Roadmap

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  1. Technical Documentation: Server Configuration Roadmap

This document provides a comprehensive technical overview of the "Roadmap" server configuration. The Roadmap configuration is designed as a high-density, balanced compute platform targeting enterprise workloads requiring significant I/O throughput and scalable memory capacity without sacrificing power efficiency.

    1. 1. Hardware Specifications

The Roadmap configuration is built upon a dual-socket reference architecture optimized for next-generation processor integration and high-speed interconnects. All components are selected adhering to strict reliability and thermal specifications suitable for 24/7 operation in enterprise data centers.

      1. 1.1 System Board and Chassis

The foundation of the Roadmap is the proprietary *Atlas-Gen-V* motherboard, designed for maximum component density while maintaining robust power delivery (VRM) design.

  • **Form Factor:** 2U Rackmount Chassis (optimized for airflow)
  • **Motherboard:** Atlas-Gen-V (Dual-Socket, Proprietary Microarchitecture)
  • **BIOS/UEFI:** Dual-redundant SPI flash modules, supporting IPMI 2.0 over LAN. Firmware updates are managed via the integrated BMC (Baseboard Management Controller).
  • **Power Supplies:** Dual Redundant (N+1 configuration standard)
   *   Type: Hot-Swappable, Platinum Efficiency (92%+ @ 50% load)
   *   Rating: 2000W per unit (Total system capacity up to 4000W peak)
  • **Cooling Subsystem:** Direct-to-chip liquid cooling capable for CPU modules, supplemented by six high-static-pressure, hot-swappable fans (40mm x 40mm, 12V DC). Thermal monitoring is granular, tracking zone temperatures across VRMs, DIMMs, and PCIe lanes.
      1. 1.2 Central Processing Units (CPUs)

The Roadmap configuration mandates support for the latest generation of server-grade processors, focusing on high core counts and extensive memory channel support.

  • **Processor Family:** Intel Xeon Scalable (Sapphire Rapids equivalent or newer) or AMD EPYC Genoa/Bergamo equivalent.
  • **Socket Configuration:** 2 Sockets (Dual-Processor configuration required for full specification compliance).
  • **Recommended SKU (Baseline):** 2 x 64-Core Processors (128 Total Cores / 256 Threads)
  • **Maximum TDP Supported:** Up to 350W per CPU socket (requires adequate cooling infrastructure).
  • **L3 Cache:** Minimum 192MB total unified L3 cache.
  • **Interconnect:** Utilizing the latest high-speed processor-to-processor interconnect (e.g., UPI or Infinity Fabric) operating at minimum 12 GT/s.
      1. 1.3 Memory Subsystem (RAM)

The configuration prioritizes massive memory capacity and high bandwidth, leveraging the increased memory channel count of modern CPUs.

  • **Memory Type:** DDR5 ECC Registered DIMMs (RDIMMs)
  • **Maximum Capacity:** 8 TB total system memory (utilizing 32 DIMM slots, 16 per CPU).
  • **Configuration (Baseline):** 1 TB DDR5-5600 (32 x 32GB DIMMs)
  • **Channel Architecture:** 8 Channels per CPU (16 Total Channels). Strict population rules apply to maintain optimal memory interleaving and performance. Refer to the Memory Population Guidelines for specific slot population methodologies.
  • **Memory Bandwidth (Theoretical Peak):** Exceeding 800 GB/s bidirectional, depending on final DIMM speed grade (e.g., DDR5-5600 vs DDR5-6400).
      1. 1.4 Storage Subsystem

The storage architecture emphasizes flexibility, supporting both high-speed NVMe acceleration and high-capacity SATA/SAS drives for tiered storage solutions.

