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```mediawiki This is a highly detailed technical documentation article for a hypothetical, high-density, dual-socket server configuration, designated **"Template:Title"**.

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  1. Template:Title: High-Density Compute Node Technical Deep Dive
    • Author:** Senior Server Hardware Engineering Team
    • Version:** 1.1
    • Date:** 2024-10-27

This document provides a comprehensive technical overview of the **Template:Title** server configuration. This platform is engineered for environments requiring extreme processing density, high memory bandwidth, and robust I/O capabilities, targeting mission-critical virtualization and high-performance computing (HPC) workloads.

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    1. 1. Hardware Specifications

The **Template:Title** configuration is built upon a 2U rack-mountable chassis, optimized for thermal efficiency and maximum component density. It leverages the latest generation of server-grade silicon to deliver industry-leading performance per watt.

      1. 1.1 System Board and Chassis

The core of the system is a proprietary dual-socket motherboard supporting the latest '[Platform Codename X]' chipset.

Feature Specification
Form Factor 2U Rackmount
Chassis Model Server Chassis Model D-9000 (High Airflow Variant)
Motherboard Dual-Socket (LGA 5xxx Socket)
BIOS/UEFI Firmware Version 3.2.1 (Supports Secure Boot and IPMI 2.0)
Management Controller Integrated Baseboard Management Controller (BMC) with dedicated 1GbE port
      1. 1.2 Central Processing Units (CPUs)

The **Template:Title** is configured for dual-socket operation, utilizing processors specifically selected for their high core count and substantial L3 cache structures, crucial for database and virtualization duties.

Component Specification Detail
CPU Model (Primary/Secondary) 2 x Intel Xeon Scalable Processor [Model Z-9490] (e.g., 64 Cores, 128 Threads each)
Total Cores/Threads 128 Cores / 256 Threads (Max Configuration)
Base Clock Frequency 2.8 GHz
Max Turbo Frequency (Single Core) Up to 4.5 GHz
L3 Cache (Total) 2 x 128 MB (256 MB Aggregate)
TDP (Per CPU) 350W (Thermal Design Power)
Supported Memory Channels 8 Channels per socket (16 total)

For further context on processor architectures, refer to the Processor Architecture Comparison.

      1. 1.3 Memory Subsystem (RAM)

Memory capacity and bandwidth are critical for this configuration. The system supports high-density Registered DIMMs (RDIMMs) across 32 DIMM slots (16 per CPU).

Parameter Configuration Detail
Total DIMM Slots 32 (16 per socket)
Memory Type Supported DDR5 ECC RDIMM
Maximum Capacity 8 TB (Using 32 x 256GB DIMMs)
Tested Configuration (Default) 2 TB (32 x 64GB DDR5-5600 ECC RDIMM)
Memory Speed (Max Supported) DDR5-6400 MT/s (Dependent on population density)
Memory Controller Type Integrated into CPU (IMC)

Understanding memory topology is vital for optimal performance; see NUMA Node Configuration Best Practices.

      1. 1.4 Storage Configuration

The **Template:Title** emphasizes high-speed NVMe storage, utilizing U.2 and M.2 form factors for primary boot and high-IOPS workloads, while offering flexibility for bulk storage via SAS/SATA drives.

        1. 1.4.1 Primary Storage (NVMe/Boot)

Boot and OS drives are typically provisioned on high-endurance M.2 NVMe drives managed by the chipset's PCIe lanes.

| Storage Bay Type | Quantity | Interface | Capacity (Per Unit) | Purpose | | :--- | :--- | :--- | :--- | :--- | | M.2 NVMe (Internal) | 2 | PCIe Gen 5 x4 | 3.84 TB (Enterprise Grade) | OS Boot/Hypervisor |

        1. 1.4.2 Secondary Storage (Data/Scratch Space)

The chassis supports hot-swappable drive bays, configured primarily for high-throughput storage arrays.

Bay Type Quantity Interface Configuration Notes
Front Accessible Bays (Hot-Swap) 12 x 2.5" Drive Bays SAS4 / NVMe (via dedicated backplane) Supports RAID configurations via dedicated hardware RAID controller (e.g., Broadcom MegaRAID 9750-16i).

