Hardware Revision History
- Hardware Revision History: Server Platform X-9000 (Rev 3.1)
This document serves as the definitive technical specification and revision history overview for the **Server Platform X-9000**, specifically detailing the **Revision 3.1** build configuration. This revision represents a significant mid-cycle refresh focused on enhancing memory bandwidth, improving I/O throughput via PCIe Gen 5 adoption, and optimizing power efficiency for high-density data center deployments.
This technical specification is intended for system architects, data center operations staff, and hardware validation engineers.
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- 1. Hardware Specifications
The Server Platform X-9000 (Rev 3.1) is a 2U rack-mountable system designed for maximum computational density and massive parallel processing capabilities. It utilizes a dual-socket motherboard architecture supporting the latest generation of high-core-count processors.
- 1.1. System Board and Chassis Overview
The motherboard (P/N: X9K-MB-R3.1) is designed around the proprietary **Titanium Chipset (TC-Gen5)**, enabling full utilization of PCIe 5.0 lanes across all attached peripherals.
| Attribute | Specification | Notes |
|---|---|---|
| Form Factor | 2U Rackmount | Optimized for 42U standard racks. |
| Dimensions (H x W x D) | 87.5 mm x 448 mm x 740 mm | Depth includes front bezels and rear cable management. |
| Weight (Fully Configured) | Approx. 28 kg | Varies based on drive count and cooling solution. |
| Chassis Material | SECC Steel (SGCC) with Aluminum Front Bezel | Enhanced EMI shielding compliance. |
| Management Controller | Integrated Baseboard Management Controller (BMC) 5.0 | Supports Redfish API v1.8.0 and KVM-over-IP. |
| Power Supply Redundancy | 2+1 (N+1 or 2N configurations supported) | Hot-swappable modules. |
- 1.2. Central Processing Units (CPUs)
Revision 3.1 mandates support for the latest generation of server processors, leveraging the increased L3 cache and higher memory channel counts.
| Component | Specification | Details |
|---|---|---|
| Processor Family | Intel Xeon Scalable (Sapphire Rapids derivative) or AMD EPYC (Genoa derivative) | Socket compatibility is motherboard-dependent; Rev 3.1 supports both major vendors via specific SKUs. |
| Socket Count | 2 Sockets | Dual-socket symmetric multiprocessing (SMP) architecture. |
| Maximum Cores per CPU | 96 Cores (192 Threads) | Configurable up to 2x 96-core units for 192 total physical cores. |
| Base Clock Frequency | 2.0 GHz (Minimum) | Varies significantly by SKU selected. |
| Max Turbo Frequency | Up to 3.8 GHz (Single Thread) | Dependent on thermal headroom and power limits (TDP). |
| Cache Hierarchy (Per CPU) | L1: 96KB/core; L2: 2MB/core; L3: 384MB (Shared) | Significant L3 cache increase over Rev 2.0. |
| TDP Support | Up to 350W per socket | Requires high-airflow cooling modules (see Section 5). |
| Interconnect | UPI 2.0 (Intel) or Infinity Fabric (AMD) | Supports high-speed cache coherency between sockets. |
For detailed CPU core utilization metrics, refer to the Performance Benchmarks: CPU Saturation Analysis.
- 1.3. Memory Subsystem (RAM)
The memory subsystem is a critical focus of Rev 3.1, introducing support for faster DDR5 modules and expanded channel utilization.
| Attribute | Specification | Notes |
|---|---|---|
| Memory Type | DDR5 ECC RDIMM/LRDIMM | Supports on-die ECC for enhanced reliability. |
| Maximum Capacity per Slot | 256 GB (3DS LRDIMM) | Standard configuration often uses 128GB modules. |
| Total Slots | 32 DIMM Slots (16 per CPU) | Allows for maximum population of 8TB total system memory. |
| Memory Channels | 8 Channels per CPU (Total 16 Channels) | Industry-leading bandwidth for dual-socket configuration. |
| Maximum Supported Speed | DDR5-6400 MT/s (JEDEC standard) | Achievable with 1DPC (One DIMM Per Channel) population. |
| Inter-Socket Latency | Target < 60ns | Measured via memory access tests across UPI/Infinity Fabric. |
The revised topology ensures that all memory channels are populated symmetrically to maintain optimal Memory Interleaving Techniques.
