Cooling System Details

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Cooling System Details: High-Density Compute Server Configuration

This document details the cooling system employed in our high-density compute server configuration, codenamed "Polaris". This system is designed to support sustained peak performance in demanding workloads. We will cover hardware specifications, performance characteristics, recommended use cases, comparisons to similar configurations, and crucial maintenance considerations.

1. Hardware Specifications

The Polaris configuration is built around maximizing compute density and maintaining thermal stability. The cooling system is designed to handle a Thermal Design Power (TDP) of up to 400W per 1U server node.

Component Specification Manufacturer/Model Notes
CPU Dual Intel Xeon Platinum 8480+ (56 cores/112 threads per CPU) Intel 350W TDP each, utilizing Intel Advanced Vector Extensions 512 (AVX-512)
RAM 2TB DDR5 ECC Registered, 5600MHz Samsung/Micron 16 x 128GB DIMMs, configured for maximum bandwidth. See Memory Subsystem Design for details.
Storage 8 x 7.68TB NVMe PCIe Gen4 SSDs (RAID 0) Samsung PM1735 High-performance, low-latency storage for demanding applications. See Storage Configuration Details.
Network Interface Dual 400GbE Network Adapters Mellanox ConnectX-7 RDMA over Converged Ethernet (RoCE) support for low-latency networking. See Network Topology for more information.
Power Supply 2 x 3000W Redundant 80+ Titanium PSU Supermicro Provides ample power and redundancy. See Power Distribution Units (PDUs) for details.
Chassis 1U Rackmount Server Chassis Supermicro SuperChassis 847E16-R1200B Designed for high airflow and component density.
Cooling System Direct-to-Chip Liquid Cooling (D2C) Asetek RackCDU D2C Specifically designed for high-TDP processors. See Liquid Cooling System Architecture
Fans Redundant Hot-Swappable Fan Modules (8 total) Delta Electronics Provides chassis airflow to support heat exchange with the liquid cooling loop. See Chassis Airflow Management.

1.1 Detailed Cooling System Components

The core of the cooling system is the Asetek RackCDU D2C solution. This consists of:

  • **Cold Plates:** Custom-designed cold plates, directly mounted on both CPUs, transferring heat to the coolant. These are made of oxygen-free high conductivity copper. Contact surface is maximized through micro-pin fin structures. See Cold Plate Design Considerations.
  • **Coolant Distribution Unit (CDU):** The CDU houses the pump, radiator, and reservoir. It circulates coolant through the cold plates, dissipating heat through a high-efficiency radiator. The CDU is located in the rear of the server rack. See CDU Maintenance Procedures.
  • **Radiator:** A large surface area radiator with high fin density, optimized for airflow from the chassis fans. Material: Aluminum alloy with specialized thermal coating.
  • **Pump:** A high-flow, low-noise pump ensures efficient coolant circulation. Redundancy is built-in with automatic failover. See Pump Performance Analysis.
  • **Coolant:** A non-conductive, specially formulated dielectric coolant (propylene glycol based) is used to maximize heat transfer and prevent corrosion. See Coolant Properties and Safety.
  • **Flow Sensors:** Monitor coolant flow rate to detect potential issues like pump failure or blockage.
  • **Temperature Sensors:** Strategically placed sensors monitor coolant and component temperatures.
  • **Leak Detection:** Integrated leak detection system provides alerts in the event of coolant leakage. See Leak Detection System Specifications.
  • **Control System:** A sophisticated control system regulates pump speed and fan speed based on temperature readings, optimizing cooling performance and minimizing noise. See Cooling System Control Algorithms.

2. Performance Characteristics

The Polaris configuration, with its advanced cooling system, exhibits exceptional performance under sustained load.

  • **CPU Temperature:** Under 100% load (using Prime95 and Intel® MPI Benchmark), CPU temperatures are consistently maintained below 75°C. This allows for sustained boost clock speeds without thermal throttling. See Thermal Throttling Prevention.
  • **SSD Temperature:** NVMe SSD temperatures are maintained below 80°C, ensuring optimal performance and longevity. Airflow from the chassis fans directly cools the SSDs.
  • **Benchmark Results:**
   *   **SPEC CPU 2017:**
       *   SPECrate®2017_fp_base: 285.2
       *   SPECspeed®2017_int_base: 185.7
   *   **Linpack:**  Achieves a sustained performance of 5.2 PFLOPS.
   *   **IOzone:**  Read/Write speeds exceeding 12 GB/s.
  • **Power Consumption:** The system typically consumes between 1200W and 1600W under full load, depending on the workload.
  • **Acoustic Noise:** Despite the high performance, the noise level is managed effectively. The system generates approximately 75 dBA at full load, which is within acceptable limits for a data center environment. Fan speed modulation plays a crucial role in noise reduction. See Acoustic Noise Reduction Techniques.

