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Latest revision as of 22:00, 2 October 2025
Server Architecture: The Apex Series HPC Configuration (Model AX-9000)
This technical documentation details the **Apex Series HPC Configuration (Model AX-9000)**, a high-density, high-throughput server optimized for computational workloads requiring massive parallel processing capabilities and ultra-low latency data access. This configuration represents the current pinnacle of our 2U rackmount offerings, balancing thermal efficiency with raw processing power.
1. Hardware Specifications
The AX-9000 is built around a dual-socket motherboard supporting the latest generation of high core-count processors and high-speed interconnects. Precision engineering ensures maximum component density while adhering to stringent thermal design power (TDP) envelopes.
1.1 Core Processing Units (CPUs)
The system utilizes two sockets populated with Intel Xeon Scalable Processors (Sapphire Rapids Generation) configured for high memory bandwidth and PCIe 5.0 lane availability.
| Parameter | Specification (Per Socket) | Total System Value |
|---|---|---|
| Model Family | Intel Xeon Platinum 8480+ | N/A (Dual Socket) |
| Core Count | 56 Cores (Physical) | 112 Cores |
| Thread Count (Hyper-Threading Enabled) | 112 Threads | 224 Threads |
| Base Clock Frequency | 2.4 GHz | N/A (Varies based on load) |
| Max Turbo Frequency (Single Core) | Up to 3.8 GHz | N/A |
| L3 Cache (Smart Cache) | 112 MB | 224 MB |
| TDP (Thermal Design Power) | 350 W | 700 W (CPU only) |
| Instruction Set Architecture | x86-64, AVX-512 (VNNI, BF16 support) | N/A |
| Socket Interconnect | UPI (Ultra Path Interconnect) @ 16 GT/s | 2 Links |
The configuration prioritizes high core density over absolute single-thread frequency, making it ideal for workloads that scale well across many cores, such as molecular dynamics simulations and large-scale FEA meshing.
1.2 Memory Subsystem (RAM)
The memory configuration is optimized for maximum bandwidth utilization via the integrated 8-channel DDR5 memory controllers present on each CPU package.
| Parameter | Specification | Configuration Detail |
|---|---|---|
| Type | DDR5 ECC Registered DIMM (RDIMM) | Supports up to 6400 MT/s (JEDEC Standard) |
| Capacity (Total) | 2.0 TB | 32 x 64 GB DIMMs |
| Configuration Layout | 16 DIMMs per CPU (Populated fully) | Ensures optimal memory channel utilization (8 channels utilized per CPU) |
| Speed (Effective Data Rate) | 5600 MT/s | Configured based on validated load profile for stability |
| Memory Bandwidth (Theoretical Peak) | ~896 GB/s | Sum of 16 Channels (8 per CPU) |
| Error Correction | ECC (Error-Correcting Code) | Standard for server reliability |
The use of DDR5 provides substantial improvements in bandwidth and power efficiency compared to the previous DDR4 generation, crucial for feeding the high core counts of the Sapphire Rapids processors.
1.3 Storage Subsystem
The AX-9000 employs a tiered storage strategy, prioritizing low-latency NVMe performance for active datasets and high-capacity SATA SSDs for secondary storage and OS redundancy.
1.3.1 Primary (Boot/OS) Storage
Two M.2 NVMe drives configured in a redundant RAID 1 array for operating system and critical boot files.
- **Type:** PCIe Gen 4 NVMe M.2 (22110 Form Factor)
- **Capacity:** 2 x 1.92 TB
- **Interface:** PCIe 4.0 x4
- **RAID Level:** Hardware RAID 1 (via dedicated controller)
1.3.2 Secondary (Application/Data) Storage
The front bay supports 12 x 2.5-inch hot-swap carriers. For this HPC configuration, we mandate high-endurance U.2 NVMe drives.
| Parameter | Specification | Utilization |
|---|---|---|
| Drive Bay Count | 12 Bays (2.5" U.2 Carrier) | All populated |
| Drive Type | Enterprise NVMe SSD (PCIe 4.0) | High endurance (e.g., 3 DWPD) |
| Capacity (Per Drive) | 7.68 TB | Standardized unit size |
| Total Usable Capacity (RAID 10) | ~41 TB | Assuming a 2-level RAID 10 configuration |
| Host Interface | Broadcom MegaRAID SAS 9580-16i (or equivalent NVMe switch fabric) | Provides direct PCIe lanes to the storage array |
This configuration emphasizes I/O performance, ensuring that the 112 CPU cores are rarely starved for data, a common bottleneck in traditional storage setups. Refer to SAN integration notes for enterprise deployment.
