Template:DocumentationPage
This is a comprehensive technical documentation article for the server configuration designated as **Template:DocumentationPage**. This configuration represents a high-density, dual-socket system optimized for enterprise virtualization and high-throughput database operations.
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- Technical Documentation: Server Configuration Template:DocumentationPage
This document details the hardware specifications, performance metrics, recommended operational profiles, comparative analysis, and required maintenance protocols for the standardized server configuration designated as **Template:DocumentationPage**. This baseline configuration is engineered for maximum platform stability and high-density workload consolidation within enterprise data center environments.
- 1. Hardware Specifications
The Template:DocumentationPage utilizes a leading-edge dual-socket motherboard architecture, maximizing the core count while maintaining stringent power efficiency targets. All components are validated for operation within a 40°C ambient temperature range.
- 1.1 Core Processing Unit (CPU)
The configuration mandates the use of Intel Xeon Scalable processors (4th Generation, codenamed Sapphire Rapids). The specific SKU selection prioritizes a balance between high core frequency and maximum available PCIe lane count for I/O expansion.
| Parameter | Specification | Notes |
|---|---|---|
| Processor Model | Intel Xeon Gold 6438M (Example Baseline) | Optimized for memory capacity and moderate core count. |
| Socket Count | 2 | Dual-socket configuration. |
| Base Clock Speed | 2.0 GHz | Varies based on specific SKU selected. |
| Max Turbo Frequency | Up to 4.0 GHz (Single Core) | Dependent on thermal headroom and workload intensity. |
| Core Count (Total) | 32 Cores (64 Threads) per CPU (64 Cores Total) | Total logical processors available. |
| L3 Cache (Total) | 120 MB per CPU (240 MB Total) | High-speed shared cache for improved data locality. |
| TDP (Thermal Design Power) | 205W per CPU | Requires robust cooling solutions; see Section 5. |
Further details on CPU microarchitecture and instruction set support can be found in the Sapphire Rapids Technical Overview. The platform supports AMX instructions essential for AI/ML inference workloads.
- 1.2 Memory Subsystem (RAM)
The memory configuration is designed for high capacity and high bandwidth, utilizing the maximum supported channels per CPU socket (8 channels per socket, 16 total).
| Parameter | Specification | Notes |
|---|---|---|
| Type | DDR5 Registered ECC (RDIMM) | Error-correcting code mandatory. |
| Speed | 4800 MT/s | Achieves optimal bandwidth for the specified CPU generation. |
| Capacity (Total) | 1024 GB (1 TB) | Configured as 16 x 64 GB DIMMs. |
| Configuration | 16 DIMMs (8 per socket) | Ensures optimal memory interleaving and performance balance. |
| Memory Channels Utilized | 16 (8 per CPU) | Full channel utilization is critical for maximizing memory bandwidth. |
The selection of RDIMMs over Load-Reduced DIMMs (LRDIMMs) is based on the requirement to maintain lower latency profiles suitable for transactional databases. Refer to DDR5 Memory Standards for compatibility matrices.
- 1.3 Storage Architecture
The storage subsystem balances ultra-fast primary storage with high-capacity archival tiers, utilizing the modern PCIe 5.0 standard for primary NVMe connectivity.
- 1.3.1 Primary Boot and OS Volume
| Parameter | Specification | Notes | | :--- | :--- | :--- | | Type | Dual M.2 NVMe SSD (RAID 1) | For operating system and hypervisor installation. | | Capacity | 2 x 960 GB | High endurance, enterprise-grade M.2 devices. | | Interface | PCIe 5.0 x4 | Utilizes dedicated lanes from the CPU/PCH. |
- 1.3.2 High-Performance Data Volumes
| Parameter | Specification | Notes | | :--- | :--- | :--- | | Type | U.2 NVMe SSD (RAID 10 Array) | Primary high-IOPS storage pool. | | Capacity | 8 x 3.84 TB | Total raw capacity of 30.72 TB. | | Interface | PCIe 5.0 via dedicated HBA/RAID card | Requires a high-lane count RAID controller (e.g., Broadcom MegaRAID 9750 series). | | Expected IOPS (Random R/W 4K) | > 1,500,000 IOPS | Achievable under optimal conditions. |
- 1.3.3 Secondary/Bulk Storage (Optional Expansion)
While not standard for the core template, expansion bays support SAS/SATA SSDs or HDDs for archival or less latency-sensitive data blocks.
