded workloads. The standard configuration specifies two processors configured for maximum core density and memory bandwidth utilization.

HDCN-v4.2 CPU Configuration
Parameter Specification (Per Socket)
Processor Model (Standard) Intel Xeon Scalable (Sapphire Rapids-EP equivalent) / AMD EPYC Genoa equivalent
Core Count (Nominal) 64 Cores / 128 Threads (Minimum)
Maximum Core Count Supported 96 Cores / 192 Threads
Base Clock Frequency 2.4 GHz
Max Turbo Frequency (Single Thread) Up to 3.8 GHz
L3 Cache (Total Per CPU) 128 MB
Thermal Design Power (TDP) 350W (Nominal)
Memory Channels Supported 8 Channels DDR5 (Per Socket)

The selection of processors must be validated against the Dynamic Power Management Policy (DPMP) governing the specific data center deployment. Careful consideration must be given to NUMA Architecture topology when configuring related operating system kernel tuning.

      1. 1.3. Memory Subsystem

This configuration is designed for memory-intensive applications, supporting the highest available density and speed for DDR5 ECC Registered DIMMs (RDIMMs).

HDCN-v4.2 Memory Configuration
Parameter Specification
Total DIMM Slots 32 (16 per CPU)
Maximum Capacity 8 TB (Using 256GB LRDIMMs, if supported by BIOS revision)
Standard Configuration (Density Focus) 2 TB (Using 64GB DDR5-4800 RDIMMs, 32 DIMMs populated)
Memory Type Supported DDR5 ECC RDIMM / LRDIMM
Memory Bandwidth (Theoretical Max) ~1.2 TB/s Aggregate
Memory Speed (Standard) DDR5-5600 MHz (All channels populated at JEDEC standard)
Memory Mirroring/Lockstep Support Yes, configurable via BIOS settings.

It is critical to adhere to the DIMM Population Guidelines to maintain optimal memory interleaving and avoid performance degradation associated with uneven channel loading.

      1. 1.4. Storage Subsystem

The HDCN-v4.2 prioritizes ultra-low latency storage access, typically utilizing NVMe SSDs connected directly via PCIe lanes to bypass traditional HBA bottlenecks.

HDCN-v4.2 Storage Configuration
Location/Type Quantity (Standard) Interface/Throughput
Front Bay U.2 NVMe (Hot-Swap) 8 Drives PCIe 5.0 x4 per drive (Up to 14 GB/s aggregate)
Internal M.2 Boot Drives (OS/Hypervisor) 2 Drives (Mirrored) PCIe 4.0 x4
Storage Controller Software RAID (OS Managed) or Optional Hardware RAID Card (Requires 1x PCIe Slot)
Maximum Raw Capacity 640 TB (Using 80TB U.2 NVMe drives)

For high-throughput applications, the use of NVMe over Fabrics (NVMe-oF) is recommended over local storage arrays, leveraging the high-speed 100GbE adapters.

      1. 1.5. Accelerators and I/O Expansion

The dense PCIe layout allows for significant expansion, crucial for AI/ML, advanced data analytics, or specialized network processing.

HDCN-v4.2 I/O Capabilities
Slot Type Count Max Power Draw per Slot
PCIe 5.0 x16 (FHFL) 8 400W (Requires direct PSU connection)
OCP 3.0 Slot 1 NIC/Storage Adapter
Total Available PCIe Lanes (CPU Dependent) 160 Lanes (Typical Configuration)

The system supports dual-width, passively cooled accelerators, requiring the advanced liquid cooling option for sustained peak performance, as detailed in Thermal Management Protocols.

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    1. 2. Performance Characteristics

The HDCN-v4.2 exhibits performance characteristics defined by its high thread count and superior memory bandwidth. Benchmarks are standardized against previous generation dual-socket systems (HDCN-v3.1).

      1. 2.1. Synthetic Benchmarks

Performance metrics are aggregated across standardized tests simulating heavy computational load across all available CPU cores and memory channels.