  • **Primary Boot/OS:** 2 x 1.92TB NVMe U.2 Drives (RAID 1, managed by the onboard SATA controller for OS redundancy).
  • **High-Performance Tier (Data/Cache):** Up to 16 x 3.84TB NVMe PCIe 4.0/5.0 SSDs. These are typically connected via a dedicated HBA (Host Bus Adapter) or a specialized storage controller card installed in a PCIe slot.
  • **Capacity Tier (Optional):** Up to 8 x 16TB SAS 12Gb/s HDDs (Managed by a dedicated RAID controller card, supporting RAID 5/6/10).
  • **Storage Controller:**
   *   Onboard: Intel VROC (Virtual RAID on CPU) supporting SATA/NVMe for basic parity.
   *   Add-in Card (Recommended): Broadcom MegaRAID series or equivalent, providing hardware XOR engine and minimum 4GB cache with battery backup unit (BBU) or supercapacitor protection.
Storage Configuration Summary
Slot Type Quantity Protocol Capacity Range (Per Unit) Primary Role
M.2 (Internal) 2 PCIe 4.0 NVMe 960GB – 3.84TB Boot/Hypervisor
U.2/M.2 Backplane (Front) 16 PCIe 5.0 NVMe 1.92TB – 7.68TB Primary Data/VM Storage
2.5" Bays (Optional) 8 SAS3/SATA III 8TB – 18TB Archival/Capacity Tier
      1. 1.5 Networking and I/O

The Roadmap configuration is engineered for high-throughput networking, essential for modern virtualization and distributed storage environments (e.g., Ceph, vSAN).

  • **Baseboard Management Controller (BMC):** Dedicated 1GbE port (IPMI).
  • **Primary Data Network (LOM):** 2 x 25 Gigabit Ethernet (25GbE) ports integrated onto the motherboard, supporting RDMA over Converged Ethernet (RoCEv2).
  • **Expansion Slots (Total):** 8 x PCIe 5.0 x16 slots (Vertical Mount).
   *   Slot Layout: 4 Primary (CPU 1 direct), 4 Secondary (CPU 2 direct or via PCIe switch).
  • **Recommended Expansion:**
   *   1 x 100GbE/200GbE Network Interface Card (NIC) for fabric connectivity.
   *   1 x High-Speed HBA/RAID Controller (as detailed in 1.4).
   *   1 x Accelerator Card (e.g., GPU or specialized AI accelerator, if required by the workload).
    1. 2. Performance Characteristics

The Roadmap configuration achieves its performance targets through a synergistic combination of high core count, massive memory bandwidth, and cutting-edge PCIe connectivity.

      1. 2.1 Processor Performance Metrics

When configured with dual 350W TDP CPUs (e.g., 2x 64-core), the system excels in highly parallelized tasks.

  • **Multi-Threaded Score (SPECrate 2017 Integer):** Demonstrated results consistently exceed 2800. This metric is critical for virtualization density and batch processing.
  • **Single-Threaded Performance (SPECspeed 2017 Floating Point):** Performance is competitive, typically achieving scores above 450, indicating suitability for latency-sensitive transactional workloads that cannot be fully parallelized.
  • **Memory Latency:** Measured round-trip latency between CPU sockets via the interconnect is typically below 80 nanoseconds (ns) when accessing remote DRAM, crucial for distributed applications.
      1. 2.2 Storage Throughput Benchmarks

The primary performance bottleneck mitigation strategy in the Roadmap involves maximizing NVMe bandwidth. Utilizing 16 NVMe drives connected directly or via a well-provisioned PCIe switch yields exceptional I/O capabilities.

  • **Sequential Read Throughput (128K Block Size):** Achievable sustained read rates are consistently above 35 GB/s when using 16 x PCIe 5.0 NVMe drives configured in a striped array (RAID 0 equivalent for testing).
  • **Random Read IOPS (4K Block Size, QD32):** Peak performance metrics often surpass 8 Million IOPS (MIOPs) when the workload is evenly distributed across the available storage controllers and the system memory is large enough to absorb the working set, minimizing physical disk access.
  • **Write Amplification Factor (WAF):** Due to the focus on enterprise SSDs supporting advanced wear-leveling algorithms, WAF under typical database write patterns (80/20 read/write) remains below 1.2, ensuring longevity of the high-speed flash components.
      1. 2.3 Network Latency and Jitter

For high-frequency trading (HFT) or real-time analytics that utilize the 100GbE fabric, network performance is paramount.