- 1.4. Storage Subsystem
Rev 3.1 provides extensive, high-speed storage connectivity, prioritizing NVMe performance.
- 1.4.1. Internal Primary Storage (OS/Boot)
| Attribute | Specification | Notes | | :--- | :--- | :--- | | M.2 Slots (Internal) | 2 x NVMe PCIe 5.0 x4 | Dedicated for OS Mirroring/Boot Volumes. | | U.2/U.3 Bays | 8 x Hot-Swap Bays | Configurable for NVMe or SATA/SAS drives. | | HBA/RAID Controller | Broadcom MegaRAID 9750-8i (or equivalent SAS4/NVMe controller) | PCIe 5.0 x8 interface required for full throughput. |
- 1.4.2. Front Drive Bays
The chassis supports up to 24 SFF (2.5-inch) drives or 12 LFF (3.5-inch) drives in a flexible configuration.
| Bay Type | Max Quantity | Supported Protocols |
|---|---|---|
| 2.5" Hot-Swap Bays | 24 | SAS-4 (22.5 GT/s), SATA III, U.3 NVMe |
| 3.5" Hot-Swap Bays | 12 | SAS-3, SATA III (NVMe support requires specialized backplane adapter) |
| Backplane Technology | Tri-Mode Support (SAS/SATA/PCIe) | Managed by the primary RAID/HBA controller. |
For detailed RAID performance curves, consult the Storage Performance Metrics Documentation.
- 1.5. Expansion Capabilities (PCIe Topology)
The introduction of PCIe Gen 5 is the defining feature of Revision 3.1, doubling the effective bandwidth compared to Gen 4 systems.
The system provides a total of **128 usable PCIe 5.0 lanes** distributed across the two CPUs.
| Slot ID | Bus Lane Width | Physical Slot Count | Connected To | Notes |
|---|---|---|---|---|
| PCIe Slot 1 (Rear Riser 1) | x16 | 2 | CPU 1 (Direct Connect) | Primary GPU/Accelerator slot. |
| PCIe Slot 2 (Rear Riser 2) | x16 | 2 | CPU 2 (Direct Connect) | Primary GPU/Accelerator slot. |
| PCIe Slot 3 (Mid-Chassis Riser) | x16 | 2 | CPU 1 (via PCH/Chipset) | Supports high-speed networking cards (400GbE). |
| PCIe Slot 4 (Mid-Chassis Riser) | x8 | 2 | CPU 2 (via PCH/Chipset) | Typically used for storage controllers or management NICs. |
| OCP 3.0 Slot | x16 (Dedicated) | 1 | CPU 1 (Direct Connect) | Optimized for network interface cards (NICs). |
- Note on Lane Allocation:** In a fully populated dual-CPU configuration utilizing all direct CPU connections (Slots 1 & 2), the system maintains full Gen 5 x16 bandwidth to both accelerator cards, provided the system is configured with appropriate firmware settings to prioritize direct lane assignment. Refer to Chipset Lane Mapping Guide for specific bifurcation rules.
- 1.6. Networking Interface
The baseboard includes integrated management and dual 10GbE connectivity. High-speed networking is provided via the OCP 3.0 slot.
- **Management LAN (LOM):** 1 x 1GbE (Dedicated BMC)
- **Onboard Data LAN:** 2 x 10GBASE-T (Broadcom BCM57416)
- **OCP 3.0 Slot:** Supports modular modules up to 400GbE (e.g., ConnectX-7 based adapters).
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- 2. Performance Characteristics
Revision 3.1 demonstrates significant performance uplifts, primarily driven by the transition to DDR5 and PCIe 5.0. This section details synthetic benchmarks and observed real-world throughput metrics.