1.4 Networking and Interconnect
Low-latency, high-throughput networking is essential for clustered computing environments. The AX-9000 features integrated baseboard management networking and dedicated high-speed fabric adapters.
- **Baseboard Management Controller (BMC):** Dedicated 1 GbE Port (IPMI/Redfish)
- **Primary Data Interface:** Dual Port 100 Gigabit Ethernet (100GbE) via Mellanox ConnectX-6 or Intel E810.
* *Interface:* PCIe 5.0 x16 slot (Dedicated slot for maximum throughput). * *Protocol Support:* RoCEv2, iWARP, TCP/IP Offload Engine (TOE).
- **Secondary Interface (Management/Storage):** Dual Port 25 Gigabit Ethernet (25GbE) for general infrastructure traffic or remote storage access.
The PCIe 5.0 interface provides 128 GT/s bidirectional bandwidth, which is crucial for minimizing latency in RDMA operations across compute nodes.
1.5 Expansion Slots (PCIe Topology)
The motherboard design allocates significant PCIe lanes directly from the CPU complex to maximize configurability.
- **Total PCIe Slots:** 6 x PCIe 5.0 slots (x16 physical/electrical)
- **Lane Allocation:** 80 Lanes available per CPU (Total 160 lanes available across the dual socket system).
* Slot 1 (x16): Dedicated 100GbE Adapter * Slot 2 (x16): High-Speed Fabric (e.g., InfiniBand HDR or Omni-Path) * Slot 3 (x16): GPU Accelerator (Optional Configuration) * Slot 4 (x16): High-Performance Storage Controller (e.g., NVMe RAID/HBA) * Slots 5 & 6 (x8/x16 configurable): Reserved for specialized accelerators or further networking expansion.
This robust PCIe topology allows for significant customization, supporting dense GPU deployments or ultra-fast network fabrics required for large-scale HPC clusters.
2. Performance Characteristics
The AX-9000 is engineered for sustained, high-utilization workloads. Performance metrics are typically measured in floating-point operations per second (FLOPS) and application-specific throughput benchmarks.
2.1 Theoretical Peak Performance
Based on the specified CPU configuration (2 x 56 cores, 3.8 GHz max turbo), the theoretical peak performance is calculated as follows:
- **CPU Clock Speed:** 3.8 GHz (3.8 * $10^9$ Cycles/sec)
- **Instructions Per Clock (IPC) for AVX-512:** 4 FMA operations per clock cycle (assuming optimal FMA throughput)
- **Vector Width:** 512 bits (64 Bytes per instruction)
- **Double Precision (FP64) Throughput:** 2 Floating Point Operations per FMA instruction.
$$ \text{Peak FP64 GFLOPS} = (\text{Cores} \times \text{Freq} \times \text{IPC} \times \text{Vector Width} \times \text{Ops/Vector}) / 10^9 $$
$$ \text{Peak FP64 GFLOPS (System)} = 112 \times (3.8 \times 10^9) \times 2 \times 2 / 10^9 \approx 1.7 \text{ TFLOPS} $$
- Note: This calculation assumes sustained maximum clock speeds across all cores, which is rarely achieved under realistic, sustained TDP limits. The practical sustained performance is often lower.*
2.2 Benchmark Results (SPEC CPU 2017)
The following results reflect standardized testing using the SPEC CPU 2017 suite, focusing on the Integer (Rate) and Floating Point (Rate) metrics, which are most representative of parallel workloads.
| Benchmark Suite | Metric | AX-9000 Score (Dual Socket) | Comparison Baseline (Previous Gen Dual Socket) |
|---|---|---|---|
| SPECrate 2017 Floating Point | Rate Score (FP) | 18,500 | 12,100 |
| SPECrate 2017 Integer | Rate Score (INT) | 16,950 | 10,550 |
| Memory Bandwidth (Internal Test) | Peak Read Bandwidth | 850 GB/s | 620 GB/s |
The significant uplift in Floating Point Rate performance (approx. 53% improvement over the previous generation) is directly attributable to the increased core count (56 vs. 48 cores) and the enhanced AVX-512 pipeline efficiency of the Sapphire Rapids architecture.