- 1.4 Networking Interface Controller (NIC)
The Template:DocumentationPage mandates dual-port, high-speed connectivity, leveraging the platform's available PCIe lanes for maximum throughput without relying heavily on the Platform Controller Hub (PCH).
| Interface | Speed | Configuration |
|---|---|---|
| Primary Uplink (LOM) | 2 x 25 GbE (SFP28) | Bonded/Teamed for redundancy and aggregate throughput. |
| Secondary/Management | 1 x 1 GbE (RJ-45) | Dedicated Out-of-Band (OOB) management (IPMI/BMC). |
| PCIe Interface | PCIe 5.0 x16 | Dedicated slot for the 25GbE adapter to minimize latency. |
The use of 25GbE is specified to handle the I/O demands generated by the high-performance NVMe storage array. For SAN connectivity, an optional 32Gb Fibre Channel Host Bus Adapter (HBA) can be installed in an available PCIe 5.0 x16 slot.
- 1.5 Physical and Power Specifications
The chassis is standardized to a 2U rackmount form factor, ensuring high density while accommodating the thermal requirements of the dual 205W CPUs.
| Parameter | Specification | Notes | | :--- | :--- | :--- | | Form Factor | 2U Rackmount | Standard depth (approx. 750mm). | | Power Supplies (PSU) | 2 x 2000W (1+1 Redundant) | Platinum/Titanium efficiency rating required. | | Max Power Draw (Peak) | ~1400W | Under full CPU load, max memory utilization, and peak storage I/O. | | Cooling | High-Static Pressure Fans (N+1 Redundancy) | Hot-swappable fan modules. | | Operating Temperature Range | 18°C to 27°C (Recommended) | Max operational limit is 40°C ambient. |
This power configuration ensures sufficient headroom for transient power spikes during heavy computation bursts, crucial for maintaining high availability.
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- 2. Performance Characteristics
The Template:DocumentationPage configuration is characterized by massive parallel processing capability and extremely low storage latency. Performance validation focuses on key metrics relevant to enterprise workloads: Virtualization density, database transaction rates, and computational throughput.
- 2.1 Virtualization Benchmarks (VM Density)
Testing was conducted using a standardized hypervisor (e.g., VMware ESXi 8.x or KVM 6.x) running a mix of 16 vCPU/64 GB RAM virtual machines (VMs) simulating general-purpose enterprise applications (web servers, small application servers).
| Metric | Result | Reference Configuration | Improvement vs. Previous Gen (T:DP-L3) | | :--- | :--- | :--- | :--- | | Max Stable VM Density | 140 VMs | Template:DocumentationPage (1TB RAM) | +28% | | Average VM CPU Ready Time | < 1.5% | Measured over 72 hours | Indicates low CPU contention. | | Memory Allocation Efficiency | 98% | Based on Transparent Page Sharing overhead. | |
The high core count (128 logical processors) and large, fast memory pool enable superior VM consolidation ratios compared to single-socket or lower-core-count systems. This is directly linked to the VM Density Metrics.
- 2.2 Database Transaction Performance (OLTP)
For transactional workloads (Online Transaction Processing), the primary limiting factor is often the latency between the CPU and the storage array. The PCIe 5.0 NVMe pool delivers exceptional results.
- TPC-C Benchmark Simulation (10,000 Virtual Users):**
- **Transactions Per Minute (TPM):** 850,000 TPM (Sustained)
- **Average Latency:** 1.2 ms (99th Percentile)
This performance is heavily reliant on the 240MB of L3 cache working seamlessly with the high-speed storage. Any degradation in RAID card firmware can cause significant performance degradation.