  • **Intra-Server Communication (Loopback):** Latency between the two 25GbE ports on the LOM is typically sub-1 microsecond ($\mu s$).
  • **RoCEv2 Performance:** When coupled with a compatible RDMA-capable switch fabric, the system exhibits median packet latency under 1.5 $\mu s$ for 100GbE traffic, with 99th percentile jitter remaining below 500 nanoseconds. This performance profile is critical for minimizing synchronization overhead in clustered databases like Distributed Databases.
      1. 2.4 Power Efficiency Profile

Despite the high component count, the Roadmap design emphasizes efficiency, leveraging the inherent power management features of modern CPUs and DDR5 memory.

  • **Idle Power Consumption:** Under base OS load (no applications running), the system typically draws between 350W and 450W (measured at the PDU input).
  • **Peak Load Power Consumption:** Full CPU utilization (stress testing all cores) combined with maximum fan speed and 16 active NVMe drives results in a peak draw of approximately 3400W.
  • **Performance Per Watt (PPW):** Achieves approximately 0.85 SPECrate 2017 Integer per Watt, which is highly competitive for a 2U platform offering this level of I/O density.
    1. 3. Recommended Use Cases

The Roadmap configuration is engineered for workloads that require a balanced blend of massive parallel processing, high memory capacity, and extremely fast data access. It is not optimized for single-threaded maximum clock speed tasks, nor is it intended as a pure archival system.

      1. 3.1 Large-Scale Virtualization Hosts (Hyperconvergence)

This configuration is ideally suited as the backbone for software-defined storage (SDS) and hyperconverged infrastructure (HCI) solutions, such as VMware vSAN or Nutanix clusters.

  • **Rationale:** The high core count supports a large number of virtual machines (VMs). The 1TB+ RAM capacity allows for generous memory allocation to critical VMs. Crucially, the extensive NVMe backplane provides the necessary low-latency storage pool required for the virtual machine disk images, preventing the "storage starvation" common in less capable hosts.
  • **Key Feature Utilization:** High-speed interconnects for inter-node communication (live migration, storage replication).
      1. 3.2 High-Performance Computing (HPC) & Computational Fluid Dynamics (CFD)

In scientific computing environments where simulation models are memory-intensive, the Roadmap provides substantial resources.

  • **Rationale:** CFD models often require loading the entire mesh and solution state into memory. The 8TB memory potential allows for simulations that would otherwise require external swapping or distribution across multiple smaller nodes. The high core count accelerates the iterative solving processes.
  • **Related Concept:** NUMA Architecture Optimization must be strictly observed when compiling and running HPC applications to ensure processes bind to the memory banks physically closest to their executing cores.
      1. 3.3 Database Management Systems (DBMS) - In-Memory and OLTP

For mission-critical transactional databases (OLTP) or modern in-memory analytical databases (e.g., SAP HANA, specialized NewSQL databases), the Roadmap configuration offers superior latency characteristics.

  • **Rationale:** Modern DBMS heavily rely on fast access to the working set. By loading the active dataset into the 1TB+ RAM pool, disk I/O latency is effectively eliminated for reads. The NVMe tier handles logging and write-ahead operations with minimal impact.
  • **Configuration Note:** For maximum database performance, the storage configuration should prioritize NVMe drives connected via PCIe 5.0 lanes directly to the CPU, bypassing potential latency introduced by the PCH (Platform Controller Hub).
      1. 3.4 AI/ML Training (Light to Medium Scale)

While dedicated GPU servers are often preferred for deep learning inference or massive model training, the Roadmap serves well for data preprocessing, feature engineering, and training smaller-to-medium sized models where CPU parallelism is beneficial.

  • **Rationale:** Data loading, augmentation, and feature extraction phases are highly CPU-bound and memory-bandwidth dependent. The large memory capacity prevents bottlenecks during data ingestion from the high-speed storage tier.
    1. 4. Comparison with Similar Configurations

To understand the strategic placement of the Roadmap configuration within an enterprise infrastructure portfolio, it is beneficial to compare it against two other common server profiles: the "Density Optimized" (DO) configuration and the "Maximum Compute" (MC) configuration.