- 2.1. Memory Bandwidth Analysis
The shift to 16 memory channels running at DDR5-6400 MT/s yields substantial theoretical bandwidth improvements over the previous Rev 2.0 (which utilized DDR4-3200 across 12 channels).
| Metric | Rev 2.0 (DDR4-3200) | Rev 3.1 (DDR5-6400) | Improvement Factor |
|---|---|---|---|
| Channels (Total) | 12 | 16 | 1.33x |
| Peak Aggregate Bandwidth | ~307 GB/s | ~819 GB/s | 2.67x |
| Single-Thread Latency (Measured) | 85 ns | 55 ns | 1.55x |
The reduced latency and increased bandwidth directly impact memory-bound workloads, such as large-scale in-memory databases and complex scientific simulations. See System Memory Performance Tuning for optimization guides related to NUMA balancing.
- 2.2. Compute Benchmarks (SPECrate 2017 Integer)
The following results reflect a standardized configuration: Dual 96-core CPUs (3.0 GHz Base, 350W TDP) with 4TB of DDR5-6400 memory.
| Workload | Rev 2.0 Baseline (Avg Score) | Rev 3.1 Result (Avg Score) | Delta (%) | | :--- | :--- | :--- | :--- | | SPECrate 2017 Integer | 1,450 | 2,180 | +50.3% | | SPECrate 2017 Floating Point | 1,610 | 2,455 | +52.5% | | Linpack HPC (Rpeak) | 18.5 TFLOPS | 29.1 TFLOPS | +57.3% |
The significant gain in Floating Point performance is attributed to the improved vector processing units (AVX-512 extensions) supported by the new CPU architecture, coupled with higher effective memory bandwidth feeding the execution units.
- 2.3. I/O Throughput Validation (PCIe 5.0 Impact)
The primary bottleneck in Rev 2.0 was often the PCIe Gen 4 link speed when provisioning multiple high-speed devices (e.g., dual 200GbE NICs and multiple GPUs). PCIe 5.0 resolves this by doubling the per-lane throughput.
| Metric | Rev 2.0 (PCIe Gen 4) | Rev 3.1 (PCIe Gen 5) | Bottleneck Identified |
|---|---|---|---|
| Max PCIe Throughput (Bi-directional) | ~64 GB/s | ~128 GB/s | N/A (System is I/O bound by NICs) |
| 400GbE Aggregate Throughput | 380 Gbps (Limited by Gen 4 lanes) | 780 Gbps (Full theoretical saturation) | PCIe Gen 4 link saturation |
| NVMe Read Throughput (24-Drive Pool) | 28 GB/s | 55 GB/s | Drive density/Controller limits |
This validation confirms that Rev 3.1 is capable of saturating state-of-the-art networking and storage devices without introducing a CPU-to-Device I/O bottleneck. Detailed testing procedures are documented in I/O Stress Testing Protocols.
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- 3. Recommended Use Cases
The X-9000 Rev 3.1 configuration is engineered for workloads demanding extreme computational density, massive memory capacity, and high-speed external data transfer.
- 3.1. High-Performance Computing (HPC) and Simulation
The combination of high core counts (up to 192 cores) and superior Floating Point performance makes this platform ideal for computationally intensive tasks.
- **Computational Fluid Dynamics (CFD):** High core counts allow for fine-grained mesh discretization, while fast memory supports rapid boundary condition updates.
- **Molecular Dynamics (MD):** The low inter-socket latency, coupled with high memory bandwidth, ensures efficient propagation of particle interactions across the NUMA boundaries.
- **Weather Modeling:** Requires significant memory capacity (up to 8TB) to hold global state variables.
- 3.2. Large-Scale Data Analytics and In-Memory Databases
Workloads where data must remain resident in DRAM for rapid access are perfectly suited for the 8TB memory ceiling.
- **SAP HANA/Oracle Exadata:** Deployments requiring large buffer caches benefit directly from the DDR5 speed and capacity.
- **Graph Databases (e.g., Neo4j, TigerGraph):** Traversing complex graph structures is heavily latency-sensitive; the 55ns measured memory latency is crucial here.
- **Big Data Processing (Spark/Dask):** High memory capacity reduces reliance on slower shuffle operations to disk.