The storage subsystem relies heavily on PCIe lane allocation. Consult PCIe Lane Allocation Standards for full topology mapping.

      1. 1.5 Networking and I/O Expansion

I/O density is achieved through multiple OCP 3.0 mezzanine slots and standard PCIe expansion slots.

Slot Type Quantity Interface / Bus Configuration
OCP 3.0 Mezzanine Slot 2 PCIe Gen 5 x16 Reserved for dual-port 100GbE or 200GbE adapters.
Standard PCIe Slots (Full Height) 4 PCIe Gen 5 x16 (x16 electrical) Used for specialized accelerators (GPUs, FPGAs) or high-speed Fibre Channel HBAs.
Onboard LAN (LOM) 2 1GbE Baseboard Management Network

The utilization of PCIe Gen 5 significantly reduces latency compared to previous generations, detailed in PCIe Generation Comparison.

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    1. 2. Performance Characteristics

Benchmarking the **Template:Title** reveals its strength in highly parallelized workloads. The combination of high core count (128) and massive memory bandwidth (16 channels DDR5) allows it to excel where data movement bottlenecks are common.

      1. 2.1 Synthetic Benchmarks

The following results are derived from standardized testing environments using optimized compilers and operating systems (Red Hat Enterprise Linux 9.x).

        1. 2.1.1 SPECrate 2017 Integer Benchmark

This benchmark measures throughput for parallel integer-based applications, representative of large-scale virtualization and transactional processing.

Metric Template:Title Result Previous Generation (2U Dual-Socket) Comparison
SPECrate 2017 Integer Score 1150 (Estimated) +45% Improvement
Latency (Average) 1.2 ms -15% Reduction
        1. 2.1.2 Memory Bandwidth Testing

Measured using STREAM benchmark tools configured to saturate all 16 memory channels simultaneously.

Operation Bandwidth Achieved Theoretical Max (DDR5-5600)
Triad Bandwidth 850 GB/s ~920 GB/s
Copy Bandwidth 910 GB/s ~1.1 TB/s
  • Note: Minor deviation from theoretical maximum is expected due to IMC overhead and memory controller contention across 32 populated DIMMs.*
      1. 2.2 Real-World Application Performance

Performance metrics are more relevant when contextualized against common enterprise workloads.

        1. 2.2.1 Virtualization Density (VMware vSphere 8.0)

Testing involved deploying standard Linux-based Virtual Machines (VMs) with standardized vCPU allocations.

| Workload Metric | Configuration A (Template:Title) | Configuration B (Standard 2U, Lower Core Count) | Improvement Factor | :--- | :--- | :--- | :--- | Maximum Stable VMs (per host) | 320 VMs (8 vCPU each) | 256 VMs (8 vCPU each) | 1.25x | Average VM Response Time (ms) | 4.8 ms | 5.9 ms | 1.23x | CPU Ready Time (%) | < 1.5% | < 2.2% | Improved efficiency

The high core density minimizes the reliance on CPU oversubscription, leading to lower CPU Ready times, a critical metric in virtualization performance. See VMware Performance Tuning for optimization guidance.

        1. 2.2.2 Database Transaction Processing (OLTP)

Using TPC-C simulation, the platform demonstrates superior throughput due to its large L3 cache, which reduces the need for frequent main memory access.

  • **TPC-C Throughput (tpmC):** 1,850,000 tpmC (at 128-user load)
  • **I/O Latency (99th Percentile):** 0.8 ms (Storage subsystem dependent)

This performance profile is heavily influenced by the NVMe subsystem's ability to keep up with high transaction rates.

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    1. 3. Recommended Use Cases

The **Template:Title** is not a general-purpose server; its specialized density and high-speed interconnects dictate specific optimal applications.

      1. 3.1 Mission-Critical Virtualization Hosts

Due to its 128-thread capacity and 8TB RAM ceiling, this configuration is ideal for hosting dense, monolithic virtual machine clusters, particularly those running VDI or large-scale application servers where memory allocation per VM is significant.

