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Latest revision as of 21:17, 2 October 2025
Server Benchmarking Configuration Profile: High-Throughput Compute Platform (HTCP-8000)
This document details the technical specifications, performance characteristics, recommended applications, competitive analysis, and maintenance requirements for the High-Throughput Compute Platform (HTCP-8000), a standardized server configuration designed specifically for intensive, repeatable system benchmarking and performance validation.
1. Hardware Specifications
The HTCP-8000 is built upon a two-socket (2S) motherboard architecture, prioritizing high core density, massive memory bandwidth, and low-latency NVMe storage access. Standardization is key to ensure reliable, repeatable test results across different environments.
1.1 Central Processing Units (CPUs)
The configuration utilizes dual Intel Xeon Scalable Processors (4th Generation, codename Sapphire Rapids), selected for their high core count, extensive L3 cache, and support for advanced vector extensions (AVX-512 and AMX).
| Parameter | Specification | Notes |
|---|---|---|
| CPU Model | 2 x Intel Xeon Platinum 8480+ | High-end, maximum core count variant |
| Core Count (Total) | 112 Cores (56P + 56P) | Physical cores only |
| Thread Count (Total) | 224 Threads | Assuming Hyper-Threading is enabled for general workloads |
| Base Clock Frequency | 2.4 GHz | |
| Max Turbo Frequency (Single Core) | Up to 3.8 GHz | |
| L3 Cache (Total) | 112 MB per socket (224 MB Aggregate) | Critical for memory-intensive benchmarks |
| TDP (Per Socket) | 350W | |
| Instruction Sets Supported | SSE4.2, AVX, AVX2, AVX-512, AMX | Essential for modern HPC workloads |
1.2 System Memory (RAM)
Memory configuration is optimized for maximum bandwidth utilization, leveraging the 8-channel memory controller present on the specified CPUs. All DIMMs are configured in a balanced, population-optimized layout to ensure peak dual-channel performance across both sockets.
| Parameter | Specification | Notes |
|---|---|---|
| Total Capacity | 2048 GB (2 TB) | Standardized high-capacity setup |
| Configuration | 16 x 128 GB DDR5 RDIMM | 8 slots populated per CPU socket |
| Memory Speed | DDR5-4800 MT/s | JEDEC standard for maximum stability at high population |
| Error Correction | ECC (Error-Correcting Code) | Mandatory for data integrity in long-running tests |
| Memory Channels Utilized | 16 (8 per socket) |
For detailed analysis on memory bandwidth optimization techniques, refer to the relevant documentation.
1.3 Storage Subsystem
Storage is partitioned into three distinct tiers to accurately measure I/O performance across different latency profiles: the OS/Boot drive, the Scratch/Working set, and the Persistent Logging/Results drive.
| Tier | Component | Quantity | Capacity | Interface/Protocol |
|---|---|---|---|---|
| Boot/OS | NVMe M.2 SSD (Enterprise Grade) | 2 (RAID 1) | 960 GB | PCIe 4.0 x4 |
| Primary Benchmark (Scratch) | U.2 NVMe SSD (High Endurance) | 8 | 7.68 TB (Raw) | PCIe 4.0 (via dedicated HBA/RAID Card) |
| Secondary Logging | SATA SSD (Value Endurance) | 2 (RAID 1) | 3.84 TB | SATA 6Gb/s |
The 8x U.2 NVMe drives are configured using a dedicated PCIe Switch/HBA that presents them directly to the CPU PCIe lanes, bypassing potential bottlenecks in chipset routing. This setup allows for sustained, high IOPS reads/writes necessary for stress testing.
1.4 Networking Infrastructure
The system includes dual, high-speed network interfaces to support both management traffic and high-throughput data transfer during distributed testing.
| Interface | Speed | Purpose |
|---|---|---|
| Management (BMC) | 1GbE Baseboard Management Controller (BMC) | Out-of-band monitoring |
| Primary Data Link | 2 x 200GbE QSFP-DD | In-band high-speed testing (e.g., network storage simulation) |
The 200GbE interfaces utilize RoCEv2 capabilities where supported by the application stack to minimize CPU overhead during data movement.
1.5 Motherboard and Chassis
The platform is built on a proprietary, high-density 2U rackmount chassis designed for optimal airflow and dense component packing.
- **Motherboard:** Dual-Socket Server Board supporting C741 Chipset (or equivalent enterprise platform).
- **PCIe Slots:** Minimum of 8 x PCIe 5.0 x16 slots available for expansion (although only 2 are used for the storage controller).
- **Form Factor:** 2U Rackmount.
- **Baseboard Management:** IPMI 2.0 compliant BMC with Redfish support.