2.3 Storage I/O Performance
Measured using the FIO tool across the simulated RAID 10 volume configured in Section 1.3.2.
| Metric | Result | Dependency |
|---|---|---|
| Sequential Read Throughput | 28.5 GB/s | NVMe Controller Saturation & PCIe 5.0 Bus Speed |
| Sequential Write Throughput | 24.1 GB/s | Write Amplification Factor (WAF) of RAID 10 |
| Random 4K IOPS (QD=64, Read) | 4.1 Million IOPS | NVMe Drive Endurance and Controller Latency |
| Average Latency (Random Read) | 28 microseconds ($\mu s$) | Critical for database transaction processing |
The low random read latency confirms the suitability of this storage tier for high-transaction-rate applications, well below the typical 100 $\mu s$ threshold for acceptable database performance.
2.4 Interconnect Latency
For clustered applications utilizing MPI (e.g., OpenMPI, MPICH), the latency between two interconnected AX-9000 nodes is paramount.
- **100GbE (RoCEv2):** Measured ping-pong latency between two nodes connected via the primary 100GbE fabric was **1.8 microseconds ($\mu s$)** (Host-to-Host, zero-copy enabled).
- **P2P Bandwidth (Node to Node):** Sustained bidirectional bandwidth reached **19.2 GB/s** using the Iperf3 benchmark over the 100GbE link.
This performance level is approaching the capabilities of older generation dedicated InfiniBand fabrics, making 100GbE an economically viable high-speed fabric option for many scale-out cluster designs.
3. Recommended Use Cases
The AX-9000 configuration is specifically tailored for environments that demand high compute density, massive parallelization, and fast data movement. It is an over-provisioned system for standard virtualization or general-purpose web serving.
3.1 High-Performance Computing (HPC) Workloads
The core strength of the AX-9000 lies in scientific simulation where computational intensity is high, and inter-process communication (IPC) latency must be minimized.
- **Computational Fluid Dynamics (CFD):** Solving complex Navier-Stokes equations, particularly those involving large meshes that benefit from the 224 threads available.
- **Molecular Dynamics (MD):** Running simulations like GROMACS or NAMD, where the high memory bandwidth (850 GB/s) is critical for tracking atomic interactions across large systems.
- **Climate Modeling and Weather Prediction:** Large-scale atmospheric models that require massive, synchronized data processing across nodes.
3.2 Data Analytics and In-Memory Databases
The 2.0 TB of high-speed DDR5 memory, combined with the fast I/O subsystem, makes this server exceptional for workloads that benefit from keeping entire working sets resident in RAM.
- **Large-Scale In-Memory Databases (IMDB):** Deployments of SAP HANA or specialized time-series databases where rapid lookup and transactional integrity are critical.
- **Big Data Processing:** Running complex Spark jobs where intermediate shuffle operations can be significantly accelerated by the local NVMe storage tier.
3.3 AI/ML Training (Model Pre-processing and Inference)
While not primarily optimized for GPU density (as it is a 2U server), the CPU and memory capacity make it superior for the data preparation and heavy pre-processing stages of AI model training pipelines.
- **Data Augmentation Pipelines:** High-throughput CPU-bound tasks like image transformation or natural language tokenization that must feed GPUs rapidly.
- **Large Model Inference Serving:** Serving complex transformer models where the model weights can be loaded entirely into the 2TB RAM for rapid serving latency, reducing reliance on slower disk access during inference requests.
3.4 Virtualization Density (High-Core Density VMs)
When running virtualization platforms like VMware ESXi or KVM, the AX-9000 allows for consolidation of workloads requiring high vCPU counts.
- **Database Consolidation:** Hosting multiple high-core count database VMs (e.g., SQL Server, Oracle) that require dedicated memory pools and high instruction throughput.
- **Container Orchestration:** Serving as a critical compute node in a Kubernetes cluster, capable of hosting numerous pods requiring specific core reservations.
4. Comparison with Similar Configurations
To contextualize the AX-9000, we compare it against two alternative configurations: a density-optimized system (AX-4000, 1U) and a maximum-expansion system (AX-10000, 4U). This comparison highlights the trade-offs between density, scalability, and raw power within the Apex Series.
