Hardware Compatibility List
Technical Deep Dive: The HCL-Optimized Server Configuration (Model X7900-Pro)
This document provides a comprehensive technical review of the HCL-Validated Server Configuration, designated Model X7900-Pro. This configuration is specifically engineered and rigorously tested to meet the stringent requirements defined within the manufacturer's official Hardware Compatibility List (HCL), ensuring maximum stability, performance predictability, and supportability across enterprise workloads.
1. Hardware Specifications
The X7900-Pro platform is a 2U rackmount server designed for high-density compute environments. Its architecture prioritizes validated component synergy over maximum theoretical throughput, focusing instead on sustained, reliable operation within certified parameters.
1.1 System Board and Chassis
The foundation of this configuration is the proprietary *ServerBoard Z12X-Ultra*, which supports dual-socket operations and is optimized for thermal dissipation within the standardized 2U chassis.
| Component | Specification | |
|---|---|---|
| Form Factor | 2U Rackmount (Depth: 750mm) | |
| Motherboard Model | ServerBoard Z12X-Ultra (Dual Socket P+) | |
| Chipset | Intel C741 Series (Validated for PCIe Gen 5.0 operation) | |
| BIOS/UEFI | Version 4.12.P (HCL Certified Firmware) | |
| Expansion Slots | 4x PCIe 5.0 x16 (Full Height, Half Length) | 2x PCIe 5.0 x8 (Low Profile) |
| Management Controller | Integrated Baseboard Management Controller (BMC) 4.0 supporting Redfish | |
| Power Supply Units (PSUs) | 2x 2200W (1+1 Redundant), 80 PLUS Titanium Certified |
1.2 Central Processing Units (CPUs)
The X7900-Pro is validated exclusively for the latest generation of server-grade processors featuring integrated AI acceleration capabilities. Dual-socket configurations are mandatory for HCL validation.
| Parameter | Value (Per Socket) |
|---|---|
| CPU Model | Intel Xeon Scalable Processor (Sapphire Rapids Family, Customized SKU) |
| Core Count | 56 Cores (112 Threads) |
| Base Clock Frequency | 2.4 GHz |
| Max Turbo Frequency (Single Core) | 3.8 GHz |
| L3 Cache | 112 MB (Shared per socket) |
| TDP Rating | 350W (Thermal envelope strictly controlled by HCL cooling profile) |
| Total System Cores/Threads | 112 Cores / 224 Threads |
- Note:* Use of any CPU not explicitly listed on the specific CPU Qualification List (CQL) results in immediate HCL invalidation.
1.3 Memory Subsystem (RAM)
Memory configuration adheres to strict channel balancing and speed requirements to maintain predictable memory latency, critical for virtualization and database workloads. Only registered ECC DDR5 modules are supported.
| Parameter | Specification |
|---|---|
| DIMM Type | DDR5 RDIMM ECC |
| Supported Speed | 5600 MT/s (JEDEC Standard) |
| Maximum Capacity | 8 TB (Using 32x 256GB DIMMs) |
| Current Configuration (HCL Baseline) | 1 TB (8x 128GB DIMMs, running in 8-Channel interleaved mode) |
| Memory Channel Configuration | 8 Channels per CPU (16 Total Channels) |
| Memory Error Correction | On-Die ECC and Full System ECC |
The baseline configuration utilizes 8 DIMMs per CPU, ensuring optimal memory bandwidth utilization according to the Intel Memory Controller Architecture.
1.4 Storage Architecture
The storage subsystem is designed for high-speed, low-latency I/O, utilizing both NVMe and SAS interfaces, managed by a dedicated Hardware RAID controller.
1.4.1 Boot and System Drives
The system employs redundant M.2 NVMe drives for the operating system and boot volumes, managed via the onboard storage controller.