Synthetic Performance Comparison (Relative to HDCN-v3.1 Baseline = 100)
Benchmark Category HDCN-v3.1 (Baseline) HDCN-v4.2 (Standard Configuration) Performance Uplift (%)
SPECrate 2017 Integer (Multi-Threaded) 100 195 +95%
STREAM Triad (Memory Bandwidth) 100 170 +70%
IOPS (4K Random Read - Local NVMe) 100 155 +55%
Floating Point Operations (HPL Simulation) 100 210 (Due to AVX-512/AMX enhancement) +110%

The substantial uplift in Floating Point Operations is directly attributable to the architectural improvements in **Vector Processing Units (VPUs)** and specialized AI accelerator instructions supported by the newer CPU generation.

      1. 2.2. Virtualization Density Metrics

When deployed as a hypervisor host (e.g., running VMware ESXi or KVM Hypervisor), the HDCN-v4.2 excels in maximizing Virtual Machine (VM) consolidation ratios while maintaining acceptable Quality of Service (QoS).

  • **vCPU to Physical Core Ratio:** Recommended maximum ratio is **6:1** for general-purpose workloads and **4:1** for latency-sensitive applications. This allows for hosting up to 768 virtual threads reliably.
  • **Memory Oversubscription:** Due to the 2TB standard configuration, memory oversubscription rates of up to 1.5x are permissible for burstable workloads, though careful monitoring of Page Table Management overhead is required.
  • **Network Latency:** End-to-end latency across the integrated 100GbE ports averages **2.1 microseconds (µs)** under 60% load, which is critical for distributed database synchronization.
      1. 2.3. Power Efficiency (Performance per Watt)

Despite the high TDP of individual components, the architectural efficiency gains result in superior performance per watt compared to previous generations.

  • **Peak Power Draw (Fully Loaded):** Approximately 2,800W (with 8x mid-range GPUs or 4x high-end accelerators).
  • **Idle Power Draw:** Under minimal load (OS running, no active tasks), the system maintains a draw of **~280W**, significantly lower than the 450W baseline of the HDCN-v3.1.
  • **Performance/Watt Ratio:** Achieves a **68% improvement** in computational throughput per kilowatt-hour utilized compared to the HDCN-v3.0 platform, directly impacting Data Center Operational Expenses.

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    1. 3. Recommended Use Cases

The HDCN-v4.2 configuration is not intended for low-density, general-purpose web serving. Its high cost and specialized requirements dictate deployment in environments where maximizing resource density and raw computational throughput is paramount.

      1. 3.1. High-Performance Computing (HPC) and Scientific Simulation

The combination of high core count, massive memory bandwidth, and support for high-speed interconnects (via PCIe 5.0 lanes dedicated to InfiniBand/Omni-Path adapters) makes it ideal for tightly coupled simulations.

  • **Molecular Dynamics (MD):** Excellent throughput for force calculations across large datasets residing in memory.
  • **Computational Fluid Dynamics (CFD):** Effective use of high core counts for grid calculations, especially when coupled with GPU accelerators for matrix operations.
  • **Weather Modeling:** Supports large global grids requiring substantial L3 cache residency.
      1. 3.2. Large-Scale Data Analytics and In-Memory Databases

Systems requiring rapid access to multi-terabyte datasets benefit immensely from the 2TB+ memory capacity and the low-latency NVMe storage tier.

  • **In-Memory OLTP Databases (e.g., SAP HANA):** The configuration meets or exceeds the requirements for Tier-1 SAP HANA deployments requiring rapid transactional processing across large tables.
  • **Big Data Processing (Spark/Presto):** High core counts accelerate job execution times by allowing more executors to run concurrently within the host environment.
  • **Real-Time Fraud Detection:** Low I/O latency is crucial for scoring transactions against massive feature stores held in RAM.
      1. 3.3. Deep Learning Training (Hybrid CPU/GPU)

While specialized GPU servers exist, the HDCN-v4.2 excels in scenarios where the CPU must manage significant data preprocessing, feature engineering, or complex model orchestration alongside the accelerators.