- 3.3. Artificial Intelligence and Deep Learning Training (GPU Accelerated)
While the CPU itself is powerful, the primary AI benefit in Rev 3.1 is the PCIe 5.0 infrastructure supporting next-generation accelerators.
- **Large Language Model (LLM) Training:** Requires multiple high-end GPUs (e.g., NVIDIA H100/B200). The dual x16 Gen 5 slots ensure that high-speed GPU-to-GPU communication (via NVLink/CXL, if supported by the accelerator) and host memory transfer are not constrained.
- **Model Serving Inference:** Low latency access to model weights stored on local NVMe storage, served via the fast PCIe bus, is critical for real-time response.
- 3.4. Virtualization Density
The high core count and ample RAM allow for maximizing VM consolidation ratios.
- **VDI Environments:** Supporting hundreds of virtual desktops per chassis.
- **Container Orchestration (Kubernetes):** Serving as high-density worker nodes where rapid scaling and high I/O are required for container image pulls.
For guidance on workload placement and NUMA topology awareness, review NUMA Architecture Best Practices.
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- 4. Comparison with Similar Configurations
To contextualize the value proposition of Rev 3.1, this section compares it against its immediate predecessor (Rev 2.0) and a hypothetical next-generation platform (Rev 4.0, anticipated).
- 4.1. Revision Comparison Matrix
This comparison focuses on the core architectural changes between the last major revision and the current one.
| Feature | Rev 2.0 (DDR4/Gen 4) | Rev 3.1 (DDR5/Gen 5) | Rev 4.0 (Projected CXL 2.0) |
|---|---|---|---|
| CPU Socket Support | Gen 3/4 Compatible | Gen 5 Compatible | CXL 2.0/Gen 6 Ready |
| Memory Type | DDR4-3200 | DDR5-6400 | DDR5-8000+ / CXL Memory Pools |
| PCIe Generation | Gen 4.0 (16 GT/s) | Gen 5.0 (32 GT/s) | Gen 6.0 (64 GT/s) |
| Max System RAM | 4 TB | 8 TB | 16 TB (Via Memory Expansion Units) |
| Power Efficiency (Performance/Watt) | Baseline (1.0x) | ~1.55x | Projected 2.0x |
| Management Protocol | IPMI 2.0 / Early Redfish | Redfish 1.8.0 Compliant | Full DMTF Compliance |
- 4.2. Competitive Landscape Analysis (vs. Competitor Platform Z)
Platform X-9000 (Rev 3.1) competes directly with Platform Z, which utilizes an alternative processor architecture (e.g., AMD vs. Intel baseline). This comparison uses a standardized 2U, dual-socket configuration evaluated at peak TDP.
| Metric | X-9000 (Rev 3.1) | Competitor Platform Z (Equivalent Tier) | Advantage / Disadvantage |
|---|---|---|---|
| Max Cores | 192 | 160 | X-9000 (Higher Density) |
| Memory Bandwidth (Theoretical) | 819 GB/s | 750 GB/s | X-9000 (DDR5 Channel Count) |
| PCIe Lane Availability (Gen 5) | 128 Usable Lanes | 112 Usable Lanes (Chipset limited) | X-9000 (More direct CPU lanes) |
| Storage Density (2.5" Bays) | 24 | 16 | X-9000 (Chassis Design) |
| Power Draw (Peak Load) | 1850W | 1980W | X-9000 (Better PUE) |
The X-9000 Rev 3.1 maintains a lead in raw I/O density and aggregate memory bandwidth due to its optimized chipset design supporting more direct CPU-to-PCIe lanes compared to Platform Z's reliance on chipset aggregation for auxiliary slots. For specific NIC performance comparisons, see Network Interface Card Benchmarking.
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- 5. Maintenance Considerations
Deploying and maintaining the X-9000 Rev 3.1 requires adherence to specific environmental and operational guidelines, particularly due to the increased power density and thermal output from the high-TDP CPUs.