1.4.2 Data Storage Array
The primary storage bays support 24 hot-swappable 2.5-inch drives.
| Drive Type | Quantity | Interface | Role |
|---|---|---|---|
| NVMe SSD (Enterprise Grade, 3.84TB) | 8 | PCIe 5.0 x4 (Direct Attached) | High-Performance Tier (Tier 0) |
| SAS SSD (Enterprise Grade, 15.36TB) | 16 | SAS-4 (via HBA/RAID) | High-Capacity Tier (Tier 1) |
| Total Raw Capacity | 307.2 TB | ||
| RAID Controller | Broadcom MegaRAID 9700 Series (24-Port, PCIe 5.0 Host Interface) | ||
| Cache | 16GB FB-DIMM Cache with NVMe Backup |
The RAID controller is flashed with proprietary firmware validated for specific I/O latency profiles required by the HCL documentation. Firmware updates must be managed through the BMC interface only.
1.5 Networking Interfaces
Network connectivity is critical for cluster operations and high-throughput data movement. The X7900-Pro integrates dual-port 200GbE adapters, leveraging the CPU's integrated PCIe lanes directly.
| Port | Speed | Interface Standard | Controller Model |
|---|---|---|---|
| Network Port 1 (Primary) | 200 Gbps | Ethernet (RoCE v2 capable) | Mellanox ConnectX-8 (Custom SKU) |
| Network Port 2 (Secondary) | 200 Gbps | Ethernet (RoCE v2 capable) | Mellanox ConnectX-8 (Custom SKU) |
| Management Port (Dedicated) | 1 Gbps | Ethernet | Integrated BMC LAN |
The integration of 200GbE is a key differentiator, requiring specific switch fabric validation, detailed in the Network Interconnect Matrix.
2. Performance Characteristics
The performance profile of the X7900-Pro is characterized by exceptional I/O throughput and highly consistent core utilization, stemming from the tightly coupled, validated hardware stack.
2.1 Synthetic Benchmarks
Performance metrics are derived from standardized testing against the X7900-Pro baseline image (OS: RHEL 9.4, Drivers: Certified v5.12.x).
2.1.1 Compute Benchmarks (SPECrate 2017 Integer)
This metric measures sustained multi-threaded performance, crucial for batch processing and general server utilization.
| Configuration | Result (Score) | Deviation from Reference |
|---|---|---|
| X7900-Pro (Dual 56C/112T) | 1,150 | +1.2% |
| Previous Gen (Dual 48C/96T) | 895 | N/A |
| Theoretical Max (Non-HCL) | ~1,120 (Estimated) | -2.7% |
The HCL validation process often involves tuning BIOS power states (P-States) to prioritize performance stability over peak energy saving, resulting in a consistent, slightly higher baseline score than potentially achievable with generic builds.
2.1.2 Memory Bandwidth and Latency
Measured using specialized memory access tools (e.g., STREAM benchmark).
| Metric | Result | Unit |
|---|---|---|
| Aggregate Read Bandwidth | 780 | GB/s |
| Aggregate Write Bandwidth | 510 | GB/s |
| Average Random Latency (32-byte access) | 58.5 | ns |
The 58.5ns latency is a critical benchmark achievement, directly attributable to the use of the validated 5600 MT/s DIMMs populated in the optimal 8-channel configuration per CPU. Deviations in DIMM population can increase latency by up to 15%. Detailed latency analysis is available upon request.
2.2 Storage I/O Throughput
The storage configuration is engineered for high Input/Output Operations Per Second (IOPS) for transactional workloads, alongside high sequential throughput for large data transfers (e.g., backups, media streaming).
2.2.1 IOPS Performance (4K Random Read/Write)
Measured using FIO against the RAID 10 array combining all 24 drives.
| Operation | Result (IOPS) | Latency (P99) |
|---|---|---|
| Random Read | 1,850,000 | 75 microseconds (µs) |
| Random Write | 1,550,000 | 92 microseconds (µs) |
The P99 latency under heavy write load (92µs) demonstrates the effectiveness of the 16GB NVMe-backed cache on the RAID controller, mitigating write amplification effects typical in high-density SAS SSD arrays.