  • **Data Preprocessing Pipelines:** The high core count accelerates ETL tasks required before GPU ingestion.
  • **Model Serving (High Throughput):** When serving large language models (LLMs) where the model weights must be swapped rapidly between system memory and accelerator VRAM, the high aggregate memory bandwidth is a decisive factor.
      1. 3.4. Dense Virtual Desktop Infrastructure (VDI)

For VDI deployments targeting knowledge workers (requiring 4-8 vCPUs and 16-32 GB RAM per user), the HDCN-v4.2 allows for consolidation ratios exceeding typical enterprise averages, reducing the overall physical footprint required for large user populations. This requires careful adherence to the VDI Resource Allocation Guidelines.

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    1. 4. Comparison with Similar Configurations

To contextualize the HDCN-v4.2, it is compared against two common alternative server configurations: the High-Frequency Workstation (HFW-v2.1) and the Standard 2U Dual-Socket Server (SDS-v5.0).

      1. 4.1. Configuration Profiles

| Feature | HDCN-v4.2 (Focus: Density/Bandwidth) | SDS-v5.0 (Focus: Balance/Standardization) | HFW-v2.1 (Focus: Single-Thread Speed) | | :--- | :--- | :--- | :--- | | **Chassis Size** | 4U | 2U | 2U (Tower/Rack Convertible) | | **Max Cores (Total)** | 192 (2x 96-core) | 128 (2x 64-core) | 64 (2x 32-core) | | **Max RAM Capacity** | 8 TB | 4 TB | 2 TB | | **Primary PCIe Gen** | PCIe 5.0 | PCIe 4.0 | PCIe 5.0 | | **Storage Bays** | 8x U.2 NVMe | 12x 2.5" SAS/SATA | 4x M.2/U.2 | | **Power Delivery** | 3000W Redundant | 2000W Redundant | 1600W Standard | | **Interconnect Support** | Native 100GbE + OCP 3.0 | 25/50GbE Standard | 10GbE Standard |

      1. 4.2. Performance Trade-offs Analysis

The comparison highlights the specific trade-offs inherent in choosing the HDCN-v4.2.

Performance Trade-off Matrix
Metric HDCN-v4.2 Advantage HDCN-v4.2 Disadvantage
Aggregate Throughput (Total Cores) Highest in class (192 Threads) Higher idle power consumption than SDS-v5.0
Single-Thread Performance Lower peak frequency than HFW-v2.1 Requires workload parallelization for efficiency
Memory Bandwidth Superior (DDR5 8-channel per CPU) Higher cost per GB of installed RAM
Storage I/O Latency Excellent (Direct PCIe 5.0 NVMe access) Fewer total drive bays than SDS-v5.0 (if SAS/SATA is required)
Rack Density (Compute $/U) Excellent Poorer Cooling efficiency under air-cooling scenarios

The decision to deploy HDCN-v4.2 over the SDS-v5.0 is justified when the application scaling factor exceeds the 1.5x core count increase and requires PCIe 5.0 or memory capacities exceeding 4TB. Conversely, the HFW-v2.1 configuration is preferred for legacy applications sensitive to clock speed rather than thread count, as detailed in CPU Microarchitecture Selection.

      1. 4.3. Cost of Ownership (TCO) Implications

While the initial Capital Expenditure (CapEx) for the HDCN-v4.2 is significantly higher (estimated 30-40% premium over SDS-v5.0), the reduced Operational Expenditure (OpEx) derived from superior rack density and improved performance-per-watt can yield a lower Total Cost of Ownership (TCO) over a five-year lifecycle for high-utilization environments. Detailed TCO modeling must account for Data Center Power Utilization Effectiveness (PUE) metrics.

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    1. 5. Maintenance Considerations

The high component density and reliance on advanced interconnects necessitate stringent maintenance protocols, particularly concerning thermal management and firmware updates.