2. Performance Characteristics
The HTCP-8000 is designed not just for raw power, but for *consistent* power delivery, minimizing thermal throttling and ensuring that measured performance accurately reflects the hardware ceiling.
2.1 Synthetic Benchmarks
Synthetic benchmarks are used to isolate specific hardware components and measure theoretical maximum throughput.
2.1.1 CPU Compute Performance (SPECrate 2017)
The configuration excels in compute-bound tasks, particularly those benefiting from high core count and vector processing capabilities.
| Benchmark Suite | Score (Reference System Baseline = 1.0) | Notes |
|---|---|---|
| SPECrate 2017 Integer | ~2100 | High multi-threaded performance validation |
| SPECrate 2017 Floating Point | ~2350 | Excellent FP throughput due to AVX-512 utilization |
The high score is directly attributable to the dual 56-core configuration and the efficiency of the AMX units when leveraged by compatible compilers and workloads.
2.1.2 Memory Bandwidth and Latency
Testing tools like STREAM (for bandwidth) and specialized memory latency checkers are essential.
| Metric | Result (Aggregate) | Target Goal |
|---|---|---|
| STREAM Triad Bandwidth | ~650 GB/s | >90% of theoretical maximum for DDR5-4800 16-channel |
| Memory Latency (Read, 128-byte block) | ~75 ns | Reflects the overhead of dual-socket communication (NUMA latency) |
The measured NUMA latency (the time taken for one socket to access memory owned by the other socket) is consistently measured at approximately 120ns, confirming the efficiency of the Ultra Path Interconnect (UPI) links.
2.2 Storage I/O Benchmarks
Storage performance is critical for database and high-frequency trading simulation workloads. We use FIO (Flexible I/O Tester) to characterize the NVMe array.
2.2.1 Sustained Random I/O (IOPS)
Testing involves 4K block size, 100% random access, 100% queue depth (QD) 128, reading from the 8x U.2 NVMe array configured in a striped LVM volume.
- **4K Random Read IOPS:** Consistently exceeds 4.5 Million IOPS.
- **4K Random Write IOPS:** Sustained between 3.8 Million and 4.2 Million IOPS before hitting thermal or controller limits.
2.2.2 Sequential Throughput (Bandwidth)
Testing involves 1MB block size, sequential access across the entire array capacity.
- **Sequential Read Throughput:** Achieves 48 GB/s.
- **Sequential Write Throughput:** Sustained at 42 GB/s.
These results demonstrate that the HTCP-8000 configuration provides near-theoretical PCIe 4.0 saturation for storage operations, a crucial factor when evaluating SAN performance against local storage.
2.3 Thermal and Power Characteristics
To ensure benchmark repeatability, the cooling solution must maintain CPU core temperatures below a critical threshold (Tj Max - 10°C) under full load.
- **Idle Power Draw (Measured at PSU input):** ~210W
- **Full Load Power Draw (All components maxed):** ~1550W
- **Thermal Headroom:** Under continuous 100% load (Prime95 Small FFTs), the maximum recorded steady-state core temperature is 84°C, providing 11°C headroom before throttling initiates (based on Tj Max of 95°C for this SKU).
This thermal stability is achieved through the specialized 2U chassis featuring redundant, high-static-pressure fans synchronized via the BMC to maintain a consistent cooling profile, as detailed in Server Cooling System Design.
3. Recommended Use Cases
The HTCP-8000 configuration is specifically engineered for environments where performance validation, high-fidelity simulation, and repeatable stress testing are paramount.
3.1 High-Fidelity Computational Fluid Dynamics (CFD)
CFD simulations heavily rely on high floating-point throughput and the ability to manage vast, complex datasets in memory quickly.
- **Benefit:** The high DDR5 bandwidth and strong AVX-512 capabilities accelerate the iterative solver stages common in CFD codes like OpenFOAM or Ansys Fluent.
- **Requirement Met:** The 2TB of fast RAM allows for running mid-to-large scale meshes entirely in memory, avoiding slow disk swapping.
3.2 Database Transaction Processing Simulation (OLTP)
For testing the scalability and latency tolerance of enterprise database systems (e.g., Oracle, SQL Server, or distributed systems like CockroachDB), the storage subsystem is the key differentiator.
- **Benefit:** The high-IOPS NVMe array simulates the rapid read/write patterns of high-concurrency OLTP workloads, allowing engineers to precisely measure transaction commit times under stress.
- **Requirement Met:** The system can sustain over 4 million 4K random reads, stressing the database buffer pool management effectively. See Database I/O Profiling Techniques.
3.3 Compiler and Software Build Farms
In environments requiring the continuous compilation of massive codebases (e.g., kernel builds, large enterprise Java applications), parallelism is crucial.