  • **Key Benefit:** Maximizes VM density per rack unit (U), reducing data center footprint costs.
      1. 3.2 High-Performance Computing (HPC) Workloads

For scientific simulations (e.g., computational fluid dynamics, weather modeling) that are memory-bandwidth sensitive and require significant floating-point operations, the **Template:Title** excels. The 16-channel memory architecture directly addresses bandwidth starvation common in HPC kernels.

  • **Requirement:** Optimal performance is achieved when utilizing specialized accelerator cards (e.g., NVIDIA H100 Tensor Core GPU) installed in the PCIe Gen 5 slots.
      1. 3.3 Large-Scale Database Servers (In-Memory Databases)

Systems running SAP HANA, Oracle TimesTen, or other in-memory databases benefit immensely from the high RAM capacity (up to 8TB). The low-latency access provided by the integrated memory controller ensures rapid query execution.

  • **Consideration:** Proper NUMA balancing is paramount. Configuration must ensure database processes align with local memory controllers. See NUMA Architecture.
      1. 3.4 AI/ML Training and Inference Clusters

While primarily CPU-centric, this server acts as an excellent host for multiple high-end accelerators. Its powerful CPU complex ensures the data pipeline feeding the GPUs remains saturated, preventing GPU underutilization—a common bottleneck in less powerful host systems.

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    1. 4. Comparison with Similar Configurations

To properly assess the value proposition of the **Template:Title**, it must be benchmarked against two common alternatives: a higher-density, single-socket configuration (optimized for power efficiency) and a traditional 4-socket configuration (optimized for maximum I/O branching).

      1. 4.1 Configuration Matrix

| Feature | Template:Title (2U Dual-Socket) | Configuration X (1U Single-Socket) | Configuration Y (4U Quad-Socket) | | :--- | :--- | :--- | :--- | | Socket Count | 2 | 1 | 4 | | Max Cores | 128 | 64 | 256 | | Max RAM | 8 TB | 4 TB | 16 TB | | PCIe Lanes (Total) | 128 (Gen 5) | 80 (Gen 5) | 224 (Gen 5) | | Rack Density (U) | 2U | 1U | 4U | | Memory Channels | 16 | 8 | 32 | | Power Draw (Peak) | ~1600W | ~1100W | ~2500W | | Ideal Role | Balanced Compute/Memory Density | Power-Constrained Workloads | Maximum I/O and Core Count |

      1. 4.2 Performance Trade-offs Analysis

The **Template:Title** strikes a deliberate balance. Configuration X offers better power efficiency per server unit, but the **Template:Title** delivers 2x the total processing capability in only 2U of space, resulting in superior compute density (cores/U).

Configuration Y offers higher scalability in terms of raw core count and I/O capacity but requires significantly more power (30% higher peak draw) and occupies twice the physical rack space (4U vs 2U). For most mainstream enterprise virtualization, the 2:1 density advantage of the **Template:Title** outweighs the need for the 4-socket architecture's maximum I/O branching.

The most critical differentiator is memory bandwidth. The 16 memory channels in the **Template:Title** provide superior sustained performance for memory-bound tasks compared to the 8 channels in Configuration X. See Memory Bandwidth Utilization.

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    1. 5. Maintenance Considerations

Deploying high-density servers like the **Template:Title** requires stringent attention to power delivery, cooling infrastructure, and serviceability procedures to ensure maximum uptime and component longevity.

      1. 5.1 Power Requirements and Redundancy

Due to the high TDP components (350W CPUs, high-speed NVMe drives), the power budget must be carefully managed at the rack PDU level.

Component Group Estimated Peak Wattage (Configured) Required PSU Rating
Dual CPU (2 x 350W TDP) ~1400W (Under full synthetic load) 2 x 2000W (1+1 Redundant configuration)
RAM (8TB Load) ~350W Required for PSU calculation
Storage (12x NVMe/SAS) ~150W Total System Peak: ~1900W

It is mandatory to deploy this system in racks fed by **48V DC power** or **high-amperage AC circuits** (e.g., 30A/208V circuits) to avoid tripping breakers during peak load events. Refer to Data Center Power Planning.