      1. 4.1 Configuration Definitions
  • **Roadmap (RM):** Balanced, high-I/O, high-memory density platform. (Focus: Flexibility and I/O throughput).
  • **Density Optimized (DO):** Typically 1U or dense 2U systems prioritizing core count per rack unit, often sacrificing memory slots or PCIe lanes for compactness.
  • **Maximum Compute (MC):** Typically 4U or bare-metal GPU chassis focusing purely on raw CPU/GPU floating-point performance, often accepting lower storage capacity or reliance on external SAN/NAS.
      1. 4.2 Feature Comparison Table
Configuration Feature Comparison
Feature Roadmap (RM) Density Optimized (DO) Maximum Compute (MC)
Form Factor 2U 1U or Dense 2U 4U or GPU Tower
Max CPU Sockets 2 2 4 (Typical)
Max System RAM (Approx.) 8 TB 2 TB 12 TB (Higher DIMM density)
Max Internal NVMe Drives 16 (Front-loaded, PCIe 5.0) 8 (Rear/Mid-bay) 4 (Often dedicated to OS/Boot)
PCIe 5.0 Lanes Available (Total) ~128 (Split across 8 slots) ~64 (Split across 4 slots) ~256 (Dedicated to accelerators)
Performance Profile Balanced, High I/O Throughput/Core Density Raw Computational Power
Typical Power Draw (Peak) 3.4 kW 2.2 kW 5.0+ kW
      1. 4.3 Architectural Trade-offs Analysis

The Roadmap configuration specifically addresses the limitations encountered when scaling out hyperconverged environments using Density Optimized (DO) servers. While a DO server allows for more hosts per rack (higher density), it often becomes storage-bound due to fewer NVMe lanes or slots. The Roadmap sacrifices 50% of the potential rack density compared to a 1U DO unit but gains 300% in accessible, high-speed, local storage bandwidth.

Conversely, the Maximum Compute (MC) variant often requires external storage fabrics (Fibre Channel, high-speed Ethernet arrays) because it dedicates most of its internal PCIe real estate to specialized accelerators (e.g., NVIDIA A100/H100). The Roadmap's integrated storage prowess eliminates the immediate need for complex external fabric integration for many enterprise workloads, simplifying deployment and reducing reliance on external storage administrators.

The Roadmap represents the sweet spot for organizations transitioning workloads from traditional three-tier architecture to integrated, high-performance private cloud environments.

    1. 5. Maintenance Considerations

Proper maintenance protocols are critical to maximizing the lifespan and sustained performance of the Roadmap configuration, particularly due to its high component density and reliance on high-speed signaling (PCIe 5.0).

      1. 5.1 Thermal Management and Airflow

The high TDP CPUs (up to 350W) and numerous NVMe drives generate significant localized heat.

  • **Rack Density Limits:** When populating racks with Roadmap units, ensure that the rack density does not exceed the HVAC cooling capacity threshold for the specific data center aisle configuration (hot aisle/cold aisle). A standard 42U rack populated entirely with Roadmap units (assuming 40-42 units) requires a sustained cooling capacity exceeding 130 kW.
  • **Component Replacement:** Due to the tight integration of the storage backplane and memory channels, component replacement must follow strict anti-static procedures. Hot-swappable components (PSUs, Fans, Storage Drives) should be replaced only using OEM-approved parts to maintain system validation status.
  • **Liquid Cooling Maintenance:** If the optional direct-to-chip liquid cooling solution is employed for sustained high-TDP operations, the coolant loop integrity must be verified quarterly. Specialized thermal paste (e.g., liquid metal or high-conductivity phase change material) used between the CPU IHS and the cold plate requires reapplication every 36 months or upon any major CPU replacement, as per Thermal Interface Material Best Practices.
      1. 5.2 Power Requirements and Redundancy

The dual 2000W Platinum PSUs necessitate careful planning for Power Distribution Unit (PDU) connectivity.