- **Benefit:** The 112 physical cores allow for maximizing parallel compilation jobs (`make -j 112`), drastically reducing build times and improving developer iteration cycles.
3.4 Virtualization Density Testing
When testing the maximum density of virtual machines (VMs) per host, the HTCP-8000 provides a high baseline.
- **Benefit:** While lower core clock speeds might favor single-threaded performance, the sheer core count and memory capacity allow for provisioning a greater number of moderately sized VMs (e.g., 16GB RAM, 4 Cores each) before resource contention becomes the limiting factor.
For environments requiring extreme single-thread clock speed over core count, the HTCP-Light Configuration should be considered.
4. Comparison with Similar Configurations
To understand the value proposition of the HTCP-8000, it must be compared against configurations optimized for different primary metrics: raw clock speed and pure storage density.
4.1 Comparison Table: Compute vs. Storage Focus
This table contrasts the HTCP-8000 (Balanced High-Throughput) against a Clock-Speed Optimized Server (CSO) and a Storage Density Server (SDS).
| Feature | HTCP-8000 (This Spec) | CSO (Clock Speed Optimized) | SDS (Storage Density Optimized) |
|---|---|---|---|
| CPU Model (Example) | 2x Xeon Platinum 8480+ (56C/P) | 2x Xeon Gold 6448Y (24C/P, Higher Clock) | 2x Xeon Silver 4410Y (12C/P, Lower TDP) |
| Total Cores (Physical) | 112 | 48 | 24 |
| Memory Capacity | 2048 GB (DDR5-4800) | 1024 GB (DDR5-5600) | 512 GB (DDR5-4800) |
| Peak Single-Thread Clock | ~3.8 GHz | ~4.4 GHz | ~3.5 GHz |
| Primary Storage (NVMe Slots) | 8 x U.2 PCIe 4.0 | 4 x M.2 PCIe 5.0 | 24 x 2.5" U.2/E1.S PCIe 4.0 |
| Aggregate IOPS (4K R) | >4.5 Million | ~2.5 Million (Due to fewer drives) | >7 Million (Due to software RAID configuration) |
4.2 Analysis of Comparison
- **HTCP-8000 Advantage:** The HTCP-8000 strikes the best balance for *general* benchmarking. Its high core count handles multi-threaded simulation scaling well, while the robust 8-drive NVMe pool provides excellent I/O headroom without sacrificing memory capacity. It is the optimal system for measuring how an application scales across both CPU and I/O resources simultaneously.
- **CSO Suitability:** The CSO configuration is superior for legacy applications or specific algorithms (e.g., older Java application servers, certain Monte Carlo simulations) that are poorly threaded or highly sensitive to single-thread latency. It trades core count for raw clock speed, which is visible in single-thread performance metrics.
- **SDS Suitability:** The SDS configuration is the choice when the bottleneck is proven to be storage capacity or raw IOPS density (e.g., massive log ingestion pipelines or high-scale NoSQL key-value stores). It sacrifices CPU and RAM capacity to maximize the number of physical drives.
For detailed cost analysis relative to performance gains, consult the TCO Modeling guide.
5. Maintenance Considerations
Maintaining the HTCP-8000 requires attention to power delivery, thermal management, and firmware synchronization, given the density of the components.
5.1 Power Requirements and Redundancy
The system's peak draw of 1550W necessitates robust power infrastructure.
- **PSU Specification:** The chassis must be equipped with redundant 2000W (Platinum or Titanium efficiency) hot-swappable power supplies.
- **Input Requirements:** Must be connected to a UPS capable of sustaining the load for a minimum of 15 minutes. For continuous benchmarking, dedicated 20A circuits (or equivalent PDU capacity) are mandatory to prevent power-throttling events during peak load spikes.
- **Power Capping:** The Integrated Baseboard Management Controller (BMC) must be configured to allow dynamic power capping only as a safety measure, not as a performance limiter. The default setting mandates allowing the system to draw up to 1600W for short bursts if the physical PSU rating allows.
5.2 Thermal Management and Airflow
The high TDP of the CPUs (350W each) means heat rejection is the primary maintenance challenge.
- **Data Center Environment:** Requires a minimum of 24°C (75°F) ambient intake air temperature. Higher temperatures will force the fans into maximum RPM, increasing acoustic output and accelerating fan bearing wear.
- **Fan Configuration:** The system utilizes 6x hot-swappable, redundant fans. Regular inspection for dust accumulation on fan blades and heat sink fins is critical. A drop in airflow efficiency by just 5% can increase CPU temperature by 3-5°C under load. Refer to the Preventative Hardware Maintenance Schedule for cleaning intervals.