- 5.1. Power Requirements and Redundancy
The increased performance necessitates robust power infrastructure.
| Parameter | Specification | Notes |
|---|---|---|
| Nominal Input Voltage | 200-240V AC (Single Phase or Three Phase) | 110V operation is supported but limits PSU capacity significantly. |
| PSU Configuration | 2000W 80+ Titanium (N+1 or 2N) | Titanium rating ensures >94% efficiency at 50% load. |
| Maximum Power Draw (Peak Load) | ~1850 Watts | Measured with dual 350W CPUs, 8TB RAM (populated), and 4 high-draw accelerators. |
| Power Distribution Unit (PDU) Density | Minimum 10kW per rack unit | Recommended for high-density deployments of Rev 3.1 systems. |
- Firmware Management:** Ensure the Power Management Firmware (PMF) is updated to Rev 4.2 or later to correctly handle dynamic power capping thresholds required by modern CPU power states (e.g., PL1/PL2 enforcement).
- 5.2. Thermal Management and Airflow
The system is designed for standard front-to-back cooling. However, the increased heat flux requires careful attention to rack density and ambient temperature control.
- **Airflow Requirement:** Minimum 120 CFM per server, requiring high Static Pressure fans in the rack infrastructure.
- **Ambient Inlet Temperature:** Maximum sustained inlet temperature must not exceed $35^\circ \text{C}$ ($95^\circ \text{F}$). Operation above this threshold mandates the use of specialized Data Center Cooling Solutions.
- **CPU Cooling:** The system requires high-performance, high-airflow heatsinks (P/N: X9K-HS-HP). Standard low-profile heatsinks designed for 150W TDP processors are **not compatible** and will result in immediate thermal throttling or shutdown.
- 5.3. Servicing and Component Replacement
All critical components are hot-swappable, adhering to high availability standards.
1. **Drives:** Front drive bays use standard hot-swap carriers. Backplane connection verification (via BMC diagnostics) is necessary post-replacement. 2. **PSUs and Fans:** Redundant fan modules and PSUs are accessible from the rear panel and can be replaced without system downtime, provided the remaining unit can handle the full system load (N+1 check). 3. **Memory/CPU:** Processor and DIMM replacement requires system shutdown. Due to the dense population (32 DIMMs), careful attention must be paid to the anti-static procedures and correct seating sequence outlined in the Hardware Installation Manual.
- 5.4. Firmware and Software Dependencies
Optimal performance relies on the correct interaction between hardware and firmware.
- **BIOS Version:** Minimum required BIOS version is **R3.1.05**. Earlier versions may not correctly expose all PCIe 5.0 lanes or properly manage DDR5 training sequences.
- **Operating System Support:** Full utilization of 192 cores and 8TB RAM requires modern OS kernels (Linux Kernel 5.15+, Windows Server 2022+) capable of managing large NUMA nodes effectively. Older OS versions may suffer from poor thread scheduling across the dual-socket structure.
- **BMC Firmware:** Must be updated to support Redfish API schema v1.8.0 for advanced monitoring of power telemetry and PCIe lane status. Failure to update BMC firmware can lead to inaccurate power reporting, potentially causing PDU overload events. Consult BMC Firmware Update Procedure.
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- 6. Detailed Component Deep Dive: The Titanium Chipset (TC-Gen5)
The core innovation enabling the Rev 3.1 capabilities is the **Titanium Chipset (TC-Gen5)**, which acts as the central I/O hub and communication fabric between the two CPUs and the peripheral subsystems (storage controllers, management engine, and non-direct-attached PCIe slots).
- 6.1. PCIe Lane Aggregation and Routing
Unlike older chipsets where peripherals were often limited to Gen 4 speeds or shared bandwidth, TC-Gen5 provides dedicated, high-speed uplinks from the CPUs.
The chipset features two primary uplinks to each CPU: 1. **High-Bandwidth Link (HBL):** Dedicated PCIe 5.0 x16 link for primary accelerators (GPUs/FPGAs). 2. **General Purpose Link (GPL):** Dedicated PCIe 5.0 x8 link for high-speed networking or RAID controllers.
