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```mediawiki Template:Infobox Server Configuration

Technical Documentation: Server Configuration Template:Stub

This document provides a comprehensive technical analysis of the Template:Stub reference configuration. This configuration is designed to serve as a standardized, baseline hardware specification against which more advanced or specialized server builds are measured. While the "Stub" designation implies a minimal viable product, its components are selected for stability, broad compatibility, and cost-effectiveness in standardized data center environments.

1. Hardware Specifications

The Template:Stub configuration prioritizes proven, readily available components that offer a balanced performance-to-cost ratio. It is designed to fit within standard 2U rackmount chassis dimensions, although specific chassis models may vary.

1.1. Central Processing Units (CPUs)

The configuration mandates a dual-socket (2P) architecture to ensure sufficient core density and memory channel bandwidth for general-purpose workloads.

Template:Stub CPU Configuration
Specification Detail (Minimum Requirement) Detail (Recommended Baseline)
Architecture Intel Xeon Scalable (Cascade Lake or newer preferred) or AMD EPYC (Rome or newer preferred) Intel Xeon Scalable Gen 3 (Ice Lake) or AMD EPYC Gen 3 (Milan)
Socket Count 2 2
Base TDP Range 95W – 135W per socket 120W – 150W per socket
Minimum Cores per Socket 12 Physical Cores 16 Physical Cores
Minimum Frequency (All-Core Turbo) 2.8 GHz 3.1 GHz
L3 Cache (Total) 36 MB Minimum 64 MB Minimum
Supported Memory Channels 6 or 8 Channels per socket 8 Channels per socket (for optimal I/O)

The selection of the CPU generation is crucial; while older generations may fit the "stub" moniker, modern stability and feature sets (such as AVX-512 or PCIe 4.0 support) are mandatory for baseline compatibility with contemporary operating systems and hypervisors.

1.2. Random Access Memory (RAM)

Memory capacity and speed are provisioned to support moderate virtualization density or large in-memory datasets typical of database caching layers. The configuration specifies DDR4 ECC Registered DIMMs (RDIMMs) or Load-Reduced DIMMs (LRDIMMs) depending on the required density ceiling.

Template:Stub Memory Configuration
Specification Detail
Type DDR4 ECC RDIMM/LRDIMM (DDR5 requirement for future revisions)
Total Capacity (Minimum) 128 GB
Total Capacity (Recommended) 256 GB
Configuration Strategy Fully populated memory channels (e.g., 8 DIMMs per CPU or 16 total)
Speed Rating (Minimum) 2933 MT/s
Speed Rating (Recommended) 3200 MT/s (or fastest supported by CPU/Motherboard combination)
Maximum Supported DIMM Rank Dual Rank (2R) preferred for stability

It is critical that the BIOS/UEFI is configured to utilize the maximum supported memory speed profile (e.g., XMP or JEDEC profiles) while maintaining stability under full load, adhering strictly to the Memory Interleaving guidelines for the specific motherboard chipset.

1.3. Storage Subsystem

The storage configuration emphasizes a tiered approach: a high-speed boot/OS volume and a larger, redundant capacity volume for application data. Direct Attached Storage (DAS) is the standard implementation.

Template:Stub Storage Layout (DAS)
Tier Component Type Quantity Capacity (per unit) Interface/Protocol
Boot/OS NVMe M.2 or U.2 SSD 2 (Mirrored) 480 GB Minimum PCIe 3.0/4.0 x4
Data/Application SATA or SAS SSD (Enterprise Grade) 4 to 6 1.92 TB Minimum SAS 12Gb/s (Preferred) or SATA III
RAID Controller Hardware RAID (e.g., Broadcom MegaRAID) 1 N/A PCIe 3.0/4.0 x8 interface required

The data drives must be configured in a RAID 5 or RAID 6 array for redundancy. The use of NVMe for the OS tier significantly reduces boot times and metadata access latency, a key improvement over older SATA-based stub configurations. Refer to RAID Levels documentation for specific array geometry recommendations.

1.4. Networking and I/O

Standardization on 10 Gigabit Ethernet (10GbE) is required for the management and primary data interfaces.