2.2.2 Sequential Throughput
Measured using a 128K block size across the entire storage array.
| Operation | Result (GB/s) |
|---|---|
| Sequential Read | 45.2 |
| Sequential Write | 38.9 |
This throughput is bottlenecked primarily by the SAS-4 expander throughput capacity rather than the drives themselves, indicating headroom for future upgrades to NVMe-only backplanes.
2.3 Network Performance
Testing confirms predictable saturation of the 200GbE links under sustained load, confirming the non-blocking nature of the PCIe Gen 5 fabric connecting the network adapters to the CPU complex.
- **Throughput:** Sustained bidirectional transfer of 195 Gbps confirmed across both ports simultaneously (Total aggregate throughput: 390 Gbps).
- **Jitter:** P99 network jitter measured below 1.5 microseconds during sustained data streaming, essential for low-latency clustered file systems (e.g., Lustre, GPFS).
3. Recommended Use Cases
The X7900-Pro configuration excels in environments demanding extreme reliability, high core density, and predictable, low-latency access to massive datasets. Its HCL certification minimizes integration risk, making it ideal for mission-critical infrastructure.
3.1 High-Density Virtualization Hosts (VMware ESXi / KVM)
With 112 physical cores and 1TB of high-speed memory, this platform is perfectly suited to host large numbers of virtual machines (VMs) or containers.
- **Workload Suitability:** Hosting VDI brokers, core application servers, and medium-to-large database instances where consolidation density is paramount.
- **Key Advantage:** The validated memory topology guarantees that memory overcommitment ratios (e.g., 4:1 or 6:1) remain stable without encountering significant ballooning or swapping due to inconsistent memory access times. Detailed virtualization density planning is provided separately.
3.2 Enterprise Database Management Systems (OLTP/OLAP)
The combination of high core count, fast memory, and extremely high-IOPS storage makes this an excellent platform for demanding database workloads.
- **OLTP (Transactional):** The 1.85 Million 4K Read IOPS are utilized effectively by in-memory databases or heavily indexed transactional systems (e.g., SQL Server, Oracle).
- **OLAP (Analytical):** The high sequential throughput (45 GB/s) allows for rapid loading of large datasets into memory for complex analytical queries. The 200GbE networking facilitates fast data ingestion from storage arrays.
3.3 High-Performance Computing (HPC) Compute Nodes
While not exclusively an HPC node (lacking integrated specialized accelerators like high-end GPUs), the X7900-Pro serves exceptionally well as a CPU-bound compute node for tightly coupled parallel applications.
- **MPI Performance:** Low inter-node communication latency, supported by the 200GbE fabric, ensures efficient execution of Message Passing Interface (MPI) jobs.
- **Compilers:** The platform fully supports the latest instruction sets (AVX-512_FP16, AMX) required by modern scientific simulation codes. Compiler optimization guidelines are available for Fortran and C++.
3.4 High-Availability Storage Controllers
When configured with specialized HBAs (replacing the RAID controller with a pass-through HBA), this chassis serves as a robust basis for software-defined storage (SDS) solutions (e.g., Ceph, ZFS).
- **Advantage:** The 24 hot-swap bays and powerful dual CPUs provide the necessary processing overhead to manage complex erasure coding and data scrubbing operations without impacting host performance.
4. Comparison with Similar Configurations
To illustrate the value proposition of the X7900-Pro, we compare it against two other common enterprise configurations: an older generation high-core density system (X6800-Legacy) and a GPU-accelerated system (X7900-Accel).