  • **PDU Allocation:** Each server should ideally be connected to two separate, redundant PDUs sourced from different UPS branches. This ensures N+1 power redundancy against a single circuit failure.
  • **Inrush Current:** During initial power-up or cold boot of a fully populated system (especially with high-capacity NVMe drives spinning up), the instantaneous inrush current can momentarily spike above the continuous rating. Ensure the upstream circuit breakers are rated appropriately (e.g., 30A dedicated circuits for high-density racks).
  • **Firmware Updates:** Power cycling firmware updates (e.g., updating the BMC or RAID controller firmware) should be performed sequentially, allowing the system to stabilize completely before initiating the next major component firmware update.
      1. 5.3 Storage Health Monitoring

The high utilization of the NVMe fleet demands proactive monitoring beyond standard SMART data.

  • **NVMe Telemetry:** Utilize vendor-specific tools (e.g., NVMe-MI commands) to monitor key health indicators such as Uncorrectable Error Counts, Media and Host Writes, and Temperature Throttling events on a continuous basis.
  • **RAID Controller Cache Management:** If using a hardware RAID card, verify that the BBU/Supercapacitor health is 100% functional. A failure in the cache protection mechanism can lead to catastrophic data loss during a power event, especially in write-intensive OLTP scenarios. Regularly test the BBU functionality via the RAID management utility.
  • **Firmware Drift:** Ensure that all storage controllers (HBA/RAID) and the underlying NVMe drives maintain consistent firmware versions across all units in the array to prevent performance inconsistencies or compatibility issues, which can severely impact storage performance metrics discussed in Section 2.3. Refer to Storage Firmware Synchronization Protocols.
      1. 5.4 Interconnect Management

The reliance on high-speed PCIe 5.0 and 100GbE fabric requires stringent physical layer maintenance.

  • **Cabling:** Only use certified, low-loss optical fiber or high-quality direct attach copper (DAC) cables for all high-speed interconnects (100GbE, PCIe add-in cards). Signal integrity degrades rapidly with poor cabling quality at these speeds.
  • **Slot Loading:** When installing or removing high-bandwidth PCIe cards (especially 100GbE NICs), ensure the retention mechanism is fully engaged and the slot locking lever is secure. A partially seated card can lead to intermittent link training failures or performance degradation due to lane bifurcation errors. Consult the PCIe Slot Specification Guide for proper seating depth.


Intel-Based Server Configurations

Configuration Specifications Benchmark
Core i7-6700K/7700 Server 64 GB DDR4, NVMe SSD 2 x 512 GB CPU Benchmark: 8046
Core i7-8700 Server 64 GB DDR4, NVMe SSD 2x1 TB CPU Benchmark: 13124
Core i9-9900K Server 128 GB DDR4, NVMe SSD 2 x 1 TB CPU Benchmark: 49969
Core i9-13900 Server (64GB) 64 GB RAM, 2x2 TB NVMe SSD
Core i9-13900 Server (128GB) 128 GB RAM, 2x2 TB NVMe SSD
Core i5-13500 Server (64GB) 64 GB RAM, 2x500 GB NVMe SSD
Core i5-13500 Server (128GB) 128 GB RAM, 2x500 GB NVMe SSD
Core i5-13500 Workstation 64 GB DDR5 RAM, 2 NVMe SSD, NVIDIA RTX 4000

AMD-Based Server Configurations

Configuration Specifications Benchmark
Ryzen 5 3600 Server 64 GB RAM, 2x480 GB NVMe CPU Benchmark: 17849
Ryzen 7 7700 Server 64 GB DDR5 RAM, 2x1 TB NVMe CPU Benchmark: 35224
Ryzen 9 5950X Server 128 GB RAM, 2x4 TB NVMe CPU Benchmark: 46045
Ryzen 9 7950X Server 128 GB DDR5 ECC, 2x2 TB NVMe CPU Benchmark: 63561
EPYC 7502P Server (128GB/1TB) 128 GB RAM, 1 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (128GB/2TB) 128 GB RAM, 2 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (128GB/4TB) 128 GB RAM, 2x2 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (256GB/1TB) 256 GB RAM, 1 TB NVMe CPU Benchmark: 48021
EPYC 7502P Server (256GB/4TB) 256 GB RAM, 2x2 TB NVMe CPU Benchmark: 48021
EPYC 9454P Server 256 GB RAM, 2x2 TB NVMe

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⚠️ *Note: All benchmark scores are approximate and may vary based on configuration. Server availability subject to stock.* ⚠️