Template:Stub Networking and I/O
Component Specification Purpose
Primary Network Interface (Data) 2 x 10GbE SFP+ or Base-T (Configured in LACP/Active-Passive) Application Traffic, VM Networking
Management Interface (Dedicated) 1 x 1GbE (IPMI/iDRAC/iLO) Out-of-Band Management
PCIe Slots Utilization At least 2 x PCIe 4.0 x16 slots populated (for future expansion or high-speed adapters) Expansion for SAN connectivity or specialized accelerators

The onboard Baseboard Management Controller (BMC) must support modern standards, including HTML5 console redirection and secure firmware updates.

1.5. Power and Form Factor

The configuration is designed for high-density rack deployment.

  • **Form Factor:** 2U Rackmount Chassis (Standard 19-inch width).
  • **Power Supplies (PSUs):** Dual Redundant, Hot-Swappable, Platinum or Titanium Efficiency Rating (>= 92% efficiency at 50% load).
  • **Total Rated Power Draw (Peak):** Approximately 850W – 1100W (dependent on CPU TDP and storage configuration).
  • **Input Voltage:** 200-240V AC (Recommended for efficiency, though 110V support must be validated).

2. Performance Characteristics

The performance profile of the Template:Stub is defined by its balanced memory bandwidth and core count, making it a suitable platform for I/O-bound tasks that require moderate computational throughput.

2.1. Synthetic Benchmarks (Estimated)

The following benchmarks reflect expected performance based on the recommended component specifications (Ice Lake/Milan generation CPUs, 3200MT/s RAM).

Template:Stub Estimated Synthetic Performance
Benchmark Area Metric Expected Result Range Notes
CPU Compute (Integer/Floating Point) SPECrate 2017 Integer (Base) 450 – 550 Reflects multi-threaded efficiency.
Memory Bandwidth (Aggregate) Read/Write (GB/s) 180 – 220 GB/s Dependent on DIMM population and CPU memory controller quality.
Storage IOPS (Random 4K Read) Sustained IOPS (from RAID 5 Array) 150,000 – 220,000 IOPS Heavily influenced by RAID controller cache and drive type.
Network Throughput TCP/IP Throughput (iperf3) 19.0 – 19.8 Gbps (Full Duplex) Testing 2x 10GbE bonded link.

The key performance bottleneck in the Stub configuration, particularly when running high-vCPU density workloads, is often the memory subsystem's latency profile rather than raw core count, especially when the operating system or application attempts to access data across the Non-Uniform Memory Access boundary between the two sockets.

2.2. Real-World Performance Analysis

The Stub configuration excels in scenarios demanding high I/O consistency rather than peak computational burst capacity.

  • **Database Workloads (OLTP):** Handles transactional loads requiring moderate connections (up to 500 concurrent active users) effectively, provided the working set fits within the 256GB RAM allocation. Performance degradation begins when the workload triggers significant page faults requiring reliance on the SSD tier.
  • **Web Serving (Apache/Nginx):** Capable of serving tens of thousands of concurrent requests per second (RPS) for static or moderately dynamic content, limited primarily by network saturation or CPU instruction pipeline efficiency under heavy SSL/TLS termination loads.
  • **Container Orchestration (Kubernetes Node):** Functions optimally as a worker node supporting 40-60 standard microservices containers, where the CPU cores provide sufficient scheduling capacity, and the 10GbE networking allows for rapid service mesh communication.

3. Recommended Use Cases

The Template:Stub configuration is not intended for high-performance computing (HPC) or extreme data analytics but serves as an excellent foundation for robust, general-purpose infrastructure.

3.1. Virtualization Host (Mid-Density)

This configuration is ideal for hosting a consolidated environment where stability and resource isolation are paramount.

  • **Target Density:** 8 to 15 Virtual Machines (VMs) depending on the VM profile (e.g., 8 powerful Windows Server VMs or 15 lightweight Linux application servers).
  • **Hypervisor Support:** Full compatibility with VMware vSphere, Microsoft Hyper-V, and Kernel-based Virtual Machine.
  • **Benefit:** The dual-socket architecture ensures sufficient PCIe lanes for multiple virtual network interface cards (vNICs) and provides ample physical memory for guest allocation.

3.2. Application and Web Servers

For standard three-tier application architectures, the Stub serves well as the application or web tier.

  • **Backend API Tier:** Suitable for hosting RESTful services written in languages like Java (Spring Boot), Python (Django/Flask), or Go, provided the application memory footprint remains within the physical RAM limits.
  • **Load Balancing Target:** Excellent as a target for Network Load Balancing (NLB) clusters, offering predictable latency and throughput.

3.3. Jump Box / Bastion Host and Management Server

Due to its robust, standardized hardware, the Stub is highly reliable for critical management functions.