      1. 5.1. Thermal Management and Cooling Requirements

The 350W TDP CPUs and potential high-power PCIe accelerators generate substantial heat flux, requiring specialized cooling infrastructure.

  • **Air Cooling (Minimum Requirement):** Requires a minimum sustained airflow of **120 CFM** across the chassis with inlet temperatures not exceeding **22°C (71.6°F)**. Standard 1000W PSU configurations are insufficient when utilizing more than two high-TDP accelerators.
  • **Liquid Cooling (Recommended):** For sustained peak performance (above 80% utilization for more than 4 hours), the optional Direct-to-Chip (D2C) liquid cooling loop is mandatory. This requires integration with the facility's Chilled Water Loop Infrastructure.
   *   *Coolant Flow Rate:* Minimum 1.5 L/min per CPU block.
   *   *Coolant Temperature:* Must be maintained between 18°C and 25°C.

Failure to adhere to thermal guidelines will trigger automatic frequency throttling via the BMC, resulting in CPU clock speeds dropping below 1.8 GHz, effectively negating the performance benefits of the configuration. Refer to Thermal Throttling Thresholds for specific sensor readings.

      1. 5.2. Power Delivery and Redundancy

The 3000W Titanium-rated PSUs are designed for N+1 redundancy.

  • **Power Draw Profile:** The system exhibits a high inrush current during cold boot due to the large capacitance required by the DDR5 memory channels and numerous NVMe devices. Power Sequencing Protocols must be strictly followed when bringing up racks containing more than 10 HDCN-v4.2 units simultaneously.
  • **Firmware Dependency:** The BMC firmware version must be compatible with the PSU management subsystem. An incompatibility can lead to inaccurate power reporting or failure to properly handle load shedding during power events.
      1. 5.3. Firmware and BIOS Management

Maintaining the **Quasar-X1000** platform requires disciplined firmware hygiene.

1. **BIOS Updates:** Critical updates often contain microcode patches necessary to mitigate security vulnerabilities (e.g., Spectre/Meltdown variants) and, crucially, adjust voltage/frequency curves for memory stability at higher speeds (DDR5-5600+). 2. **BMC/Redfish:** The Baseboard Management Controller (BMC) must run the latest version to ensure accurate monitoring of the 16+ temperature sensors across the dual CPUs and the PCIe backplane. Automated configuration deployment should use the Redfish API for idempotent state management. 3. **Storage Controller Firmware:** NVMe firmware updates are often released independently of the OS/BIOS and are vital for mitigating drive wear-out issues or addressing specific performance regressions noted in NVMe Drive Life Cycle Management.

      1. 5.4. Diagnostics and Troubleshooting

Due to the complex I/O topology (multiple UPI links, 8 memory channels per socket), standard diagnostic tools may not expose the root cause of intermittent performance degradation.

  • **Memory Debugging:** Errors often manifest as subtle instability under high load rather than hard crashes. Utilizing the BMC's integrated memory scrubbing logs and ECC Error Counters is essential for isolating faulty DIMMs or marginal CPU memory controllers.
  • **PCIe Lane Verification:** Tools capable of reading the PCIe configuration space (e.g., `lspci -vvv` on Linux, or equivalent BMC diagnostics) must be used to confirm that all installed accelerators are correctly enumerated on the expected x16 lanes, especially after hardware swaps. Misconfiguration can lead to performance degradation (e.g., running at x8 speed).

The high density of the HDCN-v4.2 means that troubleshooting often requires removing components from the chassis, emphasizing the importance of hot-swap capabilities for all primary storage and networking components.