4.1 Comparison Table: Configuration Profiles
| Feature | X7900-Pro (HCL Optimized) | X6800-Legacy (Older Gen, High Density) | X7900-Accel (GPU Focused) |
|---|---|---|---|
| CPU Generation | Latest (56C/Socket) | Previous Gen (48C/Socket) | Latest (56C/Socket) |
| Max RAM Speed | 5600 MT/s | 3200 MT/s | 5600 MT/s |
| Storage Interface | PCIe 5.0 NVMe (Direct) | PCIe 4.0 NVMe (via Controller) | PCIe 5.0 NVMe (Direct) |
| Primary Networking | 2x 200GbE | 4x 100GbE | 2x 100GbE (Shared lanes with GPUs) |
| Power Efficiency (TDP/Core) | Excellent | Moderate | Lower (Due to GPU draw) |
| HCL Cert Status | Fully Certified | End-of-Support Validation | Partial (OS/Driver dependent) |
4.2 Performance Delta Analysis
The primary performance advantage of the X7900-Pro over the X6800-Legacy is threefold: Memory bandwidth improvement (nearly 150% higher aggregate), I/O throughput improvement (PCIe 5.0 vs 4.0), and higher sustained clock speeds.
The comparison against the X7900-Accel highlights the trade-off between CPU core density and specialized acceleration.
| Metric | X7900-Pro (CPU Optimized) | X7900-Accel (2x A100 80GB) |
|---|---|---|
| SPECrate 2017 Integer | 1,150 | 1,080 (CPU overhead from GPU management) |
| 4K Random Read IOPS (Storage) | 1,850,000 | 1,500,000 (Slightly reduced due to lane contention) |
| FP64 HPC Performance (Theoretical) | 2.5 TFLOPS | 19.5 TFLOPS (GPU Dominated) |
Conclusion: For general-purpose compute, virtualization, and database workloads where the workload is inherently CPU/Memory/Storage bound, the X7900-Pro offers superior TCO and validated stability. The X7900-Accel is reserved strictly for AI training or heavy fluid dynamics simulation where GPU acceleration is mandatory. Selecting the appropriate platform requires careful workload analysis.
5. Maintenance Considerations
Maintaining the X7900-Pro within its HCL parameters requires adherence to strict operational guidelines concerning power delivery, thermal management, and firmware integrity.
5.1 Power Requirements and Redundancy
The system is designed for high power density. The dual 2200W Titanium PSUs provide substantial overhead, but careful rack power planning is essential.
- **Maximum Continuous Power Draw (Full Load):** 3,800 Watts (Typical configuration).
- **Peak Power Draw (Boot/Spike):** Up to 4,400 Watts (Momentary).
- **Required Input:** Dual independent 30A 208V circuits recommended for maximum resilience, although 20A 208V circuits are acceptable if total rack utilization is monitored.
The integrated Power Monitoring System (PMS) reports real-time draw via the BMC, allowing proactive load balancing across the rack infrastructure. Understanding power density is crucial when deploying more than six X7900-Pro units per standard rack.
5.2 Thermal Management and Cooling
The 350W TDP CPUs and high-speed NVMe components generate significant localized heat. The HCL mandates specific ambient operating parameters.
| Parameter | Required Value | Tolerance |
|---|---|---|
| Ambient Inlet Temperature (Recommended) | 20°C (68°F) | +/- 2°C |
| Maximum Inlet Temperature (HCL Limit) | 25°C (77°F) | N/A |
| Airflow Requirement | Minimum 180 CFM per unit | Verified via rack airflow analysis |
| Fan Speed Control | Dynamic (BMC Controlled) | Must remain in "Performance Profile B" under 85% CPU load. |
Failure to maintain the required inlet temperature will trigger mandatory thermal throttling, potentially reducing performance by 20-30% to protect the CPUs. The system uses 8x high-speed (15,000 RPM) internal fans managed by the BMC for zonal cooling.
5.3 Firmware and Lifecycle Management
The stability of the X7900-Pro relies heavily on maintaining the exact firmware versions certified in the HCL.
- **BMC Firmware:** Must remain at version 4.12.P or later certified patch levels. Downgrades are strictly prohibited outside of documented emergency recovery procedures.
- **Storage Controller Firmware:** Must match the version specified in the Storage Firmware Matrix corresponding to the installed drive models. Mismatches can lead to degraded RAID rebuild performance or premature drive failure reporting.