  • **Configuration Management:** Running Ansible Tower, Puppet Master, or Chef Server. The storage subsystem provides fast configuration deployment and log aggregation.
  • **Monitoring Infrastructure:** Hosting Prometheus/Grafana or ELK stack components (excluding large-scale indexing nodes).

3.4. File and Backup Target

When configured with a higher count of high-capacity SATA/SAS drives (exceeding the 6-drive minimum), the Stub becomes a capable, high-throughput Network Attached Storage (NAS) target utilizing technologies like ZFS or Windows Storage Spaces.

4. Comparison with Similar Configurations

To contextualize the Template:Stub, it is useful to compare it against its immediate predecessors (Template:Legacy) and its successors (Template:HighDensity).

4.1. Configuration Matrix Comparison

Configuration Comparison Table
Feature Template:Stub (Baseline) Template:Legacy (10/12 Gen Xeon) Template:HighDensity (1S/HPC Focus)
CPU Sockets 2P 2P 1S (or 2P with extreme core density)
Max RAM (Typical) 256 GB 128 GB 768 GB+
Primary Storage Interface PCIe 4.0 NVMe (OS) + SAS/SATA SSDs PCIe 3.0 SATA SSDs only All NVMe U.2/AIC
Network Speed 10GbE Standard 1GbE Standard 25GbE or 100GbE Mandatory
Power Efficiency Rating Platinum/Titanium Gold Titanium (Extreme Density Optimization)
Cost Index (Relative) 1.0x 0.6x 2.5x+

The Stub configuration represents the optimal point for balancing current I/O requirements (10GbE, PCIe 4.0) against legacy infrastructure compatibility, whereas the Template:Legacy is constrained by slower interconnects and less efficient power delivery.

4.2. Performance Trade-offs

The primary trade-off when moving from the Stub to the Template:HighDensity configuration involves the shift from balanced I/O to raw compute.

  • **Stub Advantage:** Superior I/O consistency due to the dedicated RAID controller and dual-socket memory architecture providing high aggregate bandwidth.
  • **HighDensity Disadvantage (in this context):** Single-socket (1S) high-density configurations, while offering more cores per watt, often suffer from reduced memory channel access (e.g., 6 channels vs. 8 channels per CPU), leading to lower sustained memory bandwidth under full virtualization load.

5. Maintenance Considerations

Maintaining the Template:Stub requires adherence to standard enterprise server practices, with specific attention paid to thermal management due to the dual-socket high-TDP components.

5.1. Thermal Management and Cooling

The dual-socket design generates significant heat, necessitating robust cooling infrastructure.

  • **Airflow Requirements:** Must maintain a minimum front-to-back differential pressure of 0.4 inches of water column (in H2O) across the server intake area.
  • **Component Specifics:** CPUs rated above 150W TDP require high-static pressure fans integrated into the chassis, often exceeding the performance of standard cooling solutions designed for single-socket, low-TDP hardware.
  • **Hot Aisle Containment:** Deployment within a hot-aisle/cold-aisle containment strategy is highly recommended to maximize chiller efficiency and prevent thermal throttling, especially during peak operation when all turbo frequencies are engaged.

5.2. Power Requirements and Redundancy

The redundant power supplies (N+1 or 2N configuration) must be connected to diverse power paths whenever possible.

  • **PDU Load Balancing:** The total calculated power draw (approaching 1.1kW peak) means that servers should be distributed across multiple Power Distribution Units (PDUs) to avoid overloading any single circuit breaker in the rack infrastructure.
  • **Firmware Updates:** Regular firmware updates for the BMC, BIOS/UEFI, and RAID controller are mandatory to ensure compatibility with new operating system kernels and security patches (e.g., addressing Spectre variants).

5.3. Operating System and Driver Lifecycle

The longevity of the Stub configuration relies heavily on vendor support for the chosen CPU generation.

  • **Driver Validation:** Before deploying any major OS patch or hypervisor upgrade, all hardware drivers (especially storage controller and network card firmware) must be validated against the vendor's Hardware Compatibility List (HCL).
  • **Diagnostic Tools:** The BMC must be configured to stream diagnostic logs (e.g., Intelligent Platform Management Interface sensor readings) to a central System Monitoring platform for proactive failure prediction.

The stability of the Template:Stub ensures that maintenance windows are predictable, typically only required for major component replacements (e.g., PSU failure or expected drive rebuilds) rather than frequent stability patches.