      1. 5.2 Thermal Management and Airflow

The 2U chassis design relies heavily on high static pressure fans to push air across the dense CPU heat sinks and across the NVMe backplane.

  • **Minimum Required Airflow:** 180 CFM at 35°C ambient inlet temperature.
  • **Recommended Inlet Temperature:** Below 25°C for sustained peak loading.
  • **Fan Configuration:** N+1 Redundant Hot-Swappable Fan Modules (8 total modules).

Improper airflow management, such as mixing this high-airflow unit with low-airflow storage arrays in the same rack section, will lead to thermal throttling of the CPUs, severely impacting performance metrics detailed in Section 2. Consult Server Cooling Standards for rack layout recommendations.

      1. 5.3 Serviceability and Component Access

The **Template:Title** utilizes a top-cover removal mechanism that provides full access to the DIMM slots and CPU sockets without unmounting the chassis from the rack (if sufficient front/rear clearance is maintained).

        1. 5.3.1 Component Replacement Procedures

| Component | Replacement Procedure Notes | Required Downtime | | :--- | :--- | :--- | | DIMM Module | Hot-plug supported only for specific low-power DIMMs; cold-swap recommended for large capacity changes. | Minimal (If replacing non-boot path DIMM) | | CPU/Heatsink | Requires chassis removal from rack for proper torque application and thermal paste management. | Full Downtime | | Fan Module | Hot-Swappable (N+1 redundancy ensures operation during replacement). | Zero | | RAID Controller | Accessible via rear access panel; hot-swap dependent on controller model. | Minimal |

All maintenance procedures must adhere strictly to the Vendor Maintenance Protocol. Failure to follow torque specifications on CPU retention mechanisms can lead to socket damage or poor thermal contact.

      1. 5.4 Firmware Management

Maintaining the synchronization of the BMC, BIOS/UEFI, and RAID controller firmware is critical for stability, especially when leveraging advanced features like PCIe Gen 5 bifurcation or memory mapping. Automated firmware deployment via the BMC is the preferred method for large deployments. See BMC Remote Management.

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    1. Conclusion

The **Template:Title** configuration represents a significant leap in 2U server density, specifically tailored for memory-intensive and highly parallelized computations. Its robust specifications—128 cores, 8TB RAM capacity, and extensive PCIe Gen 5 I/O—position it as a premium solution for modern enterprise data centers where maximizing compute density without sacrificing critical bandwidth is the primary objective. Careful planning regarding power delivery and cooling infrastructure is mandatory for realizing its full performance potential.

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Intel-Based Server Configurations

Configuration Specifications Benchmark
Core i7-6700K/7700 Server 64 GB DDR4, NVMe SSD 2 x 512 GB CPU Benchmark: 8046
Core i7-8700 Server 64 GB DDR4, NVMe SSD 2x1 TB CPU Benchmark: 13124
Core i9-9900K Server 128 GB DDR4, NVMe SSD 2 x 1 TB CPU Benchmark: 49969
Core i9-13900 Server (64GB) 64 GB RAM, 2x2 TB NVMe SSD
Core i9-13900 Server (128GB) 128 GB RAM, 2x2 TB NVMe SSD
Core i5-13500 Server (64GB) 64 GB RAM, 2x500 GB NVMe SSD
Core i5-13500 Server (128GB) 128 GB RAM, 2x500 GB NVMe SSD
Core i5-13500 Workstation 64 GB DDR5 RAM, 2 NVMe SSD, NVIDIA RTX 4000