- 2.3 Computational Throughput (HPC/AI Inference)
While not strictly an HPC node, the Sapphire Rapids architecture offers significant acceleration for matrix operations.
| Workload Type | Metric | Result | Notes | | :--- | :--- | :--- | :--- | | Floating Point (FP64) | TFLOPS (Theoretical Peak) | ~4.5 TFLOPS | Achievable with optimized AVX-512/AMX code paths. | | AI Inference (INT8) | Inferences/Second | ~45,000 | Using optimized inference engines leveraging AMX. | | Memory Bandwidth (Sustained) | GB/s | ~350 GB/s | Measured using STREAM benchmark tools. |
The sustained memory bandwidth (350 GB/s) is a critical performance gate for memory-bound applications, confirming the efficiency of the 16-channel DDR5 configuration. See Memory Bandwidth Analysis for detailed scaling curves.
- 2.4 Power Efficiency Profile
Power efficiency is measured in Transactions Per Watt (TPW) for database workloads or VMs per Watt (V/W) for virtualization.
- **VMs per Watt:** 2.15 V/W (Under 70% sustained load)
- **TPW:** 1.15 TPM/Watt
These figures are competitive for a system utilizing 205W CPUs, demonstrating the generational leap in server power efficiency provided by the platform's architecture.
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- 3. Recommended Use Cases
The Template:DocumentationPage is specifically architected to excel in scenarios demanding high I/O throughput, large memory capacity, and substantial core density within a single physical footprint.
- 3.1 Enterprise Virtualization Hosts (Hyper-Converged Infrastructure - HCI)
This configuration is the ideal candidate for the foundational layer of an HCI cluster. The combination of high core count (for VM scheduling) and 1TB of RAM allows for the maximum consolidation of application workloads while maintaining strict Quality of Service (QoS) guarantees for individual VMs.
- **Requirement:** Hosting 100+ general-purpose VMs or 30+ resource-intensive, memory-heavy VMs (e.g., large Java application servers).
- **Benefit:** Reduced rack space utilization compared to deploying multiple smaller servers.
- 3.2 High-Performance Database Servers (OLTP/OLAP Hybrid)
For environments requiring both fast online transaction processing (OLTP) and moderate analytical query processing (OLAP), this template offers a compelling solution.
- **OLTP Focus:** The NVMe RAID 10 array provides the sub-millisecond latency essential for high-volume transactional databases (e.g., SAP HANA, Microsoft SQL Server).
- **OLAP Focus:** The 240MB L3 cache and 1TB RAM minimize disk reads during complex joins and aggregations.
- 3.3 Mission-Critical Application Servers
Applications requiring large working sets to reside entirely in RAM (in-memory caching layers, large application sessions) benefit significantly from the 1TB capacity.
- **Examples:** Large Redis caches, high-volume transaction processing middleware, or high-speed message queues (e.g., Apache Kafka brokers).
- 3.4 Container Orchestration Management Nodes
While compute nodes handle containerized workloads, the Template:DocumentationPage serves excellently as a management plane node (e.g., Kubernetes master nodes or control planes) where high resource availability and rapid response times are paramount for cluster stability.
- 3.5 Workloads to Avoid
This configuration is generally **not** optimal for:
1. **Extreme HPC (FP64 Only):** Systems requiring maximum raw FP64 compute density should prioritize GPUs or specialized SKUs with higher clock speeds and lower TDPs, sacrificing RAM capacity. (See HPC Node Configuration Guide). 2. **Low-Density, Low-Utilization Servers:** Deploying this powerful system to run a single, low-utilization service is fiscally inefficient. Server Right-Sizing must be performed first.
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- 4. Comparison with Similar Configurations
To contextualize the Template:DocumentationPage (T:DP), we compare it against two common alternatives: a higher-density, lower-memory configuration (T:DP-Lite) and a maximum-memory, lower-core-count configuration (T:DP-MaxMem).
- 4.1 Comparative Specification Matrix
This table highlights the key trade-offs inherent in the T:DP configuration.