Intel-Based Server Configurations

Configuration Specifications Benchmark
Core i7-6700K/7700 Server 64 GB DDR4, NVMe SSD 2 x 512 GB CPU Benchmark: 8046
Core i7-8700 Server 64 GB DDR4, NVMe SSD 2x1 TB CPU Benchmark: 13124
Core i9-9900K Server 128 GB DDR4, NVMe SSD 2 x 1 TB CPU Benchmark: 49969
Core i9-13900 Server (64GB) 64 GB RAM, 2x2 TB NVMe SSD
Core i9-13900 Server (128GB) 128 GB RAM, 2x2 TB NVMe SSD
Core i5-13500 Server (64GB) 64 GB RAM, 2x500 GB NVMe SSD
Core i5-13500 Server (128GB) 128 GB RAM, 2x500 GB NVMe SSD
Core i5-13500 Workstation 64 GB DDR5 RAM, 2 NVMe SSD, NVIDIA RTX 4000

AMD-Based Server Configurations

Configuration Specifications Benchmark
Ryzen 5 3600 Server 64 GB RAM, 2x480 GB NVMe CPU Benchmark: 17849
Ryzen 7 7700 Server 64 GB DDR5 RAM, 2x1 TB NVMe CPU Benchmark: 35224
Ryzen 9 5950X Server 128 GB RAM, 2x4 TB NVMe CPU Benchmark: 46045
Ryzen 9 7950X Server 128 GB DDR5 ECC, 2x2 TB NVMe CPU Benchmark: 63561
EPYC 7502P Server (128GB/1TB) 128 GB RAM, 1 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (128GB/2TB) 128 GB RAM, 2 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (128GB/4TB) 128 GB RAM, 2x2 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (256GB/1TB) 256 GB RAM, 1 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (256GB/4TB) 256 GB RAM, 2x2 TB NVMe CPU Benchmark: 48021
EPYC 9454P Server 256 GB RAM, 2x2 TB NVMe

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⚠️ *Note: All benchmark scores are approximate and may vary based on configuration. Server availability subject to stock.* ⚠️ Chipset Features: A Deep Dive into the AMD EPYC 7003 Series Platform

This document provides a detailed technical overview of server configurations built around the AMD EPYC 7003 series processors, with a focus on the chipset features and resulting system capabilities. This configuration represents a high-performance, scalable platform suitable for a variety of demanding workloads.

1. Hardware Specifications

This section outlines the key components and specifications of a typical server based on the AMD EPYC 7003 series. We will focus on a 2-socket configuration, as it represents a common deployment model. Variations exist, but this provides a solid baseline understanding. The chipset in question is the AMD SP3 (Socket SP3), bringing substantial improvements over previous generations.

Component Specification
CPU 2 x AMD EPYC 7763 (64-Core, 128 Threads, 2.45 GHz Base, 3.5 GHz Boost)
Chipset AMD SP3
Memory 16 x 32GB DDR4-3200 ECC Registered DIMMs (512GB Total) – 8 DIMMs per socket
Memory Channels 8 channels per CPU (64 DIMM slots total, utilizing all 8 channels for optimal bandwidth)
Storage 8 x 4TB NVMe PCIe Gen4 SSDs (RAID 10 Configuration)
Storage Controller AMD SP3 Integrated SATA/SAS Controller + Broadcom SAS/SATA HBA (Hardware RAID)
Network Interface 2 x 100GbE Network Interface Cards (NICs) - Mellanox ConnectX-6 Dx
Expansion Slots 7 x PCIe 4.0 x16 slots per socket (configured for various adapters)
Power Supply 2 x 1600W Redundant 80+ Platinum Power Supplies
Motherboard Supermicro H12SSL-NT (Example – variations exist)
BIOS UEFI AMI BIOS with IPMI 2.0 Support
Cooling High-Performance Air Cooling (Heatsinks and Fans) – Liquid cooling optional
Form Factor 2U Rackmount Chassis

Detailed Explanation of Key Components:

  • CPU: The AMD EPYC 7763 is a high-core-count processor designed for heavily threaded applications. Its high clock speeds and large cache contribute to excellent performance. See CPU Architecture for more details on AMD's core designs.
  • Chipset (AMD SP3): The SP3 chipset is critical. It provides the interconnect between the CPUs, memory, I/O, and other system components. It significantly increases PCIe lane availability compared to prior generations, crucial for modern accelerators like GPUs and high-speed network cards. The SP3 chipset also boasts improved power management capabilities. Refer to Chipset Functionality for a detailed breakdown.
  • Memory: DDR4-3200 ECC Registered DIMMs are used to maximize memory bandwidth and reliability. The 8-channel memory architecture of the EPYC processor allows for significantly higher memory throughput than previous-generation platforms. See Memory Subsystems for more information on memory types and performance.
  • Storage: NVMe PCIe Gen4 SSDs provide extremely fast storage performance, critical for applications requiring low latency and high IOPS. RAID 10 configuration ensures both performance and data redundancy. See Storage Technologies for a comparison of different storage options.
  • Network Interface: 100GbE NICs provide high-bandwidth network connectivity, essential for data-intensive applications and virtualization. Consider Network Topologies when designing your network infrastructure.
  • Expansion Slots: The abundance of PCIe 4.0 x16 slots allows for the addition of various expansion cards, such as GPUs for machine learning, or additional storage controllers. Refer to PCIe Standards for a detailed explanation of PCIe versions and lane configurations.
  • Power Supply: Redundant power supplies provide high availability and protect against power failures.

2. Performance Characteristics

This configuration delivers exceptional performance across a wide range of workloads. The following benchmark results represent typical performance levels.

Benchmark Results (Example):

Benchmark Score
SPECint®2017 Rate 285.0
SPECfp®2017 Rate 190.5
STREAM Triad (GB/s) 580.2
Y-Bench (Virtualization) 98.7 (normalized)
IOmeter (4KB Random Read IOPS) 750,000

Real-World Performance:

  • Virtualization: This configuration excels in virtualized environments, comfortably supporting a large number of virtual machines with demanding workloads. The high core count and memory capacity are particularly beneficial. See Virtualization Technologies for more details.
  • Database Servers: The high memory bandwidth and fast storage make this configuration ideal for database servers, enabling fast query processing and high transaction rates. Consider Database Management Systems when selecting the appropriate database software.
  • High-Performance Computing (HPC): The EPYC 7763 processor’s core count and AVX2/AVX-512 instruction set support make it suitable for HPC applications. See HPC Cluster Design for more information.
  • Machine Learning/AI: The PCIe 4.0 slots accommodate multiple GPUs, making this configuration a strong contender for machine learning and AI workloads. Refer to GPU Acceleration for a detailed discussion.
  • Video Encoding/Transcoding: The high core count and AVX-512 support accelerate video encoding and transcoding tasks. See Media Processing Workloads for optimization techniques.

Performance Bottlenecks:

While this configuration is powerful, potential bottlenecks can occur. These include:

  • Memory Bandwidth:** While high, very memory-intensive workloads can still saturate the available bandwidth.
  • Storage IOPS:** Even with NVMe SSDs, extremely demanding I/O workloads can lead to performance limitations.
  • Network Bandwidth:** For applications requiring extremely high network throughput, exceeding 100GbE can become a bottleneck.

3. Recommended Use Cases

This server configuration is best suited for the following applications:

  • Large-Scale Virtualization Environments: Supporting hundreds or thousands of virtual machines.
  • In-Memory Databases: Applications requiring fast access to large datasets.
  • High-Performance Data Analytics: Processing and analyzing large volumes of data.
  • Machine Learning and Deep Learning: Training and deploying complex AI models.
  • Scientific Computing and Simulations: Running computationally intensive simulations.
  • High-Traffic Web Servers: Handling a large number of concurrent requests.
  • Financial Modeling and Risk Analysis: Performing complex financial calculations.
  • Media Encoding and Transcoding Farms: Processing large video files.

4. Comparison with Similar Configurations

The following table compares this AMD EPYC 7003-based configuration with alternative options:

Feature AMD EPYC 7763 (This Configuration) Intel Xeon Platinum 8380 AMD EPYC 7543
Core Count 64 40 32
Thread Count 128 80 64
Base Clock Speed 2.45 GHz 2.3 GHz 2.8 GHz
Memory Channels 8 8 8
PCIe Lanes 128 64 128
TDP 280W 270W 280W
Typical Cost (Server) $15,000 - $20,000 $18,000 - $25,000 $12,000 - $17,000

Analysis:

  • AMD EPYC 7763 vs. Intel Xeon Platinum 8380: The EPYC 7763 generally offers better price-to-performance for heavily threaded workloads due to its higher core count and comparable clock speed. The Intel Xeon Platinum 8380 may have a slight edge in certain single-threaded applications.
  • AMD EPYC 7763 vs. AMD EPYC 7543: The EPYC 7763 provides significantly higher core count and performance at a higher price point. The EPYC 7543 is a more cost-effective option for less demanding workloads. See CPU Comparison for a more in-depth analysis.
  • Considerations: The optimal choice depends on the specific workload and budget constraints. For applications that can fully utilize a large number of cores, the AMD EPYC 7763 is the preferred option.