AMD-Based Server Configurations

Configuration Specifications Benchmark
Ryzen 5 3600 Server 64 GB RAM, 2x480 GB NVMe CPU Benchmark: 17849
Ryzen 7 7700 Server 64 GB DDR5 RAM, 2x1 TB NVMe CPU Benchmark: 35224
Ryzen 9 5950X Server 128 GB RAM, 2x4 TB NVMe CPU Benchmark: 46045
Ryzen 9 7950X Server 128 GB DDR5 ECC, 2x2 TB NVMe CPU Benchmark: 63561
EPYC 7502P Server (128GB/1TB) 128 GB RAM, 1 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (128GB/2TB) 128 GB RAM, 2 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (128GB/4TB) 128 GB RAM, 2x2 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (256GB/1TB) 256 GB RAM, 1 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (256GB/4TB) 256 GB RAM, 2x2 TB NVMe CPU Benchmark: 48021
EPYC 9454P Server 256 GB RAM, 2x2 TB NVMe

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⚠️ *Note: All benchmark scores are approximate and may vary based on configuration. Server availability subject to stock.* ⚠️

1. Hardware Specifications

This document details the cooling system integrated within a high-density, high-performance server configuration designed for demanding workloads. The server's overall specifications significantly influence cooling requirements, and are detailed below. This cooling system is designed to maintain optimal operating temperatures for all components under sustained peak loads.

1.1. Core System Components

Component Specification
CPU Dual Intel Xeon Platinum 8480+ (56 cores/112 threads per CPU, 3.2 GHz base frequency, 3.8 GHz Turbo Boost Max Frequency 3.0, 300MB L3 Cache, TDP 350W)
Motherboard Supermicro X13DEI-N (Dual Socket LGA 4677, DDR5 ECC Registered Memory, PCIe 5.0 Support) - See Motherboard Architecture for details.
RAM 2TB DDR5 ECC Registered Memory (8 x 256GB DIMMs, 5600 MHz) - Refer to Memory Technology for further information.
Storage 8 x 7.68TB NVMe PCIe Gen4 SSDs (U.2 Interface) in RAID 10 configuration. See Storage Systems for RAID configuration details.
Network Interface Dual 200GbE Network Adapters (Mellanox ConnectX-7) - See Network Interface Cards for specifications.
Power Supply 3 x 1600W Redundant 80+ Titanium Power Supplies - Details available in Power Supply Units.
Chassis 4U Rackmount Chassis with optimized airflow design. See Server Chassis for details.

1.2. Cooling System Components

Component Specification
CPU Coolers 2 x Custom Liquid Coolers (Dual 120mm Radiators per CPU, High-Performance Cold Plates) - See Liquid Cooling Technologies
Radiator Fans 8 x 120mm PWM Fans (High Static Pressure, Optimized for Radiators) - Details in Fan Technology
Chassis Fans 6 x 80mm PWM Fans (Front Intake), 4 x 80mm PWM Fans (Rear Exhaust) – Controlled via Intelligent Fan Control.
Liquid Cooling Pump Dual Redundant Pumps (DC 12V, High Flow Rate) - See Pump Technology
Liquid Cooling Reservoir 2 x 500ml Reservoirs (Integrated into Cooling Loop)
Cooling Fluid Non-Conductive, Non-Corrosive Coolant (Glycol-Based) - See Coolant Specifications.
Temperature Sensors Multiple Temperature Sensors (CPU, Motherboard, VRM, SSDs, Ambient) - Integrated with Server Management Tools.
Heat Pipes Integrated into VRM cooling solution on motherboard. See Heat Pipe Technology.

1.3. Cooling System Topology

The cooling system employs a hybrid approach, combining liquid cooling for high-power components (CPUs) and air cooling for other critical areas. Two independent liquid cooling loops are implemented, one for each CPU. Each loop consists of a high-performance cold plate directly contacting the CPU, a pump, a radiator with PWM fans, and a reservoir. Airflow is managed by strategically placed intake and exhaust fans to create a unidirectional flow path through the chassis. Temperature sensors are positioned throughout the system to provide real-time monitoring and control via the server’s baseboard management controller (BMC).


2. Performance Characteristics

The cooling system's effectiveness is paramount to maintaining server stability and performance. Testing was conducted under various load conditions to assess its capabilities.