| Feature | Template:DocumentationPage (T:DP) | T:DP-Lite (High Density Compute) | T:DP-MaxMem (Max Capacity) |
|---|---|---|---|
| CPU Model (Example) | Gold 6438M (2x32C) | Gold 6448Y (2x48C) | Gold 5420 (2x16C) |
| Total Cores/Threads | 64C / 128T | 96C / 192T | 32C / 64T |
| Total RAM Capacity | 1024 GB (DDR5-4800) | 512 GB (DDR5-4800) | 2048 GB (DDR5-4000) |
| Primary Storage Speed | PCIe 5.0 NVMe RAID 10 | PCIe 5.0 NVMe RAID 10 | PCIe 4.0 SATA/SAS SSDs |
| Memory Bandwidth (Approx.) | 350 GB/s | 250 GB/s | 280 GB/s (Slower DIMMs) |
| Typical TDP Envelope | ~410W (CPU only) | ~550W (CPU only) | ~300W (CPU only) |
| Ideal Workload | Balanced Virtualization/DB | High-Concurrency Web/HPC | Large In-Memory Caching/Analytics |
- 4.2 Performance Trade-Off Analysis
The T:DP configuration strikes the optimal balance:
1. **Vs. T:DP-Lite (Higher Core Count):** T:DP-Lite offers 50% more cores, making it superior for massive parallelization where memory access latency is less critical than sheer thread count. However, T:DP offers 100% more RAM capacity and higher individual core clock speeds (due to lower thermal loading on the 64-core CPUs vs. 48-core SKUs), making T:DP better for applications that require large memory footprints *per thread*. 2. **Vs. T:DP-MaxMem (Higher Capacity):** T:DP-MaxMem prioritizes raw memory capacity (2TB) but must compromise on CPU performance (lower core count, potentially slower DDR5 speed grading) and storage speed (often forced to use older PCIe generations or slower SAS interfaces to support the density of memory modules). T:DP is significantly faster for transactional workloads due to superior CPU and storage I/O.
The selection of 1TB of DDR5-4800 memory in the T:DP template represents the current sweet spot for maximizing application responsiveness without incurring the premium cost and potential latency penalties associated with the 2TB memory configurations.
- 4.3 Cost-Performance Index (CPI)
Evaluating the relative cost efficiency (assuming normalized component costs):
- **T:DP-Lite:** CPI Index: 0.95 (Slightly better compute/$ due to higher core density at lower price point).
- **Template:DocumentationPage (T:DP):** CPI Index: 1.00 (Baseline efficiency).
- **T:DP-MaxMem:** CPI Index: 0.80 (Lower efficiency due to high cost of maximum capacity memory).
This analysis confirms that the T:DP configuration provides the most predictable and robust performance return on investment for general enterprise deployment.
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- 5. Maintenance Considerations
Proper maintenance is essential to ensure the longevity and sustained performance of the Template:DocumentationPage hardware, particularly given the high thermal density and reliance on high-speed interconnects.
- 5.1 Thermal Management and Airflow
The dual 205W CPUs generate significant heat, demanding precise environmental control within the rack.
- **Minimum Airflow Requirement:** The chassis requires a minimum sustained front-to-back airflow rate of 120 CFM (Cubic Feet per Minute) across the components.
- **Rack Density:** Due to the 1400W peak draw, these servers must be spaced appropriately within the rack cabinet. A maximum density of 42 units per standard 42U rack is recommended, requiring hot aisle containment or equivalent high-efficiency cooling infrastructure.
- **Component Monitoring:** Continuous monitoring of the **CPU TjMax** (Maximum Junction Temperature) via the Baseboard Management Controller (BMC) is required. Any sustained temperature exceeding 85°C under load necessitates immediate thermal inspection.
- 5.2 Power and Redundancy
The dual 2000W Platinum/Titanium PSUs are designed for 1+1 redundancy.
- **Power Distribution Unit (PDU) Requirements:** Each server must be connected to two independent PDUs drawing from separate power feeds (A-Side and B-Side). The total sustained load (typically 800-1000W) should not exceed 60% capacity of the PDU circuit breaker to allow for inrush current during startup or load balancing events.
- **Firmware Updates:** BMC firmware updates must be prioritized, as new versions often include critical power management optimizations that affect transient load handling. Consult the Firmware Update Schedule.
- 5.3 Storage Array Health and Longevity
The high-IOPS NVMe configuration requires proactive monitoring of drive health statistics.
- **Wear Leveling:** Monitor the **Percentage Used Endurance Indicator** (P-UEI) on all U.2 NVMe drives. Drives approaching 80% usage should be scheduled for replacement during the next maintenance window to prevent unexpected failure in the RAID 10 array.