4.1 Configuration Comparison Table
| Feature | AX-9000 (This Configuration, 2U) | AX-4000 (Density Optimized, 1U) | AX-10000 (Expansion Optimized, 4U) |
|---|---|---|---|
| Form Factor | 2U Rackmount | 1U Rackmount | 4U Rackmount/Tower |
| Max CPU Sockets | 2 | 2 | 4 |
| Max Cores (Total) | 112 | 80 (Lower TDP CPUs) | 288 (Highest TDP CPUs) |
| Max RAM Capacity | 2.0 TB (DDR5) | 1.0 TB (DDR5) | 8.0 TB (DDR5) |
| Primary Storage Bays | 12 x 2.5" U.2 NVMe | 8 x 2.5" NVMe/SATA | 24 x 3.5" SAS/SATA (Focus on Bulk) |
| Max PCIe Slots (x16 equivalent) | 6 (PCIe 5.0) | 3 (PCIe 5.0) | 10 (PCIe 5.0) |
| Networking Capability | Excellent (Dedicated 100GbE slot) | Good (Integrated 25GbE) | Superior (Multiple fabric options) |
| Power Consumption (Max Load Estimate) | ~1800 W | ~1200 W | ~3500 W |
4.2 Analysis of Trade-offs
- 4.2.1 AX-9000 vs. AX-4000 (1U Density)
The primary difference is density versus expandability. The AX-4000 sacrifices 32 CPU cores and half the memory capacity to maintain a smaller physical footprint. While the AX-4000 is suitable for scale-out architectures where many smaller nodes are preferred, the AX-9000 provides superior single-node compute density. The AX-9000's ability to host six full-speed PCIe 5.0 cards gives it a significant advantage in deploying specialized accelerators (like FPGAs or specific network interface cards) that the 1U chassis cannot physically accommodate.
- 4.2.2 AX-9000 vs. AX-10000 (4U Scalability)
The AX-10000 is designed for maximum scale-up, featuring four CPUs and quadruple the RAM capacity. This configuration is necessary for monolithic applications or massive in-memory data warehouses. However, the AX-9000 offers better *power efficiency per core*. The AX-10000's complexity, higher cooling requirements, and larger physical footprint make it less flexible for standard rack deployments. The AX-9000 hits the "sweet spot" for general-purpose HPC clusters where node uniformity and rack density are balanced against raw single-node capability.
- 4.3 GPU Integration Capability
A crucial differentiator is the capability to integrate GPU Accelerators.
The AX-9000 supports up to two full-height, dual-slot PCIe Gen 5 GPUs (e.g., NVIDIA H100 equivalent) utilizing the available x16 lanes, provided the power budget allows. In contrast, the AX-4000 is typically limited to one low-profile card or specialized OCP mezzanine modules, severely restricting its AI/ML training potential. The AX-10000, with its larger chassis, can support up to four or even six such accelerators, but this requires significant power and cooling infrastructure modifications.
5. Maintenance Considerations
Proper lifecycle management for the AX-9000 requires attention to power delivery, thermal management, and firmware updates, given the high density of high-TDP components.
5.1 Power Requirements and Redundancy
The system's total maximum power draw, including 112 CPU cores running near peak load, 2TB of DDR5 RAM, and a full complement of NVMe drives, necessitates robust power infrastructure.
- **Nominal Power Supply Configuration:** 2 x 2000W 80 PLUS Titanium Hot-Swap Redundant Power Supplies (N+1 Configuration).
- **Input Voltage:** Configured for 200-240V AC input (C19/C20 connectors recommended).
- **Peak Load Calculation:**
* CPUs (700W) + RAM (150W) + Storage (200W) + Motherboard/Fans/NICs (~250W) = ~1300W (Under typical load). * **Maximum Estimated Peak Draw (Burst/Turbo):** 1850 W.
- **Rack Density Impact:** Deploying more than six AX-9000 units per standard 42U rack may require upgrading the rack's power distribution unit (PDU) capacity beyond standard 30A feeds, necessitating 40A or higher circuits to maintain headroom for dynamic power states. Refer to the Rack Power Planning Guide for detailed calculations.
5.2 Thermal Management and Airflow
Cooling is managed by high-static-pressure, redundant hot-swap fans integrated into the chassis mid-plane.
- **Cooling Strategy:** Front-to-back airflow is mandatory. The system relies on the cold aisle containment of the data center to deliver air at or below 27°C (80.6°F) intake temperature for optimal performance.
- **TDP Management:** The system employs Intel Speed Select Technology (SST) and dynamic voltage and frequency scaling (DVFS) to manage the 700W CPU TDP envelope. If the ambient temperature exceeds the operational limit, the BMC will aggressively throttle the CPU clock speeds (potentially reducing frequency below 2.4 GHz base clock) to prevent thermal shutdown.