- **Liquid Cooling Potential:** While not standard, the chassis supports optional rear-door heat exchangers. For extreme overclocking or running sustained workloads beyond the 350W TDP, investigating Direct-to-Chip Liquid Cooling integration may be required.
5.3 Firmware and Driver Synchronization
Benchmark repeatability hinges on the consistency of the underlying firmware stack. Any deviation in BIOS settings or driver versions can invalidate results.
- **BIOS/UEFI:** Must be maintained at the latest stable version provided by the OEM. Specific settings that must be locked down include:
* UPI Link Speed: Set to Max Performance (typically 11.2 GT/s or higher). * Intel Speed Select Technology (SST): Disabled or set to 'Performance Profile' to prevent dynamic frequency scaling from interfering with sustained clock measurement. * Memory Training: Verify the memory training sequence completes successfully upon every cold boot.
- **Storage Controller Firmware:** The dedicated HBA/RAID controller managing the NVMe array must have an identical firmware revision across all benchmarking nodes. Outdated firmware can lead to inconsistent wear-leveling algorithms, causing performance degradation over time.
- **Operating System Configuration:** The standard OS for this platform is a specific build of Linux (e.g., RHEL 9.x or Ubuntu LTS) utilizing the latest stable kernel release, ensuring optimal support for PCIe 5.0 drivers and memory management units (MMU).
5.4 Component Lifespan and Replacement
Due to the high utilization profile, component lifespan must be actively monitored.
- **NVMe Endurance:** The primary benchmark drives (U.2) are high-endurance (rated for >1.5 Drive Writes Per Day - DWPD). Monitoring tools must track the Total Bytes Written (TBW) and remaining endurance percentage. These drives should be proactively replaced when reaching 80% TBW, rather than waiting for failure, to maintain performance consistency.
- **DRAM Refresh Cycles:** While ECC memory mitigates data errors, extremely long-running tests can increase the frequency of internal DRAM refresh cycles. Monitoring memory error counters via BMC logs is a key diagnostic step, especially if uncorrectable errors begin to appear during extended stress tests.
---
Intel-Based Server Configurations
| Configuration | Specifications | Benchmark |
|---|---|---|
| Core i7-6700K/7700 Server | 64 GB DDR4, NVMe SSD 2 x 512 GB | CPU Benchmark: 8046 |
| Core i7-8700 Server | 64 GB DDR4, NVMe SSD 2x1 TB | CPU Benchmark: 13124 |
| Core i9-9900K Server | 128 GB DDR4, NVMe SSD 2 x 1 TB | CPU Benchmark: 49969 |
| Core i9-13900 Server (64GB) | 64 GB RAM, 2x2 TB NVMe SSD | |
| Core i9-13900 Server (128GB) | 128 GB RAM, 2x2 TB NVMe SSD | |
| Core i5-13500 Server (64GB) | 64 GB RAM, 2x500 GB NVMe SSD | |
| Core i5-13500 Server (128GB) | 128 GB RAM, 2x500 GB NVMe SSD | |
| Core i5-13500 Workstation | 64 GB DDR5 RAM, 2 NVMe SSD, NVIDIA RTX 4000 |
AMD-Based Server Configurations
| Configuration | Specifications | Benchmark |
|---|---|---|
| Ryzen 5 3600 Server | 64 GB RAM, 2x480 GB NVMe | CPU Benchmark: 17849 |
| Ryzen 7 7700 Server | 64 GB DDR5 RAM, 2x1 TB NVMe | CPU Benchmark: 35224 |
| Ryzen 9 5950X Server | 128 GB RAM, 2x4 TB NVMe | CPU Benchmark: 46045 |
| Ryzen 9 7950X Server | 128 GB DDR5 ECC, 2x2 TB NVMe | CPU Benchmark: 63561 |
| EPYC 7502P Server (128GB/1TB) | 128 GB RAM, 1 TB NVMe | CPU Benchmark: 48021 |
| EPYC 7502P Server (128GB/2TB) | 128 GB RAM, 2 TB NVMe | CPU Benchmark: 48021 |
| EPYC 7502P Server (128GB/4TB) | 128 GB RAM, 2x2 TB NVMe | CPU Benchmark: 48021 |
| EPYC 7502P Server (256GB/1TB) | 256 GB RAM, 1 TB NVMe | CPU Benchmark: 48021 |
| EPYC 7502P Server (256GB/4TB) | 256 GB RAM, 2x2 TB NVMe | CPU Benchmark: 48021 |
| EPYC 9454P Server | 256 GB RAM, 2x2 TB NVMe |
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⚠️ *Note: All benchmark scores are approximate and may vary based on configuration. Server availability subject to stock.* ⚠️