5. Maintenance Considerations

Maintaining this server configuration requires careful attention to several key areas.

  • Cooling: The high TDP of the EPYC processors requires robust cooling solutions. Regularly inspect heatsinks and fans for dust accumulation and ensure proper airflow within the chassis. Liquid cooling may be necessary for higher density deployments. Refer to Server Cooling Systems.
  • Power Requirements: This configuration requires a significant amount of power. Ensure the data center has sufficient power capacity and redundancy. Monitor power consumption to identify potential issues. Consider Power Management Strategies.
  • Firmware Updates: Regularly update the motherboard BIOS, RAID controller firmware, and NIC firmware to ensure optimal performance and security. See Firmware Management.
  • Remote Management: Utilize the IPMI 2.0 interface for remote monitoring and management of the server. This allows for remote power control, BIOS updates, and troubleshooting. Refer to Remote Server Management.
  • Storage Maintenance: Monitor the health of the SSDs and proactively replace failing drives. Implement a regular backup schedule to protect against data loss. See Data Backup and Recovery.
  • Physical Security: Ensure the server is physically secure to prevent unauthorized access. Implement appropriate access controls and security measures. Consider Data Center Security.
  • Airflow Management: Proper airflow is crucial to prevent overheating. Ensure there are no obstructions blocking airflow to the components. Utilize blanking panels to fill empty rack spaces. See Data Center Airflow.
  • Environmental Monitoring: Monitor temperature and humidity levels within the data center to ensure optimal operating conditions. See Data Center Environmental Control.
  • Predictive Failure Analysis (PFA): Utilize server management software that provides PFA capabilities to proactively identify potential hardware failures.


This documentation provides a comprehensive overview of the AMD EPYC 7003-based server configuration. Regularly consult the manufacturer’s documentation for the latest updates and best practices. ```


Intel-Based Server Configurations

Configuration Specifications Benchmark
Core i7-6700K/7700 Server 64 GB DDR4, NVMe SSD 2 x 512 GB CPU Benchmark: 8046
Core i7-8700 Server 64 GB DDR4, NVMe SSD 2x1 TB CPU Benchmark: 13124
Core i9-9900K Server 128 GB DDR4, NVMe SSD 2 x 1 TB CPU Benchmark: 49969
Core i9-13900 Server (64GB) 64 GB RAM, 2x2 TB NVMe SSD
Core i9-13900 Server (128GB) 128 GB RAM, 2x2 TB NVMe SSD
Core i5-13500 Server (64GB) 64 GB RAM, 2x500 GB NVMe SSD
Core i5-13500 Server (128GB) 128 GB RAM, 2x500 GB NVMe SSD
Core i5-13500 Workstation 64 GB DDR5 RAM, 2 NVMe SSD, NVIDIA RTX 4000

AMD-Based Server Configurations

Configuration Specifications Benchmark
Ryzen 5 3600 Server 64 GB RAM, 2x480 GB NVMe CPU Benchmark: 17849
Ryzen 7 7700 Server 64 GB DDR5 RAM, 2x1 TB NVMe CPU Benchmark: 35224
Ryzen 9 5950X Server 128 GB RAM, 2x4 TB NVMe CPU Benchmark: 46045
Ryzen 9 7950X Server 128 GB DDR5 ECC, 2x2 TB NVMe CPU Benchmark: 63561
EPYC 7502P Server (128GB/1TB) 128 GB RAM, 1 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (128GB/2TB) 128 GB RAM, 2 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (128GB/4TB) 128 GB RAM, 2x2 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (256GB/1TB) 256 GB RAM, 1 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (256GB/4TB) 256 GB RAM, 2x2 TB NVMe CPU Benchmark: 48021
EPYC 9454P Server 256 GB RAM, 2x2 TB NVMe

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⚠️ *Note: All benchmark scores are approximate and may vary based on configuration. Server availability subject to stock.* ⚠️