- **OS Driver Validation:** All drivers (network, storage, management) must be sourced exclusively from the validated Enterprise Driver Repository. Generic vendor drivers are not supported under the HCL agreement.
Lifecycle management should be performed using the integrated [[Intelligent Platform Management Interface (IPMI)|IPMI] commands or the Redfish interface to ensure all components are updated simultaneously and correctly synchronized. Manual updates bypassing the central management tool are discouraged due to the complexity of the firmware dependencies.
5.4 Component Replacement Procedures
Due to the tightly integrated nature of the PCIe 5.0 components, specific handling protocols are required during component replacement.
1. **CPU/RAM Replacement:** Requires complete system power down (both PSUs unplugged) and grounding. Thermal paste must be the manufacturer-specified compound (e.g., Thermal Grizzly Kryonaut Extreme). 2. **RAID Controller Replacement:** Requires an exact model match and the transfer of the non-volatile cache module (if applicable). The new controller must be flashed with the configuration backup *before* being inserted into the system to prevent initial configuration mismatches. 3. **Hot-Swappable Components:** Drives, Fans, and PSUs can be replaced hot-swapped, provided the replacement part matches the SKU exactly to ensure proper Power Budgeting calculations by the BMC.
Adherence to these maintenance protocols is mandatory for retaining the platform's stringent support level. Troubleshooting guides detail error codes associated with configuration drift.
Intel-Based Server Configurations
| Configuration | Specifications | Benchmark |
|---|---|---|
| Core i7-6700K/7700 Server | 64 GB DDR4, NVMe SSD 2 x 512 GB | CPU Benchmark: 8046 |
| Core i7-8700 Server | 64 GB DDR4, NVMe SSD 2x1 TB | CPU Benchmark: 13124 |
| Core i9-9900K Server | 128 GB DDR4, NVMe SSD 2 x 1 TB | CPU Benchmark: 49969 |
| Core i9-13900 Server (64GB) | 64 GB RAM, 2x2 TB NVMe SSD | |
| Core i9-13900 Server (128GB) | 128 GB RAM, 2x2 TB NVMe SSD | |
| Core i5-13500 Server (64GB) | 64 GB RAM, 2x500 GB NVMe SSD | |
| Core i5-13500 Server (128GB) | 128 GB RAM, 2x500 GB NVMe SSD | |
| Core i5-13500 Workstation | 64 GB DDR5 RAM, 2 NVMe SSD, NVIDIA RTX 4000 |
AMD-Based Server Configurations
| Configuration | Specifications | Benchmark |
|---|---|---|
| Ryzen 5 3600 Server | 64 GB RAM, 2x480 GB NVMe | CPU Benchmark: 17849 |
| Ryzen 7 7700 Server | 64 GB DDR5 RAM, 2x1 TB NVMe | CPU Benchmark: 35224 |
| Ryzen 9 5950X Server | 128 GB RAM, 2x4 TB NVMe | CPU Benchmark: 46045 |
| Ryzen 9 7950X Server | 128 GB DDR5 ECC, 2x2 TB NVMe | CPU Benchmark: 63561 |
| EPYC 7502P Server (128GB/1TB) | 128 GB RAM, 1 TB NVMe | CPU Benchmark: 48021 |
| EPYC 7502P Server (128GB/2TB) | 128 GB RAM, 2 TB NVMe | CPU Benchmark: 48021 |
| EPYC 7502P Server (128GB/4TB) | 128 GB RAM, 2x2 TB NVMe | CPU Benchmark: 48021 |
| EPYC 7502P Server (256GB/1TB) | 256 GB RAM, 1 TB NVMe | CPU Benchmark: 48021 |
| EPYC 7502P Server (256GB/4TB) | 256 GB RAM, 2x2 TB NVMe | CPU Benchmark: 48021 |
| EPYC 9454P Server | 256 GB RAM, 2x2 TB NVMe |
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⚠️ *Note: All benchmark scores are approximate and may vary based on configuration. Server availability subject to stock.* ⚠️