2.1. Thermal Testing Methodology

  • **Stress Testing:** CPU utilization was maintained at 100% using Prime95 (Small FFTs) and Intel Burn Test for extended periods (24-48 hours).
  • **Monitoring:** Temperatures were logged using the server’s BMC sensors and validated with external thermal probes placed on the CPU IHS, VRMs, and SSDs.
  • **Ambient Temperature:** Tests were conducted at a controlled ambient temperature of 25°C (77°F).
  • **Fan Speed Control:** Fan curves were tested with various profiles, including silent, balanced, and performance modes.
  • **Workload Simulation:** A representative database workload (PostgreSQL with pgbench) was used to simulate real-world application performance.

2.2. Benchmark Results

Metric Value
Max CPU Temperature (Prime95) 78°C
Average CPU Temperature (Prime95) 65°C
VRM Temperature (Max) 85°C
SSD Temperature (Max) 70°C
Intake Air Temperature 25°C
Exhaust Air Temperature 35°C
Fan RPM (Max) 3200 RPM
Fan Noise (Max, dB) 65 dB (at 1 meter)

2.3. Real-World Performance

During prolonged database workload simulations, the server demonstrated consistent performance without thermal throttling. The CPU maintained boost clock speeds above 3.5 GHz for extended periods. The cooling system effectively dissipated the heat generated by the CPUs and other components, resulting in stable operation and predictable performance. The temperature difference between intake and exhaust air (10°C) indicates efficient heat removal. See Thermal Throttling for more details on performance impacts.


3. Recommended Use Cases

This server configuration, with its robust cooling system, is ideally suited for the following applications:

  • **High-Performance Computing (HPC):** The ability to sustain peak CPU performance makes this configuration excellent for scientific simulations, data analysis, and other computationally intensive tasks.
  • **Virtualization:** Supporting a high density of virtual machines requires a stable and reliable cooling solution to prevent performance degradation.
  • **Database Servers:** Large-scale databases generate significant heat. This cooling system ensures consistent performance and data integrity.
  • **Artificial Intelligence (AI) and Machine Learning (ML):** Training and inference tasks demand substantial processing power, necessitating efficient heat dissipation. See AI Server Requirements.
  • **Video Encoding/Transcoding:** High-resolution video processing puts a heavy load on the CPU and requires effective cooling.
  • **Financial Modeling:** Complex financial models require significant computational resources.



4. Comparison with Similar Configurations

This cooling system represents a premium solution. Here’s a comparison with alternative cooling configurations:

Configuration Cooling System Cost Performance Complexity
**Configuration A (Air-Cooled)** Standard Airflow with High-Performance Heatsinks and Fans Low Good (Limited by TDP) Low
**Configuration B (Hybrid - Single CPU Liquid Cooled)** Liquid Cooling for one CPU, Air Cooling for others. Medium Improved (One CPU benefits from liquid cooling) Medium
**Configuration C (Dual Loop Liquid Cooling – This Configuration)** Dual Loop Liquid Cooling for both CPUs, Airflow for remaining components. High Excellent (Sustained peak performance) High
**Configuration D (Direct-to-Chip Liquid Cooling)** Liquid cooling directly contacting CPU die (Advanced). See Direct-to-Chip Cooling. Very High Exceptional (Highest possible cooling performance) Very High
    • Analysis:**
  • **Configuration A** is the most cost-effective but may struggle to maintain optimal temperatures under sustained high loads. It's suitable for less demanding workloads.
  • **Configuration B** provides a compromise between cost and performance. It's a good option if one CPU is significantly more critical than the other.
  • **Configuration D** offers the best possible cooling performance but is significantly more expensive and complex to implement. It’s typically used in specialized HPC environments.
  • **This configuration (C)** strikes a balance between performance, cost, and complexity, providing excellent cooling for both CPUs without the extreme cost of direct-to-chip cooling.


5. Maintenance Considerations

Maintaining the cooling system is crucial for long-term reliability and performance.