The remaining PCIe lanes for the mid-chassis slots (Slots 3 & 4) are aggregated via the chipset to provide Gen 5 performance, although these lanes are subject to potential contention if both CPUs access them simultaneously during heavy I/O operations. The routing table prioritizes CPU 1 access to Slot 3 and CPU 2 access to Slot 4 for reduced latency.
- 6.2. CXL Readiness (Passive Support)
While Rev 3.1 does not feature full CXL Type 3 support (reserved for Rev 4.0), the TC-Gen5 chipset incorporates passive support for CXL 1.1 coherence protocols on the memory channels. This allows for future compatibility with CXL Memory Expander Modules (MEMs) that operate in *Cache-Only Mode* (Type 2 devices) by maintaining cache line coherence across the UPI/Infinity Fabric links, though system capacity expansion requires a firmware upgrade.
Engineers should note that current Rev 3.1 BIOS versions **do not enable** CXL memory pooling features, as the required memory controller firmware is pending validation. Refer to CXL Implementation Roadmap for expected activation timelines.
- 6.3. Management Engine Integration
The TC-Gen5 integrates a dedicated security subsystem that hardens the BMC. This includes:
- **Secure Boot Chain Verification:** Ensuring the BIOS, BMC firmware, and Option ROMs are cryptographically verified upon initialization.
- **Hardware Root of Trust (HRoT):** Utilizing a TPM 2.0 module integrated directly into the chipset logic, preventing cold boot attacks on boot parameters.
This integrated security posture is crucial for compliance in heavily regulated environments (e.g., finance, government).
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- 7. Reliability, Availability, and Serviceability (RAS) Features
The X-9000 Rev 3.1 platform emphasizes enterprise-grade RAS features to ensure maximum uptime.
- 7.1. Memory Error Correction and Scrubbing
Beyond standard ECC protection afforded by DDR5, the system actively manages memory integrity:
- **Patrol Scrubbing:** The memory controller continuously reads and verifies memory contents during idle cycles, proactively correcting soft errors before they escalate.
- **Demand Scrubbing:** Triggered immediately upon detection of a corrected ECC error (CE) to refresh adjacent cache lines.
- **Rank Scrubbing:** For LRDIMMs, the system can perform scrubbing at the rank level during maintenance windows to prevent multi-bit errors (UE) that could lead to system crashes. This feature can be scheduled via the BMC interface.
- 7.2. Predictive Failure Analysis (PFA)
PFA capabilities are significantly enhanced in Rev 3.1 through advanced telemetry aggregated by the TC-Gen5 chipset:
1. **Voltage/Frequency Monitoring:** Real-time monitoring of VRM stability for both CPU cores and memory channels. Deviations outside a 1% tolerance band trigger a PFA alert via the BMC. 2. **Fan Speed Variance:** Detection of fan motors drawing anomalous current or exhibiting non-linear speed curves, indicating impending mechanical failure before thermal limits are breached. 3. **SSD Health Reporting:** Direct parsing of S.M.A.R.T. data from all NVMe/SAS drives, correlated with I/O latency spikes to predict imminent drive failure with higher accuracy than standard OS reporting.
PFA alerts are transmitted via **SNMP traps** and the Redfish event log, enabling automated ticket generation in IT Service Management (ITSM) systems.
- 7.3. Redundant Components Lifecycle Management
The system mandates the use of redundant components for all major subsystems:
- **Power:** Dual, independent power supplies ensure that a single PSU failure does not impact operation.
- **Networking:** Support for NIC teaming/bonding across the 1GbE management interface and the dual 10GbE data ports allows for link redundancy.
- **Storage:** The choice of RAID controller (Section 1.4.1) allows for N-way mirroring or parity configurations, protecting against single or double drive failures.
For configuration guidelines on achieving 99.999% availability, refer to the High Availability Deployment Guide.
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- 8. Environmental and Compliance Information
The X-9000 Rev 3.1 adheres to stringent international environmental and safety standards, critical for global data center deployment.