3. Recommended Use Cases

The Polaris configuration is ideal for applications that demand high computational power and sustained performance, including:

  • **High-Performance Computing (HPC):** Scientific simulations, weather forecasting, computational fluid dynamics.
  • **Artificial Intelligence (AI) / Machine Learning (ML):** Deep learning training, inference serving.
  • **Data Analytics:** Large-scale data processing, real-time analytics.
  • **Financial Modeling:** Complex financial simulations, risk management.
  • **Video Encoding/Transcoding:** High-resolution video processing.
  • **Virtual Desktop Infrastructure (VDI):** Supporting a large number of virtual desktops with demanding graphics requirements. See VDI Performance Optimization.
  • **Database Applications:** High-throughput database servers requiring low latency.

4. Comparison with Similar Configurations

The Polaris configuration is often compared to air-cooled high-density servers and other liquid-cooled solutions.

Configuration Cooling System Max TDP per Server Performance Cost Complexity
Polaris (D2C Liquid Cooling) Direct-to-Chip Liquid Cooling 400W Excellent (sustained performance) High Moderate
Air-cooled High-Density Server High-Speed Fans & Heatsinks 300W Good (prone to thermal throttling) Moderate Low
Immersion Cooling Submerged in Dielectric Fluid 500W+ Excellent (potentially better than D2C) Very High High
Rear Door Heat Exchanger (RDHx) Air-to-Liquid Heat Exchanger 350W Good (requires optimized airflow) Moderate Moderate
    • Comparison Notes:**
  • **Air-cooled servers:** While more affordable and simpler to maintain, air-cooled servers struggle to effectively cool high-TDP processors, leading to thermal throttling and reduced performance.
  • **Immersion cooling:** Offers superior cooling performance but involves significantly higher upfront costs and complexity, and requires specialized fluids and infrastructure. See Immersion Cooling Technology Overview.
  • **RDHx:** Provides improved cooling compared to traditional air cooling, but requires careful rack design and airflow management.

5. Maintenance Considerations

Maintaining the Polaris cooling system is crucial for ensuring its long-term reliability and performance.

  • **Coolant Level Check:** The coolant level should be checked every 6 months. Top up as needed with the specified dielectric coolant.
  • **Leak Inspection:** Regularly inspect the entire cooling loop for any signs of leakage. Pay close attention to connections and seals.
  • **Radiator Cleaning:** The radiator should be cleaned every 3-6 months to remove dust and debris, which can reduce its cooling efficiency. Use compressed air and a soft brush. See Radiator Cleaning Best Practices.
  • **Pump Monitoring:** Monitor pump flow rate and temperature. Replace the pump if it shows signs of failure.
  • **Fan Maintenance:** Inspect and replace fan modules as needed. Redundant fans provide continued operation during maintenance.
  • **Coolant Replacement:** The coolant should be replaced every 2-3 years to prevent corrosion and maintain its thermal properties.
  • **Power Requirements:** The system requires a dedicated 208V, 30A power circuit per server node. Ensure adequate power capacity and redundancy. See Data Center Power Infrastructure.
  • **BIOS/Firmware Updates:** Regularly update the server BIOS and cooling system firmware to benefit from performance improvements and bug fixes. See Server Firmware Management.
  • **Environmental Monitoring:** Continuously monitor ambient temperature and humidity in the data center. Maintain optimal conditions to maximize cooling efficiency. See Data Center Environmental Control.
  • **Pressure Testing:** Annually perform a pressure test on the cooling loop to ensure there are no leaks or weaknesses.

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Intel-Based Server Configurations

Configuration Specifications Benchmark
Core i7-6700K/7700 Server 64 GB DDR4, NVMe SSD 2 x 512 GB CPU Benchmark: 8046
Core i7-8700 Server 64 GB DDR4, NVMe SSD 2x1 TB CPU Benchmark: 13124
Core i9-9900K Server 128 GB DDR4, NVMe SSD 2 x 1 TB CPU Benchmark: 49969
Core i9-13900 Server (64GB) 64 GB RAM, 2x2 TB NVMe SSD
Core i9-13900 Server (128GB) 128 GB RAM, 2x2 TB NVMe SSD
Core i5-13500 Server (64GB) 64 GB RAM, 2x500 GB NVMe SSD
Core i5-13500 Server (128GB) 128 GB RAM, 2x500 GB NVMe SSD
Core i5-13500 Workstation 64 GB DDR5 RAM, 2 NVMe SSD, NVIDIA RTX 4000

AMD-Based Server Configurations

Configuration Specifications Benchmark
Ryzen 5 3600 Server 64 GB RAM, 2x480 GB NVMe CPU Benchmark: 17849
Ryzen 7 7700 Server 64 GB DDR5 RAM, 2x1 TB NVMe CPU Benchmark: 35224
Ryzen 9 5950X Server 128 GB RAM, 2x4 TB NVMe CPU Benchmark: 46045
Ryzen 9 7950X Server 128 GB DDR5 ECC, 2x2 TB NVMe CPU Benchmark: 63561
EPYC 7502P Server (128GB/1TB) 128 GB RAM, 1 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (128GB/2TB) 128 GB RAM, 2 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (128GB/4TB) 128 GB RAM, 2x2 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (256GB/1TB) 256 GB RAM, 1 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (256GB/4TB) 256 GB RAM, 2x2 TB NVMe CPU Benchmark: 48021
EPYC 9454P Server 256 GB RAM, 2x2 TB NVMe

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