---

  • This documentation serves as the primary technical reference for the deployment and maintenance of the HDCN-v4.2 server configuration. All operational staff must be trained on the specific power and thermal profiles detailed herein.*


Intel-Based Server Configurations

Configuration Specifications Benchmark
Core i7-6700K/7700 Server 64 GB DDR4, NVMe SSD 2 x 512 GB CPU Benchmark: 8046
Core i7-8700 Server 64 GB DDR4, NVMe SSD 2x1 TB CPU Benchmark: 13124
Core i9-9900K Server 128 GB DDR4, NVMe SSD 2 x 1 TB CPU Benchmark: 49969
Core i9-13900 Server (64GB) 64 GB RAM, 2x2 TB NVMe SSD
Core i9-13900 Server (128GB) 128 GB RAM, 2x2 TB NVMe SSD
Core i5-13500 Server (64GB) 64 GB RAM, 2x500 GB NVMe SSD
Core i5-13500 Server (128GB) 128 GB RAM, 2x500 GB NVMe SSD
Core i5-13500 Workstation 64 GB DDR5 RAM, 2 NVMe SSD, NVIDIA RTX 4000

AMD-Based Server Configurations

Configuration Specifications Benchmark
Ryzen 5 3600 Server 64 GB RAM, 2x480 GB NVMe CPU Benchmark: 17849
Ryzen 7 7700 Server 64 GB DDR5 RAM, 2x1 TB NVMe CPU Benchmark: 35224
Ryzen 9 5950X Server 128 GB RAM, 2x4 TB NVMe CPU Benchmark: 46045
Ryzen 9 7950X Server 128 GB DDR5 ECC, 2x2 TB NVMe CPU Benchmark: 63561
EPYC 7502P Server (128GB/1TB) 128 GB RAM, 1 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (128GB/2TB) 128 GB RAM, 2 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (128GB/4TB) 128 GB RAM, 2x2 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (256GB/1TB) 256 GB RAM, 1 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (256GB/4TB) 256 GB RAM, 2x2 TB NVMe CPU Benchmark: 48021
EPYC 9454P Server 256 GB RAM, 2x2 TB NVMe

Order Your Dedicated Server

Configure and order your ideal server configuration

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⚠️ *Note: All benchmark scores are approximate and may vary based on configuration. Server availability subject to stock.* ⚠️ ```


Intel-Based Server Configurations

Configuration Specifications Benchmark
Core i7-6700K/7700 Server 64 GB DDR4, NVMe SSD 2 x 512 GB CPU Benchmark: 8046
Core i7-8700 Server 64 GB DDR4, NVMe SSD 2x1 TB CPU Benchmark: 13124
Core i9-9900K Server 128 GB DDR4, NVMe SSD 2 x 1 TB CPU Benchmark: 49969
Core i9-13900 Server (64GB) 64 GB RAM, 2x2 TB NVMe SSD
Core i9-13900 Server (128GB) 128 GB RAM, 2x2 TB NVMe SSD
Core i5-13500 Server (64GB) 64 GB RAM, 2x500 GB NVMe SSD
Core i5-13500 Server (128GB) 128 GB RAM, 2x500 GB NVMe SSD
Core i5-13500 Workstation 64 GB DDR5 RAM, 2 NVMe SSD, NVIDIA RTX 4000

AMD-Based Server Configurations

Configuration Specifications Benchmark
Ryzen 5 3600 Server 64 GB RAM, 2x480 GB NVMe CPU Benchmark: 17849
Ryzen 7 7700 Server 64 GB DDR5 RAM, 2x1 TB NVMe CPU Benchmark: 35224
Ryzen 9 5950X Server 128 GB RAM, 2x4 TB NVMe CPU Benchmark: 46045
Ryzen 9 7950X Server 128 GB DDR5 ECC, 2x2 TB NVMe CPU Benchmark: 63561
EPYC 7502P Server (128GB/1TB) 128 GB RAM, 1 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (128GB/2TB) 128 GB RAM, 2 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (128GB/4TB) 128 GB RAM, 2x2 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (256GB/1TB) 256 GB RAM, 1 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (256GB/4TB) 256 GB RAM, 2x2 TB NVMe CPU Benchmark: 48021
EPYC 9454P Server 256 GB RAM, 2x2 TB NVMe

Order Your Dedicated Server

Configure and order your ideal server configuration

Need Assistance?

⚠️ *Note: All benchmark scores are approximate and may vary based on configuration. Server availability subject to stock.* ⚠️