5.1. Regular Cleaning

  • **Dust Removal:** Regularly clean dust from radiator fins, fans, and air filters (at least every 3-6 months, or more frequently in dusty environments). Use compressed air and anti-static brushes. See Dust Mitigation Strategies.
  • **Fan Inspection:** Inspect fans for proper operation and bearing wear. Replace any faulty fans immediately.
  • **Reservoir Inspection:** Periodically inspect the liquid cooling reservoirs for leaks or sediment buildup.

5.2. Liquid Cooling Maintenance

  • **Coolant Replacement:** Replace the coolant every 2-3 years to prevent corrosion and maintain optimal thermal conductivity. Refer to Coolant Replacement Procedures.
  • **Leak Detection:** Regularly inspect the cooling loops for leaks. The BMC often includes leak detection sensors.
  • **Pump Monitoring:** Monitor pump performance through the BMC. Declining flow rates indicate potential pump failure.

5.3. Power Requirements

The cooling system components (fans, pumps) consume approximately 200-300W of power. This must be accounted for when calculating the overall power budget for the server. The redundant power supplies provide sufficient headroom for the cooling system and other components. See Power Redundancy for details.

5.4. Environmental Monitoring

  • **Temperature Logging:** Continuously monitor CPU, VRM, and SSD temperatures using the server’s BMC. Set up alerts for temperature thresholds.
  • **Airflow Monitoring:** Verify proper airflow direction and obstruction-free vents.
  • **Humidity Control:** Maintain a stable humidity level in the server room to prevent condensation and corrosion.

5.5. Troubleshooting

  • **High Temperatures:** Investigate potential causes such as dust buildup, fan failure, pump failure, or coolant leaks.
  • **Pump Noise:** Excessive pump noise may indicate cavitation or a failing pump.
  • **Fan Noise:** Loud fan noise may indicate bearing wear or improper fan control settings.
  • **System Instability:** Thermal throttling can cause system instability. Address the underlying cooling issue immediately. Refer to Server Troubleshooting Guide for more detailed guidance.

```


Intel-Based Server Configurations

Configuration Specifications Benchmark
Core i7-6700K/7700 Server 64 GB DDR4, NVMe SSD 2 x 512 GB CPU Benchmark: 8046
Core i7-8700 Server 64 GB DDR4, NVMe SSD 2x1 TB CPU Benchmark: 13124
Core i9-9900K Server 128 GB DDR4, NVMe SSD 2 x 1 TB CPU Benchmark: 49969
Core i9-13900 Server (64GB) 64 GB RAM, 2x2 TB NVMe SSD
Core i9-13900 Server (128GB) 128 GB RAM, 2x2 TB NVMe SSD
Core i5-13500 Server (64GB) 64 GB RAM, 2x500 GB NVMe SSD
Core i5-13500 Server (128GB) 128 GB RAM, 2x500 GB NVMe SSD
Core i5-13500 Workstation 64 GB DDR5 RAM, 2 NVMe SSD, NVIDIA RTX 4000

AMD-Based Server Configurations

Configuration Specifications Benchmark
Ryzen 5 3600 Server 64 GB RAM, 2x480 GB NVMe CPU Benchmark: 17849
Ryzen 7 7700 Server 64 GB DDR5 RAM, 2x1 TB NVMe CPU Benchmark: 35224
Ryzen 9 5950X Server 128 GB RAM, 2x4 TB NVMe CPU Benchmark: 46045
Ryzen 9 7950X Server 128 GB DDR5 ECC, 2x2 TB NVMe CPU Benchmark: 63561
EPYC 7502P Server (128GB/1TB) 128 GB RAM, 1 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (128GB/2TB) 128 GB RAM, 2 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (128GB/4TB) 128 GB RAM, 2x2 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (256GB/1TB) 256 GB RAM, 1 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (256GB/4TB) 256 GB RAM, 2x2 TB NVMe CPU Benchmark: 48021
EPYC 9454P Server 256 GB RAM, 2x2 TB NVMe

Order Your Dedicated Server

Configure and order your ideal server configuration

Need Assistance?

⚠️ *Note: All benchmark scores are approximate and may vary based on configuration. Server availability subject to stock.* ⚠️

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