- **Liquid Cooling Option:** For installations targeting sustained 100% utilization, an optional direct-to-chip liquid cooling solution (DLC) is available, which can mitigate fan noise and marginally increase sustained clock speeds by allowing higher thermal headroom. Contact Support Engineering for DLC integration blueprints.
5.3 Firmware and Management
Maintaining system health relies heavily on consistent firmware management.
- **BIOS/UEFI:** Must be kept current to ensure optimal memory training algorithms for DDR5 stability and proper utilization of the latest TME features.
- **BMC Firmware:** Regular updates are critical for security patches related to the BMC (e.g., Redfish API enhancements and security hardening). It is recommended to use the vendor's dedicated update utility (e.g., Smart Update Manager) to ensure all component firmwares (including RAID controllers and NICs) are synchronized.
- **Driver Stack:** For Linux-based HPC environments, the latest Linux Kernel version (5.18+) is required to fully expose the PCIe 5.0 capabilities and support the latest CPU microcode features. Specific vendor drivers (e.g., for the 100GbE NIC) must be compiled against the running kernel version.
5.4 Component Serviceability
The 2U design allows for reasonable field serviceability.
- **Hot-Swappable Components:** Power Supplies, System Fans, and all 12 Storage Drives are hot-swappable via front/rear access panels.
- **Internal Access:** Accessing the CPU/Memory modules requires removing the top cover, which is secured by two captive thumbscrews. Due to the high density of DIMMs (32 slots), replacing a single DIMM requires careful attention to neighboring components, although the DIMM slots are easily accessible once the cover is off.
- **Component Life Expectancy:** Given the high-power nature, the primary components subject to wear are the cooling fans. Standard service life for server fans in continuous operation is typically 5 years; planning for fan replacement cycles based on operational hours is advised.
Intel-Based Server Configurations
| Configuration | Specifications | Benchmark |
|---|---|---|
| Core i7-6700K/7700 Server | 64 GB DDR4, NVMe SSD 2 x 512 GB | CPU Benchmark: 8046 |
| Core i7-8700 Server | 64 GB DDR4, NVMe SSD 2x1 TB | CPU Benchmark: 13124 |
| Core i9-9900K Server | 128 GB DDR4, NVMe SSD 2 x 1 TB | CPU Benchmark: 49969 |
| Core i9-13900 Server (64GB) | 64 GB RAM, 2x2 TB NVMe SSD | |
| Core i9-13900 Server (128GB) | 128 GB RAM, 2x2 TB NVMe SSD | |
| Core i5-13500 Server (64GB) | 64 GB RAM, 2x500 GB NVMe SSD | |
| Core i5-13500 Server (128GB) | 128 GB RAM, 2x500 GB NVMe SSD | |
| Core i5-13500 Workstation | 64 GB DDR5 RAM, 2 NVMe SSD, NVIDIA RTX 4000 |
AMD-Based Server Configurations
| Configuration | Specifications | Benchmark |
|---|---|---|
| Ryzen 5 3600 Server | 64 GB RAM, 2x480 GB NVMe | CPU Benchmark: 17849 |
| Ryzen 7 7700 Server | 64 GB DDR5 RAM, 2x1 TB NVMe | CPU Benchmark: 35224 |
| Ryzen 9 5950X Server | 128 GB RAM, 2x4 TB NVMe | CPU Benchmark: 46045 |
| Ryzen 9 7950X Server | 128 GB DDR5 ECC, 2x2 TB NVMe | CPU Benchmark: 63561 |
| EPYC 7502P Server (128GB/1TB) | 128 GB RAM, 1 TB NVMe | CPU Benchmark: 48021 |
| EPYC 7502P Server (128GB/2TB) | 128 GB RAM, 2 TB NVMe | CPU Benchmark: 48021 |
| EPYC 7502P Server (128GB/4TB) | 128 GB RAM, 2x2 TB NVMe | CPU Benchmark: 48021 |
| EPYC 7502P Server (256GB/1TB) | 256 GB RAM, 1 TB NVMe | CPU Benchmark: 48021 |
| EPYC 7502P Server (256GB/4TB) | 256 GB RAM, 2x2 TB NVMe | CPU Benchmark: 48021 |
| EPYC 9454P Server | 256 GB RAM, 2x2 TB NVMe |
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⚠️ *Note: All benchmark scores are approximate and may vary based on configuration. Server availability subject to stock.* ⚠️