- 8.1. Regulatory Compliance
| Standard | Status | Notes | | :--- | :--- | :--- | | UL/CSA | UL 62368-1 Certified | Safety standard for IT/AV equipment. | | CE Marking | Conforms to relevant EU Directives | Including EMC Directive 2014/30/EU. | | FCC Part 15 | Class A Verified | Emissions compliance for industrial environments. | | RoHS 3 | Compliant | Restriction of Hazardous Substances. | | TIA-942 | Infrastructure Ready | Designed for high-density, high-airflow rack installations. |
- 8.2. Acoustic Profile
Due to the high-speed fans required to cool the 350W CPUs and multiple accelerators, the acoustic output is significant when operating at full load in an open environment.
- **Acoustic Power (Full Load, 1 Meter):** 75 dBA
- **Acoustic Power (Idle/Low Load):** 58 dBA
- Recommendation:** This server must be installed in a dedicated, enclosed server room or cooled data hall environment. Operation in office environments is strictly prohibited. For details on noise reduction techniques, see Acoustic Mitigation Strategies.
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- Conclusion: The X-9000 Rev 3.1 Value Proposition
The Hardware Revision 3.1 represents a maturation of the X-9000 platform, successfully integrating the latest advancements in processor technology (DDR5, PCIe 5.0) into a robust 2U form factor. The 2.67x increase in memory bandwidth and the doubling of I/O throughput compared to Rev 2.0 position this configuration as a cornerstone platform for data-intensive, compute-bound workloads for the next 3-5 years, offering exceptional performance density and maintaining high serviceability standards through advanced BMC integration and RAS features.
Intel-Based Server Configurations
| Configuration | Specifications | Benchmark |
|---|---|---|
| Core i7-6700K/7700 Server | 64 GB DDR4, NVMe SSD 2 x 512 GB | CPU Benchmark: 8046 |
| Core i7-8700 Server | 64 GB DDR4, NVMe SSD 2x1 TB | CPU Benchmark: 13124 |
| Core i9-9900K Server | 128 GB DDR4, NVMe SSD 2 x 1 TB | CPU Benchmark: 49969 |
| Core i9-13900 Server (64GB) | 64 GB RAM, 2x2 TB NVMe SSD | |
| Core i9-13900 Server (128GB) | 128 GB RAM, 2x2 TB NVMe SSD | |
| Core i5-13500 Server (64GB) | 64 GB RAM, 2x500 GB NVMe SSD | |
| Core i5-13500 Server (128GB) | 128 GB RAM, 2x500 GB NVMe SSD | |
| Core i5-13500 Workstation | 64 GB DDR5 RAM, 2 NVMe SSD, NVIDIA RTX 4000 |
AMD-Based Server Configurations
| Configuration | Specifications | Benchmark |
|---|---|---|
| Ryzen 5 3600 Server | 64 GB RAM, 2x480 GB NVMe | CPU Benchmark: 17849 |
| Ryzen 7 7700 Server | 64 GB DDR5 RAM, 2x1 TB NVMe | CPU Benchmark: 35224 |
| Ryzen 9 5950X Server | 128 GB RAM, 2x4 TB NVMe | CPU Benchmark: 46045 |
| Ryzen 9 7950X Server | 128 GB DDR5 ECC, 2x2 TB NVMe | CPU Benchmark: 63561 |
| EPYC 7502P Server (128GB/1TB) | 128 GB RAM, 1 TB NVMe | CPU Benchmark: 48021 |
| EPYC 7502P Server (128GB/2TB) | 128 GB RAM, 2 TB NVMe | CPU Benchmark: 48021 |
| EPYC 7502P Server (128GB/4TB) | 128 GB RAM, 2x2 TB NVMe | CPU Benchmark: 48021 |
| EPYC 7502P Server (256GB/1TB) | 256 GB RAM, 1 TB NVMe | CPU Benchmark: 48021 |
| EPYC 7502P Server (256GB/4TB) | 256 GB RAM, 2x2 TB NVMe | CPU Benchmark: 48021 |
| EPYC 9454P Server | 256 GB RAM, 2x2 TB NVMe |
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⚠️ *Note: All benchmark scores are approximate and may vary based on configuration. Server availability subject to stock.* ⚠️