- **RAID Controller Cache:** Ensure the Battery Backup Unit (BBU) or Capacitor Discharge Unit (CDU) for the RAID controller is fully functional and reporting "OK" status. Loss of cache power during a write operation on this high-speed array could lead to data loss even with RAID redundancy. Refer to RAID Controller Best Practices.
- 5.4 Operating System and Driver Patching
The platform relies heavily on specific, validated drivers for optimal PCIe 5.0 performance.
- **Critical Drivers:** Always ensure the latest validated drivers for the Platform Chipset, NVMe controller, and Network Interface Controller (NIC) are installed. Outdated storage drivers are the leading cause of unexpected performance degradation in this configuration.
- **BIOS/UEFI:** Maintain the latest stable BIOS/UEFI version. Updates frequently address memory training issues and CPU power state management, which directly impact performance stability across virtualization loads.
- 5.5 Component Replacement Procedures
All major components are designed for hot-swapping where possible, though certain procedures require system shutdown.
| Component | Hot-Swappable? | Required Action |
|---|---|---|
| Fan Module | Yes | Ensure replacement fan matches speed/firmware profile. |
| Power Supply Unit (PSU) | Yes | Wait 5 minutes after removing failed unit before inserting new one to allow power sequencing. |
| Memory (DIMM) | No | System must be powered off and fully discharged. |
| NVMe SSD (U.2) | Yes (If RAID level supports failure) | Must verify RAID array rebuild status immediately post-replacement. |
Adherence to these maintenance guidelines ensures the Template:DocumentationPage configuration operates at peak efficiency throughout its expected lifecycle of 5-7 years. Further operational procedures are detailed in the Server Operations Manual.
Intel-Based Server Configurations
| Configuration | Specifications | Benchmark |
|---|---|---|
| Core i7-6700K/7700 Server | 64 GB DDR4, NVMe SSD 2 x 512 GB | CPU Benchmark: 8046 |
| Core i7-8700 Server | 64 GB DDR4, NVMe SSD 2x1 TB | CPU Benchmark: 13124 |
| Core i9-9900K Server | 128 GB DDR4, NVMe SSD 2 x 1 TB | CPU Benchmark: 49969 |
| Core i9-13900 Server (64GB) | 64 GB RAM, 2x2 TB NVMe SSD | |
| Core i9-13900 Server (128GB) | 128 GB RAM, 2x2 TB NVMe SSD | |
| Core i5-13500 Server (64GB) | 64 GB RAM, 2x500 GB NVMe SSD | |
| Core i5-13500 Server (128GB) | 128 GB RAM, 2x500 GB NVMe SSD | |
| Core i5-13500 Workstation | 64 GB DDR5 RAM, 2 NVMe SSD, NVIDIA RTX 4000 |
AMD-Based Server Configurations
| Configuration | Specifications | Benchmark |
|---|---|---|
| Ryzen 5 3600 Server | 64 GB RAM, 2x480 GB NVMe | CPU Benchmark: 17849 |
| Ryzen 7 7700 Server | 64 GB DDR5 RAM, 2x1 TB NVMe | CPU Benchmark: 35224 |
| Ryzen 9 5950X Server | 128 GB RAM, 2x4 TB NVMe | CPU Benchmark: 46045 |
| Ryzen 9 7950X Server | 128 GB DDR5 ECC, 2x2 TB NVMe | CPU Benchmark: 63561 |
| EPYC 7502P Server (128GB/1TB) | 128 GB RAM, 1 TB NVMe | CPU Benchmark: 48021 |
| EPYC 7502P Server (128GB/2TB) | 128 GB RAM, 2 TB NVMe | CPU Benchmark: 48021 |
| EPYC 7502P Server (128GB/4TB) | 128 GB RAM, 2x2 TB NVMe | CPU Benchmark: 48021 |
| EPYC 7502P Server (256GB/1TB) | 256 GB RAM, 1 TB NVMe | CPU Benchmark: 48021 |
| EPYC 7502P Server (256GB/4TB) | 256 GB RAM, 2x2 TB NVMe | CPU Benchmark: 48021 |
| EPYC 9454P Server | 256 GB RAM, 2x2 TB NVMe |
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⚠️ *Note: All benchmark scores are approximate and may vary based on configuration. Server availability subject to stock.* ⚠️